CN104051358B - 带有散热器的半导体器件组件 - Google Patents

带有散热器的半导体器件组件 Download PDF

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Publication number
CN104051358B
CN104051358B CN201410079547.5A CN201410079547A CN104051358B CN 104051358 B CN104051358 B CN 104051358B CN 201410079547 A CN201410079547 A CN 201410079547A CN 104051358 B CN104051358 B CN 104051358B
Authority
CN
China
Prior art keywords
semiconductor die
base portion
perimeter
opening
encapsulant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201410079547.5A
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English (en)
Chinese (zh)
Other versions
CN104051358A (zh
Inventor
B·J·卡彭特
L·M·希金斯三世
袁媛
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NXP USA Inc
Original Assignee
NXP USA Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NXP USA Inc filed Critical NXP USA Inc
Publication of CN104051358A publication Critical patent/CN104051358A/zh
Application granted granted Critical
Publication of CN104051358B publication Critical patent/CN104051358B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01515—Forming coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN201410079547.5A 2013-03-13 2014-03-06 带有散热器的半导体器件组件 Expired - Fee Related CN104051358B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/799,031 2013-03-13
US13/799,031 US8754521B1 (en) 2013-03-13 2013-03-13 Semiconductor device assembly having a heat spreader

Publications (2)

Publication Number Publication Date
CN104051358A CN104051358A (zh) 2014-09-17
CN104051358B true CN104051358B (zh) 2018-04-13

Family

ID=50896797

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410079547.5A Expired - Fee Related CN104051358B (zh) 2013-03-13 2014-03-06 带有散热器的半导体器件组件

Country Status (3)

Country Link
US (1) US8754521B1 (https=)
JP (1) JP6288831B2 (https=)
CN (1) CN104051358B (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9899290B2 (en) 2016-03-23 2018-02-20 Nxp Usa, Inc. Methods for manufacturing a packaged device with an extended structure for forming an opening in the encapsulant
JP6748501B2 (ja) * 2016-07-14 2020-09-02 ローム株式会社 電子部品およびその製造方法
US11373930B2 (en) 2020-03-31 2022-06-28 Cisco Technology, Inc. Thermal packaging with fan out wafer level processing

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5175612A (en) * 1989-12-19 1992-12-29 Lsi Logic Corporation Heat sink for semiconductor device assembly
US6534859B1 (en) * 2002-04-05 2003-03-18 St. Assembly Test Services Ltd. Semiconductor package having heat sink attached to pre-molded cavities and method for creating the package
US6998707B2 (en) * 1999-11-24 2006-02-14 Denso Corporation Semiconductor device having radiation structure

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05211250A (ja) * 1992-01-30 1993-08-20 Nec Corp 樹脂封止型半導体装置
JPH06232294A (ja) * 1993-02-03 1994-08-19 Hitachi Ltd 半導体集積回路装置
JPH06349973A (ja) * 1993-06-14 1994-12-22 Sony Corp 樹脂封止型半導体装置
US6507116B1 (en) 1997-04-24 2003-01-14 International Business Machines Corporation Electronic package and method of forming
US6146921A (en) 1998-09-16 2000-11-14 Intel Corporation Cavity mold cap BGA package with post mold thermally conductive epoxy attach heat sink
US5982621A (en) * 1998-11-23 1999-11-09 Caesar Technology Inc. Electronic device cooling arrangement
US6963141B2 (en) * 1999-12-31 2005-11-08 Jung-Yu Lee Semiconductor package for efficient heat spreading
JP2001358259A (ja) * 2000-06-15 2001-12-26 Seiko Epson Corp 半導体パッケージ
US20020079572A1 (en) 2000-12-22 2002-06-27 Khan Reza-Ur Rahman Enhanced die-up ball grid array and method for making the same
JP4720372B2 (ja) * 2005-08-24 2011-07-13 富士ゼロックス株式会社 電源装置
KR101698932B1 (ko) * 2010-08-17 2017-01-23 삼성전자 주식회사 반도체 패키지 및 그 제조방법

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5175612A (en) * 1989-12-19 1992-12-29 Lsi Logic Corporation Heat sink for semiconductor device assembly
US6998707B2 (en) * 1999-11-24 2006-02-14 Denso Corporation Semiconductor device having radiation structure
US6534859B1 (en) * 2002-04-05 2003-03-18 St. Assembly Test Services Ltd. Semiconductor package having heat sink attached to pre-molded cavities and method for creating the package

Also Published As

Publication number Publication date
JP2014179602A (ja) 2014-09-25
CN104051358A (zh) 2014-09-17
JP6288831B2 (ja) 2018-03-07
US8754521B1 (en) 2014-06-17

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Address after: Texas in the United States

Applicant after: NXP USA, Inc.

Address before: Texas in the United States

Applicant before: FREESCALE SEMICONDUCTOR, Inc.

GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20180413