JP2014179602A5 - - Google Patents
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- Publication number
- JP2014179602A5 JP2014179602A5 JP2014034907A JP2014034907A JP2014179602A5 JP 2014179602 A5 JP2014179602 A5 JP 2014179602A5 JP 2014034907 A JP2014034907 A JP 2014034907A JP 2014034907 A JP2014034907 A JP 2014034907A JP 2014179602 A5 JP2014179602 A5 JP 2014179602A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor die
- pedestal portion
- opening
- periphery
- sealant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 46
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims 25
- 239000000758 substrate Substances 0.000 claims 14
- 239000000565 sealant Substances 0.000 claims 13
- 239000003795 chemical substances by application Substances 0.000 claims 3
- 239000000463 material Substances 0.000 claims 3
- 238000000034 method Methods 0.000 claims 3
- 238000007789 sealing Methods 0.000 claims 3
- 230000002093 peripheral effect Effects 0.000 claims 2
- 238000000151 deposition Methods 0.000 claims 1
- 239000004094 surface-active agent Substances 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/799,031 | 2013-03-13 | ||
| US13/799,031 US8754521B1 (en) | 2013-03-13 | 2013-03-13 | Semiconductor device assembly having a heat spreader |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014179602A JP2014179602A (ja) | 2014-09-25 |
| JP2014179602A5 true JP2014179602A5 (https=) | 2017-03-30 |
| JP6288831B2 JP6288831B2 (ja) | 2018-03-07 |
Family
ID=50896797
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014034907A Expired - Fee Related JP6288831B2 (ja) | 2013-03-13 | 2014-02-26 | ヒートスプレッダを有する半導体デバイスアセンブリ |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US8754521B1 (https=) |
| JP (1) | JP6288831B2 (https=) |
| CN (1) | CN104051358B (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9899290B2 (en) | 2016-03-23 | 2018-02-20 | Nxp Usa, Inc. | Methods for manufacturing a packaged device with an extended structure for forming an opening in the encapsulant |
| JP6748501B2 (ja) * | 2016-07-14 | 2020-09-02 | ローム株式会社 | 電子部品およびその製造方法 |
| US11373930B2 (en) | 2020-03-31 | 2022-06-28 | Cisco Technology, Inc. | Thermal packaging with fan out wafer level processing |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5175612A (en) * | 1989-12-19 | 1992-12-29 | Lsi Logic Corporation | Heat sink for semiconductor device assembly |
| JPH05211250A (ja) * | 1992-01-30 | 1993-08-20 | Nec Corp | 樹脂封止型半導体装置 |
| JPH06232294A (ja) * | 1993-02-03 | 1994-08-19 | Hitachi Ltd | 半導体集積回路装置 |
| JPH06349973A (ja) * | 1993-06-14 | 1994-12-22 | Sony Corp | 樹脂封止型半導体装置 |
| US6507116B1 (en) | 1997-04-24 | 2003-01-14 | International Business Machines Corporation | Electronic package and method of forming |
| US6146921A (en) | 1998-09-16 | 2000-11-14 | Intel Corporation | Cavity mold cap BGA package with post mold thermally conductive epoxy attach heat sink |
| US5982621A (en) * | 1998-11-23 | 1999-11-09 | Caesar Technology Inc. | Electronic device cooling arrangement |
| US6703707B1 (en) * | 1999-11-24 | 2004-03-09 | Denso Corporation | Semiconductor device having radiation structure |
| US6963141B2 (en) * | 1999-12-31 | 2005-11-08 | Jung-Yu Lee | Semiconductor package for efficient heat spreading |
| JP2001358259A (ja) * | 2000-06-15 | 2001-12-26 | Seiko Epson Corp | 半導体パッケージ |
| US20020079572A1 (en) | 2000-12-22 | 2002-06-27 | Khan Reza-Ur Rahman | Enhanced die-up ball grid array and method for making the same |
| US6534859B1 (en) * | 2002-04-05 | 2003-03-18 | St. Assembly Test Services Ltd. | Semiconductor package having heat sink attached to pre-molded cavities and method for creating the package |
| JP4720372B2 (ja) * | 2005-08-24 | 2011-07-13 | 富士ゼロックス株式会社 | 電源装置 |
| KR101698932B1 (ko) * | 2010-08-17 | 2017-01-23 | 삼성전자 주식회사 | 반도체 패키지 및 그 제조방법 |
-
2013
- 2013-03-13 US US13/799,031 patent/US8754521B1/en not_active Expired - Fee Related
-
2014
- 2014-02-26 JP JP2014034907A patent/JP6288831B2/ja not_active Expired - Fee Related
- 2014-03-06 CN CN201410079547.5A patent/CN104051358B/zh not_active Expired - Fee Related
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