JP6282628B2 - プロセスチャンバ、プロセスチャンバとロードロックの複合体、及び基板加工システム - Google Patents
プロセスチャンバ、プロセスチャンバとロードロックの複合体、及び基板加工システム Download PDFInfo
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- JP6282628B2 JP6282628B2 JP2015236590A JP2015236590A JP6282628B2 JP 6282628 B2 JP6282628 B2 JP 6282628B2 JP 2015236590 A JP2015236590 A JP 2015236590A JP 2015236590 A JP2015236590 A JP 2015236590A JP 6282628 B2 JP6282628 B2 JP 6282628B2
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- Prior art keywords
- load lock
- process chamber
- substrate
- main frame
- chamber
- Prior art date
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- 238000000034 method Methods 0.000 title claims description 164
- 230000008569 process Effects 0.000 title claims description 123
- 239000000758 substrate Substances 0.000 title claims description 77
- 239000002131 composite material Substances 0.000 title description 5
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 230000007246 mechanism Effects 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 5
- 238000005192 partition Methods 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 230000032258 transport Effects 0.000 description 2
- 238000004380 ashing Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 238000004299 exfoliation Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3244—Gas supply means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
- H01J37/32889—Connection or combination with other apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Drying Of Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Robotics (AREA)
- Physical Vapour Deposition (AREA)
- Mechanical Engineering (AREA)
Description
Claims (7)
- 半導体製造システム内で基板加工に用いられる、メインフレームとロードロックとを備えるプロセスチャンバであって、
自身の内部を加工ゾーンとし、自身を前記ロードロックの側壁に装設される取付機構を有するチャンバ本体と、
前記加工ゾーンと前記メインフレームとの間で基板を移送する第1ポートと、
前記加工ゾーンと前記ロードロックとの間で基板を移送する第2ポートと、
を備えるプロセスチャンバ。 - 前記第1ポート上に配設されたゲートバルブを更に備える、請求項1に記載のプロセスチャンバ。
- 前記第2ポート上に配設されたゲートバルブを更に備える、請求項1に記載のプロセスチャンバ。
- プラズマ照射装置と、プロセスガス供給機構とを更に備える、請求項1に記載のプロセスチャンバ。
- 前記チャンバ本体とロードロックとが一つの側壁を共有する、請求項1に記載のプロセスチャンバ。
- 前記チャンバ本体と前記ロードロックとが一体形成されて成る、請求項1に記載のプロセスチャンバ。
- 前記ロードロックは隔壁により区切られた上部と底部とを有し、該上部と該底部とのいずれか一方に配設されたロボットを更に備える、請求項1に記載のプロセスチャンバ。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510276763.3A CN106298583B (zh) | 2015-05-27 | 2015-05-27 | 处理腔、处理腔和真空锁组合以及基片处理系统 |
CNCN201510276763.3 | 2015-05-27 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016225592A JP2016225592A (ja) | 2016-12-28 |
JP6282628B2 true JP6282628B2 (ja) | 2018-02-21 |
Family
ID=57398879
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015236590A Active JP6282628B2 (ja) | 2015-05-27 | 2015-12-03 | プロセスチャンバ、プロセスチャンバとロードロックの複合体、及び基板加工システム |
Country Status (5)
Country | Link |
---|---|
US (1) | US10685814B2 (ja) |
JP (1) | JP6282628B2 (ja) |
KR (1) | KR101891383B1 (ja) |
CN (1) | CN106298583B (ja) |
TW (1) | TWI581360B (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018174186A (ja) * | 2017-03-31 | 2018-11-08 | 東京エレクトロン株式会社 | 基板処理装置 |
CN112530830A (zh) * | 2019-09-18 | 2021-03-19 | 中微半导体设备(上海)股份有限公司 | 基片处理系统、阀板组件及其基片处理系统的工作方法 |
CN112530829A (zh) * | 2019-09-18 | 2021-03-19 | 中微半导体设备(上海)股份有限公司 | 基片处理系统、阀板组件及其基片处理系统的工作方法 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60228728A (ja) * | 1984-04-25 | 1985-11-14 | Nissan Motor Co Ltd | タ−ボチヤ−ジヤ付内燃機関の過給圧制御装置 |
US6034000A (en) * | 1997-07-28 | 2000-03-07 | Applied Materials, Inc. | Multiple loadlock system |
US6977014B1 (en) * | 2000-06-02 | 2005-12-20 | Novellus Systems, Inc. | Architecture for high throughput semiconductor processing applications |
KR100960773B1 (ko) * | 2000-09-15 | 2010-06-01 | 어플라이드 머티어리얼스, 인코포레이티드 | 처리 장비용 더블 이중 슬롯 로드록 |
US20030113188A1 (en) * | 2001-12-17 | 2003-06-19 | Applied Materials, Inc. | Mechanism for providing a continuous supply of wafers and cassettes to semiconductor fabrication tool |
US6899507B2 (en) * | 2002-02-08 | 2005-05-31 | Asm Japan K.K. | Semiconductor processing apparatus comprising chamber partitioned into reaction and transfer sections |
JP4515133B2 (ja) * | 2004-04-02 | 2010-07-28 | 株式会社アルバック | 搬送装置及びその制御方法並びに真空処理装置 |
TWI295816B (en) * | 2005-07-19 | 2008-04-11 | Applied Materials Inc | Hybrid pvd-cvd system |
KR101057530B1 (ko) * | 2005-12-20 | 2011-08-17 | 어플라이드 머티어리얼스, 인코포레이티드 | 반도체 장치 제조 설비를 위한 확대된 본체 |
KR20080071682A (ko) * | 2007-01-31 | 2008-08-05 | 세메스 주식회사 | 로드락 챔버 및 이를 이용한 반도체 제조 장치 |
WO2008144664A1 (en) * | 2007-05-18 | 2008-11-27 | Brooks Automation, Inc. | Compact substrate transport system with fast swap robot |
JP2010135536A (ja) * | 2008-12-04 | 2010-06-17 | Tokyo Electron Ltd | ロードロック装置および真空処理システム |
JP2010238879A (ja) * | 2009-03-31 | 2010-10-21 | Tokyo Electron Ltd | マルチチャンバ処理システム |
CN104137248B (zh) * | 2012-02-29 | 2017-03-22 | 应用材料公司 | 配置中的除污及剥除处理腔室 |
KR20160083084A (ko) * | 2013-11-04 | 2016-07-11 | 어플라이드 머티어리얼스, 인코포레이티드 | 증가된 개수의 측들을 갖는 이송 챔버들, 반도체 디바이스 제조 프로세싱 툴들, 및 프로세싱 방법들 |
-
2015
- 2015-05-27 CN CN201510276763.3A patent/CN106298583B/zh active Active
- 2015-11-25 US US14/952,230 patent/US10685814B2/en active Active
- 2015-11-25 TW TW104139262A patent/TWI581360B/zh active
- 2015-12-03 JP JP2015236590A patent/JP6282628B2/ja active Active
- 2015-12-07 KR KR1020150173056A patent/KR101891383B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
KR20160140323A (ko) | 2016-12-07 |
JP2016225592A (ja) | 2016-12-28 |
TW201642376A (zh) | 2016-12-01 |
TWI581360B (zh) | 2017-05-01 |
US20160351429A1 (en) | 2016-12-01 |
CN106298583A (zh) | 2017-01-04 |
CN106298583B (zh) | 2019-12-03 |
US10685814B2 (en) | 2020-06-16 |
KR101891383B1 (ko) | 2018-08-24 |
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