JP6266028B2 - マニピュレータを含む投影露光装置及び投影露光装置を制御する方法 - Google Patents
マニピュレータを含む投影露光装置及び投影露光装置を制御する方法 Download PDFInfo
- Publication number
- JP6266028B2 JP6266028B2 JP2016009061A JP2016009061A JP6266028B2 JP 6266028 B2 JP6266028 B2 JP 6266028B2 JP 2016009061 A JP2016009061 A JP 2016009061A JP 2016009061 A JP2016009061 A JP 2016009061A JP 6266028 B2 JP6266028 B2 JP 6266028B2
- Authority
- JP
- Japan
- Prior art keywords
- movement
- vector
- optical
- zone
- zones
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims description 66
- 230000003287 optical effect Effects 0.000 claims description 279
- 239000013598 vector Substances 0.000 claims description 258
- 238000012937 correction Methods 0.000 claims description 213
- 238000010438 heat treatment Methods 0.000 claims description 53
- 230000005855 radiation Effects 0.000 claims description 51
- 238000005457 optimization Methods 0.000 claims description 28
- 238000005286 illumination Methods 0.000 claims description 25
- 230000002950 deficient Effects 0.000 claims description 23
- 230000004075 alteration Effects 0.000 claims description 21
- 239000011248 coating agent Substances 0.000 claims description 15
- 238000000576 coating method Methods 0.000 claims description 15
- 238000003384 imaging method Methods 0.000 claims description 15
- 230000007547 defect Effects 0.000 claims description 14
- 238000012360 testing method Methods 0.000 claims description 14
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 230000001419 dependent effect Effects 0.000 claims description 7
- 238000013461 design Methods 0.000 claims description 6
- 230000001360 synchronised effect Effects 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 20
- 239000000758 substrate Substances 0.000 description 18
- 238000007689 inspection Methods 0.000 description 15
- 238000010586 diagram Methods 0.000 description 13
- 238000005259 measurement Methods 0.000 description 12
- 230000006870 function Effects 0.000 description 11
- 238000004364 calculation method Methods 0.000 description 10
- 239000011159 matrix material Substances 0.000 description 9
- 230000003044 adaptive effect Effects 0.000 description 8
- 230000008859 change Effects 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 230000005670 electromagnetic radiation Effects 0.000 description 7
- 230000008569 process Effects 0.000 description 5
- 230000003595 spectral effect Effects 0.000 description 5
- 238000000354 decomposition reaction Methods 0.000 description 4
- 238000006073 displacement reaction Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 210000001747 pupil Anatomy 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- YBJHBAHKTGYVGT-ZKWXMUAHSA-N (+)-Biotin Chemical compound N1C(=O)N[C@@H]2[C@H](CCCCC(=O)O)SC[C@@H]21 YBJHBAHKTGYVGT-ZKWXMUAHSA-N 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 239000011241 protective layer Substances 0.000 description 3
- 239000010453 quartz Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- FEPMHVLSLDOMQC-UHFFFAOYSA-N virginiamycin-S1 Natural products CC1OC(=O)C(C=2C=CC=CC=2)NC(=O)C2CC(=O)CCN2C(=O)C(CC=2C=CC=CC=2)N(C)C(=O)C2CCCN2C(=O)C(CC)NC(=O)C1NC(=O)C1=NC=CC=C1O FEPMHVLSLDOMQC-UHFFFAOYSA-N 0.000 description 3
- 230000003679 aging effect Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- 206010010071 Coma Diseases 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 201000009310 astigmatism Diseases 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 238000001900 extreme ultraviolet lithography Methods 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 230000005405 multipole Effects 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 230000001902 propagating effect Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70191—Optical correction elements, filters or phase plates for controlling intensity, wavelength, polarisation, phase or the like
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70258—Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
- G03F7/70266—Adaptive optics, e.g. deformable optical elements for wavefront control, e.g. for aberration adjustment or correction
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70308—Optical correction elements, filters or phase plates for manipulating imaging light, e.g. intensity, wavelength, polarisation, phase or image shift
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
- G03F7/705—Modelling or simulating from physical phenomena up to complete wafer processes or whole workflow in wafer productions
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70591—Testing optical components
- G03F7/706—Aberration measurement
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Mounting And Adjusting Of Optical Elements (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102015201020.1A DE102015201020A1 (de) | 2015-01-22 | 2015-01-22 | Projektionsbelichtungsanlage mit Manipulator sowie Verfahren zum Steuern einer Projektionsbelichtungsanlage |
| DE102015201020.1 | 2015-01-22 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016136253A JP2016136253A (ja) | 2016-07-28 |
| JP2016136253A5 JP2016136253A5 (enExample) | 2017-08-03 |
| JP6266028B2 true JP6266028B2 (ja) | 2018-01-24 |
Family
ID=55174529
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016009061A Active JP6266028B2 (ja) | 2015-01-22 | 2016-01-20 | マニピュレータを含む投影露光装置及び投影露光装置を制御する方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US9760019B2 (enExample) |
| EP (1) | EP3048486B1 (enExample) |
| JP (1) | JP6266028B2 (enExample) |
| DE (1) | DE102015201020A1 (enExample) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102013204391B3 (de) | 2013-03-13 | 2014-05-28 | Carl Zeiss Smt Gmbh | Projektionsobjektiv mit Wellenfrontmanipulator |
| KR101668984B1 (ko) * | 2013-09-14 | 2016-10-24 | 칼 짜이스 에스엠티 게엠베하 | 마이크로리소그래피 투영 장치의 동작 방법 |
| DE102017208364A1 (de) * | 2017-05-18 | 2018-11-22 | Carl Zeiss Smt Gmbh | Optisches system sowie verfahren |
| DE102019219289A1 (de) * | 2019-12-11 | 2021-06-17 | Carl Zeiss Smt Gmbh | Optisches System, sowie Heizanordnung und Verfahren zum Heizen eines optischen Elements in einem optischen System |
| DE102020201723A1 (de) | 2020-02-12 | 2021-08-12 | Carl Zeiss Smt Gmbh | Projektionsbelichtungsanlage mit einem thermischen Manipulator |
| JP7486335B2 (ja) * | 2020-03-30 | 2024-05-17 | キヤノン株式会社 | インプリント装置、インプリント方法、および物品製造方法 |
| DE102020207752A1 (de) | 2020-06-23 | 2021-12-23 | Carl Zeiss Smt Gmbh | Heizanordnung und Verfahren zum Heizen eines optischen Elements |
| DE102020207748A1 (de) * | 2020-06-23 | 2021-03-25 | Carl Zeiss Smt Gmbh | Optisches System, insbesondere in einermikrolithographischen Projektionsbelichtungsanlage |
| JP2022022911A (ja) * | 2020-07-10 | 2022-02-07 | キヤノン株式会社 | 結像光学系、露光装置、および物品製造方法 |
| DE102020209784A1 (de) * | 2020-08-04 | 2022-02-10 | Carl Zeiss Smt Gmbh | Verfahren zur herstellung oder einstellung einer projektionsbelichtungsanlage |
| US12321099B2 (en) * | 2021-08-30 | 2025-06-03 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method for generating EUV radiation |
| DE102022204015A1 (de) | 2022-04-26 | 2023-10-26 | Carl Zeiss Smt Gmbh | Aktuator und Deformationsspiegel |
| DE102022114974A1 (de) | 2022-06-14 | 2023-12-14 | Carl Zeiss Smt Gmbh | Verfahren zum Heizen eines optischen Elements sowie optisches System |
| DE102022116700A1 (de) * | 2022-07-05 | 2024-01-11 | Carl Zeiss Smt Gmbh | Optische Baugruppe, Projektionsbelichtungsanlage für die Halbleiterlithographie und Verfahren |
| DE102022212380A1 (de) | 2022-11-21 | 2023-11-23 | Carl Zeiss Smt Gmbh | Verfahren und Vorrichtung zum Heizen eines EUV-Spiegels, mikrolithographische Projektionsbelichtungsanlage |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW550377B (en) | 2000-02-23 | 2003-09-01 | Zeiss Stiftung | Apparatus for wave-front detection |
| US6398373B1 (en) * | 2000-08-09 | 2002-06-04 | Asml Us, Inc. | Pneumatic control system and method for shaping deformable mirrors in lithographic projection systems |
| DE10046379A1 (de) * | 2000-09-20 | 2002-03-28 | Zeiss Carl | System zur gezielten Deformation von optischen Elementen |
| DE10146499B4 (de) * | 2001-09-21 | 2006-11-09 | Carl Zeiss Smt Ag | Verfahren zur Optimierung der Abbildungseigenschaften von mindestens zwei optischen Elementen sowie Verfahren zur Optimierung der Abbildungseigenschaften von mindestens drei optischen Elementen |
| US6803994B2 (en) | 2002-06-21 | 2004-10-12 | Nikon Corporation | Wavefront aberration correction system |
| JP4692753B2 (ja) * | 2004-02-13 | 2011-06-01 | 株式会社ニコン | 露光方法及び装置、並びにデバイス製造方法 |
| DE102004035595B4 (de) | 2004-04-09 | 2008-02-07 | Carl Zeiss Smt Ag | Verfahren zur Justage eines Projektionsobjektives |
| US7423765B2 (en) * | 2004-07-31 | 2008-09-09 | Carl Zeiss Smt Ag | Optical system of a microlithographic projection exposure apparatus |
| US20080204682A1 (en) | 2005-06-28 | 2008-08-28 | Nikon Corporation | Exposure method and exposure apparatus, and device manufacturing method |
| DE102006045075A1 (de) | 2006-09-21 | 2008-04-03 | Carl Zeiss Smt Ag | Steuerbares optisches Element |
| US20100033704A1 (en) * | 2008-08-11 | 2010-02-11 | Masayuki Shiraishi | Deformable mirror, mirror apparatus, and exposure apparatus |
| DE102008042356A1 (de) * | 2008-09-25 | 2010-04-08 | Carl Zeiss Smt Ag | Projektionsbelichtungsanlage mit optimierter Justagemöglichkeit |
| WO2011074319A1 (ja) | 2009-12-14 | 2011-06-23 | 株式会社ニコン | デフォーマブルミラー、照明光学系、露光装置、およびデバイス製造方法 |
| TWI475330B (zh) | 2010-07-30 | 2015-03-01 | 卡爾蔡司Smt有限公司 | 超紫外線曝光裝置 |
| DE102011077784A1 (de) | 2011-06-20 | 2012-12-20 | Carl Zeiss Smt Gmbh | Projektionsanordnung |
| DE102011081603A1 (de) | 2011-08-26 | 2012-10-25 | Carl Zeiss Smt Gmbh | Adaptiver Spiegel und Verfahren zu dessen Herstellung |
| JP2013106014A (ja) | 2011-11-16 | 2013-05-30 | Nikon Corp | 変形可能な反射光学素子及びその駆動方法、光学系、並びに露光装置 |
| KR101679136B1 (ko) * | 2012-02-04 | 2016-11-23 | 칼 짜이스 에스엠티 게엠베하 | 마이크로리소그래픽 투영 노광 장치의 동작 방법 및 이러한 장치의 투영 오브젝티브 |
| JP2013161992A (ja) | 2012-02-06 | 2013-08-19 | Nikon Corp | 変形可能な反射光学素子、光学系、及び露光装置 |
| DE102012205096B3 (de) * | 2012-03-29 | 2013-08-29 | Carl Zeiss Smt Gmbh | Projektionsbelichtungsanlage mit mindestens einem Manipulator |
| DE102012212757A1 (de) * | 2012-07-20 | 2014-01-23 | Carl Zeiss Smt Gmbh | Verfahren zum betreiben einer mikrolithographischen projektionsbelichtungsanlage |
| US9651872B2 (en) | 2013-03-13 | 2017-05-16 | Carl Zeiss Smt Gmbh | Projection lens with wavefront manipulator |
| DE102013204391B3 (de) * | 2013-03-13 | 2014-05-28 | Carl Zeiss Smt Gmbh | Projektionsobjektiv mit Wellenfrontmanipulator |
-
2015
- 2015-01-22 DE DE102015201020.1A patent/DE102015201020A1/de not_active Ceased
-
2016
- 2016-01-15 EP EP16000098.0A patent/EP3048486B1/de active Active
- 2016-01-20 JP JP2016009061A patent/JP6266028B2/ja active Active
- 2016-01-21 US US15/002,564 patent/US9760019B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| EP3048486A3 (de) | 2016-08-31 |
| EP3048486A2 (de) | 2016-07-27 |
| US9760019B2 (en) | 2017-09-12 |
| JP2016136253A (ja) | 2016-07-28 |
| EP3048486B1 (de) | 2018-06-06 |
| DE102015201020A1 (de) | 2016-07-28 |
| US20160216616A1 (en) | 2016-07-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6266028B2 (ja) | マニピュレータを含む投影露光装置及び投影露光装置を制御する方法 | |
| KR100657640B1 (ko) | 리소그래피 공정 시 웨이퍼 열 변형의 최적화된 보정 | |
| JP2005004146A (ja) | 反射光学素子及び露光装置 | |
| US20220373899A1 (en) | Projection exposure apparatus with a thermal manipulator | |
| US11640119B2 (en) | Exposure method, exposure apparatus, article manufacturing method, and method of manufacturing semiconductor device | |
| CN112130421B (zh) | 曝光装置、曝光方法和制造物品的方法 | |
| KR20230136134A (ko) | 투영 시스템에서의 수차를 예측하기 위한 방법 및 시스템 | |
| US12411417B2 (en) | Projection objective including an optical device | |
| CN119365822A (zh) | 用于加热光学元件的方法和光学系统 | |
| US12339592B2 (en) | Method for thermo-mechanical control of a heat sensitive element and device for use in a lithographic production process | |
| CN117063128A (zh) | 用于照射均匀性校正的光刻设备和方法 | |
| JP7457678B2 (ja) | 露光装置、露光方法および物品製造方法 | |
| JP7504282B2 (ja) | 光学装置を調整するためのシステムおよび方法 | |
| JP2023073020A (ja) | 露光装置および物品の製造方法 | |
| JP2022089012A (ja) | 露光装置、露光方法および物品の製造方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20161207 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20161226 |
|
| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20170327 |
|
| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20170526 |
|
| A524 | Written submission of copy of amendment under article 19 pct |
Free format text: JAPANESE INTERMEDIATE CODE: A524 Effective date: 20170622 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20171204 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 6266028 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |