JP6249050B2 - 液体噴射ヘッドおよび液体噴射装置 - Google Patents
液体噴射ヘッドおよび液体噴射装置 Download PDFInfo
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- JP6249050B2 JP6249050B2 JP2016118611A JP2016118611A JP6249050B2 JP 6249050 B2 JP6249050 B2 JP 6249050B2 JP 2016118611 A JP2016118611 A JP 2016118611A JP 2016118611 A JP2016118611 A JP 2016118611A JP 6249050 B2 JP6249050 B2 JP 6249050B2
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- Prior art keywords
- liquid
- reservoir
- piezoelectric element
- substrate
- liquid ejecting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000007788 liquid Substances 0.000 title claims description 98
- 239000000758 substrate Substances 0.000 claims description 154
- 230000001681 protective effect Effects 0.000 claims description 44
- 238000000034 method Methods 0.000 description 16
- 239000000463 material Substances 0.000 description 13
- 238000005530 etching Methods 0.000 description 11
- 238000004891 communication Methods 0.000 description 8
- 239000010931 gold Substances 0.000 description 8
- 239000012212 insulator Substances 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 239000002243 precursor Substances 0.000 description 7
- 238000007789 sealing Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 5
- 239000013078 crystal Substances 0.000 description 5
- 238000001020 plasma etching Methods 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000005238 degreasing Methods 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000010304 firing Methods 0.000 description 3
- 229910052741 iridium Inorganic materials 0.000 description 3
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 3
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 3
- 229910044991 metal oxide Inorganic materials 0.000 description 3
- 150000004706 metal oxides Chemical class 0.000 description 3
- 238000000059 patterning Methods 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 238000009623 Bosch process Methods 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- 229910018503 SF6 Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910004121 SrRuO Inorganic materials 0.000 description 2
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- 238000009616 inductively coupled plasma Methods 0.000 description 2
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000003980 solgel method Methods 0.000 description 2
- 229910052712 strontium Inorganic materials 0.000 description 2
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 2
- SFZCNBIFKDRMGX-UHFFFAOYSA-N sulfur hexafluoride Chemical compound FS(F)(F)(F)(F)F SFZCNBIFKDRMGX-UHFFFAOYSA-N 0.000 description 2
- 229960000909 sulfur hexafluoride Drugs 0.000 description 2
- 229910052726 zirconium Inorganic materials 0.000 description 2
- 238000000018 DNA microarray Methods 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 239000013212 metal-organic material Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 239000010955 niobium Substances 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- 150000002902 organometallic compounds Chemical class 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 238000001552 radio frequency sputter deposition Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000001947 vapour-phase growth Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
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- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016118611A JP6249050B2 (ja) | 2016-06-15 | 2016-06-15 | 液体噴射ヘッドおよび液体噴射装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016118611A JP6249050B2 (ja) | 2016-06-15 | 2016-06-15 | 液体噴射ヘッドおよび液体噴射装置 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011266549A Division JP5953723B2 (ja) | 2011-12-06 | 2011-12-06 | 液体噴射ヘッドおよび液体噴射装置 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017222480A Division JP6409944B2 (ja) | 2017-11-20 | 2017-11-20 | 液体噴射ヘッドおよび液体噴射装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016164004A JP2016164004A (ja) | 2016-09-08 |
| JP2016164004A5 JP2016164004A5 (enrdf_load_stackoverflow) | 2017-05-18 |
| JP6249050B2 true JP6249050B2 (ja) | 2017-12-20 |
Family
ID=56876207
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016118611A Active JP6249050B2 (ja) | 2016-06-15 | 2016-06-15 | 液体噴射ヘッドおよび液体噴射装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6249050B2 (enrdf_load_stackoverflow) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7106828B2 (ja) * | 2017-09-13 | 2022-07-27 | セイコーエプソン株式会社 | 液体噴射ヘッド、液体噴射装置、圧電デバイス、及び、液体噴射ヘッドの製造方法 |
| CN110722880B (zh) * | 2018-07-17 | 2021-01-12 | 精工爱普生株式会社 | 头单元以及液体喷出装置 |
| CN119789960A (zh) * | 2022-08-29 | 2025-04-08 | 京瓷株式会社 | 液体喷出头及记录装置 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002046281A (ja) * | 2000-08-01 | 2002-02-12 | Seiko Epson Corp | インクジェット式記録ヘッド及びその製造方法並びにインクジェット式記録装置 |
| JP2005209898A (ja) * | 2004-01-23 | 2005-08-04 | Seiko Epson Corp | 圧電体素子、及びその製造方法並びに液体噴射ヘッド |
| JP2006116767A (ja) * | 2004-10-20 | 2006-05-11 | Seiko Epson Corp | 液滴吐出ヘッド、液滴吐出装置 |
| JP2010069688A (ja) * | 2008-09-17 | 2010-04-02 | Seiko Epson Corp | 液体噴射ヘッド及び液体噴射装置 |
| JP5403228B2 (ja) * | 2009-03-26 | 2014-01-29 | セイコーエプソン株式会社 | 液体噴射ヘッドユニット及び液体噴射装置 |
| US8454132B2 (en) * | 2009-12-14 | 2013-06-04 | Fujifilm Corporation | Moisture protection of fluid ejector |
| JP5716431B2 (ja) * | 2011-02-04 | 2015-05-13 | 株式会社リコー | インクジェット記録ヘッド、インクカートリッジ、インクジェット記録装置、および、画像形成装置。 |
| JP5776214B2 (ja) * | 2011-02-18 | 2015-09-09 | 株式会社リコー | 液滴吐出ヘッド、及び画像形成装置 |
| JP2013028033A (ja) * | 2011-07-27 | 2013-02-07 | Ricoh Co Ltd | 液滴吐出ヘッド、及び画像形成装置 |
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- 2016-06-15 JP JP2016118611A patent/JP6249050B2/ja active Active
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| Publication number | Publication date |
|---|---|
| JP2016164004A (ja) | 2016-09-08 |
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