JP6249050B2 - Liquid ejecting head and liquid ejecting apparatus - Google Patents

Description

  The present invention relates to a liquid ejecting head having a pressure absorbing member and a liquid ejecting apparatus.

As a liquid ejecting head, for example, a part of a pressure generating chamber communicating with a nozzle opening for ejecting ink droplets is configured by a vibration plate, and the vibration plate is deformed by a piezoelectric element to pressurize ink in the pressure generating chamber, and the nozzle There are ink jet recording heads that eject ink droplets from openings.
Also known is a head body in which a protective substrate is bonded onto a flow path forming substrate on which a piezoelectric element is formed. In order to connect the electrode of the piezoelectric element and a COF (Chip On Film) substrate, which is a wiring board on which the drive circuit is mounted, a through hole is formed in the protective substrate, and the lead electrode is drawn out from the piezoelectric element to the through hole. A COF substrate is connected to the lead electrode in the through hole. Furthermore, one surface of the reservoir portion is sealed with a sealing film that is a pressure absorbing member, so that pressure fluctuations in the pressure generating chamber or the like are absorbed (see, for example, Patent Document 1).

JP 2010-228265 A

The larger the area of the pressure absorbing member that seals the reservoir, the better the efficiency of absorbing pressure fluctuations in the pressure generating chamber or the like. In order to increase the area of the pressure absorbing member, it is necessary to widen the reservoir.
In a structure in which a through hole is formed in the protective substrate, a lead electrode is drawn out from the piezoelectric element to the through hole, and the lead electrode and the COF substrate are connected in the through hole, it is necessary to avoid the through hole and widen the reservoir portion. Accordingly, it is necessary to form the reservoir portion by expanding the flow path forming substrate, the protective substrate, the vibration plate, and the like in a direction avoiding the through holes, and it is difficult to obtain a small-sized liquid ejecting head with reduced cost.

  SUMMARY An advantage of some aspects of the invention is to solve at least one of the problems described above, and the invention can be implemented as the following forms or application examples.

[Application Example 1]
A liquid ejecting head in which a plurality of nozzle openings for ejecting liquid are arranged side by side, the flow path forming substrate having a liquid supply path for supplying the liquid to a pressure generation chamber communicating with the nozzle openings, and the flow path A piezoelectric element that is formed on a formation substrate and changes the pressure in the pressure generating chamber; a piezoelectric element holding portion that protects the piezoelectric element; and a protective substrate that has a through hole that exposes a lead electrode drawn from the piezoelectric element; A drive circuit housed in the through-hole and connected to the lead electrode, a reservoir-forming substrate covering the through-hole, and a reservoir partially formed on the protective substrate and the reservoir-forming substrate on the through-hole And a compliance substrate that seals the reservoir portion and absorbs pressure fluctuations of the reservoir portion by a pressure absorbing member. Body jet head.

  According to this application example, since the reservoir portion is also formed on the through hole, the area of the pressure absorption member of the compliance substrate can be increased, and the pressure fluctuation absorption efficiency is improved. In addition, a part of the reservoir portion is also formed on the through holes in the direction in which the flow path forming substrate, the protective substrate, and the reservoir forming substrate are stacked. Compared with the case where the portion is formed, a small-sized liquid ejecting head with reduced cost can be obtained.

[Application Example 2]
The liquid ejecting head according to claim 1, wherein the wiring board connected to the drive circuit is connected in a direction different from a direction in which the lead electrode is connected.
In this application example, since the wiring board is connected to the drive circuit in a direction different from the direction in which the lead electrode drawn from the piezoelectric element is connected to the drive circuit, the direction of the lead electrode drawn from the piezoelectric element is Thus, a smaller liquid jet head can be obtained.

[Application Example 3]
The liquid ejecting head according to claim 1, further comprising a heat conducting member that contacts the driving circuit and the reservoir forming substrate.
In this application example, heat generated in the drive circuit escapes through the reservoir formation substrate, changes in the characteristics of the piezoelectric element due to heat generated in the drive circuit, fluctuations in the capacity of the pressure generation chamber and the liquid supply path, flow path formation substrate Further, peeling between the substrates due to a difference in thermal expansion between the protective substrate, the reservoir forming substrate, and the compliance substrate is suppressed. Therefore, it is possible to obtain a liquid ejecting head with improved durability in which there is little variation in the liquid ejecting state and leakage of liquid from between the substrates is suppressed.

[Application Example 4]
A liquid ejecting apparatus comprising the liquid ejecting head described above.

  According to this application example, a liquid ejecting apparatus that can achieve the above-described effects can be obtained.

1 is a schematic perspective view illustrating an example of an ink jet recording apparatus. 1 is a schematic perspective view of an ink jet recording head. FIG. 2 is an exploded perspective view illustrating a schematic configuration of an ink jet recording head. FIG. 3 is a cross-sectional perspective view taken along line AA in FIG. 2 of the ink jet recording head. AA and BB cross-sectional perspective views in FIG. 2 of the ink jet recording head. FIG. 3 is an exploded partial perspective view illustrating a configuration of an ink jet recording head. (A) is a partial plan view of an ink jet recording head, (b) is a CC cross-sectional view in (a), and (c) is a DD partial cross-sectional view in (a).

Hereinafter, embodiments will be described in detail with reference to the drawings. In the following drawings, the scale of each layer and each member is different from the actual scale so that each layer and each member can be recognized.
FIG. 1 is a schematic perspective view illustrating an example of an ink jet recording apparatus 1000 as a liquid ejecting apparatus. The ink jet recording apparatus 1000 includes an ink jet recording head 1 as a liquid ejecting head.
In FIG. 1, an ink jet recording apparatus 1000 includes recording head units 1A and 1B. The recording head units 1A and 1B are detachably provided with cartridges 2A and 2B constituting ink supply means. A carriage 3 on which the recording head units 1A and 1B are mounted is a carriage shaft 5 attached to the apparatus main body 4. Are provided so as to be axially movable.

  The recording head units 1A and 1B, for example, discharge a black ink composition and a color ink composition, respectively. Then, the driving force of the driving motor 6 is transmitted to the carriage 3 via a plurality of gears and a timing belt 7 (not shown), so that the carriage 3 on which the recording head units 1A and 1B are mounted moves along the carriage shaft 5. . On the other hand, the apparatus main body 4 is provided with a platen 8 along the carriage shaft 5, and a recording sheet S, which is a recording medium such as paper fed by a not-shown paper feed roller, is conveyed on the platen 8. It is like that. In FIG. 1, the conveying direction is indicated by a white arrow.

  The recording head units 1 </ b> A and 1 </ b> B include the ink jet recording head 1 at a position facing the recording sheet S. In the drawing, the ink jet recording head 1 is located on the recording sheet S side of the recording head units 1A and 1B, and is not directly illustrated.

FIG. 2 is a schematic perspective view showing the ink jet recording head 1 according to the embodiment.
The shape of the ink jet recording head 1 is a substantially rectangular parallelepiped. A flexible substrate 210 as a wiring substrate is inserted from openings 220 provided at both ends in the longitudinal direction of one surface of the widest surface of the rectangular parallelepiped. The longitudinal direction is indicated by a white arrow in FIG. The conveyance direction of the recording sheet S shown in FIG. 1 and the longitudinal direction of the ink jet recording head 1 coincide. Here, the term “match” includes a dimensional error that occurs in manufacturing and an error due to a shift in the transport direction that occurs during transport.

In the middle of the longitudinal direction of the surface where the two flexible substrates 210 are inserted, two ink inlets 230 are provided, and ink is supplied from the cartridges 2A and 2B shown in FIG.
3 is an exploded perspective view showing a schematic configuration of the ink jet recording head 1, FIG. 4 is a perspective cross-sectional view taken along the line AA of FIG. 2 of the ink jet recording head 1, and FIG. It is an AA and BB cross-sectional perspective view in FIG.

2 to 5, the ink jet recording head 1 includes a flow path forming substrate 10, a nozzle plate 20, a protective substrate 30, a reservoir forming substrate 35, a compliance substrate 40, a drive circuit 200, and a flexible substrate 210.
The flow path forming substrate 10, the nozzle plate 20, and the protective substrate 30 are stacked so that the flow path forming substrate 10 is sandwiched between the nozzle plate 20 and the protective substrate 30, and the reservoir forming substrate 35 is stacked on the protective substrate 30. Further, the compliance substrate 40 is stacked on the reservoir forming substrate 35.
The drive circuit 200 is disposed in the through hole 33 formed in the protective substrate 30 between the flow path forming substrate 10 and the reservoir forming substrate 35.

FIG. 6 is an exploded partial perspective view showing a more detailed configuration of the ink jet recording head 1, in which the reservoir forming substrate 35 and the compliance substrate 40 are omitted. FIG. 7A is a partial plan view of the ink jet recording head 1, in which the reservoir forming substrate 35 and the compliance substrate 40 are omitted. 7B is a cross-sectional view taken along the line CC of the ink jet recording head 1 in FIG. 7A, and FIG. 7C is a partial cross-sectional view taken along the line DD of the ink jet recording head 1 in FIG. .
The flow path forming substrate 10 is made of, for example, a silicon single crystal plate having a plane orientation (110). A plurality of pressure generating chambers 12 are formed on the flow path forming substrate 10 in two rows 13 by anisotropic etching. Here, the rows 13 are arranged in parallel in the width direction of the ink jet recording head 1 (direction orthogonal to the longitudinal direction). The cross-sectional shape of the pressure generation chamber 12 in the width direction of the ink jet recording head 1 is trapezoidal, and the pressure generation chamber 12 is formed long in the width direction of the ink jet recording head 1.

  In addition, a communication portion 14 as a liquid supply path is formed in a region outside the longitudinal direction of the pressure generation chamber 12 of the flow path forming substrate 10, and the communication portion 14 and each pressure generation chamber 12 are connected to each pressure generation chamber. 12 is communicated via an ink supply path 15 as a liquid supply path. The ink supply path 15 is formed with a narrower width than the pressure generation chamber 12, and maintains a constant flow path resistance of ink flowing into the pressure generation chamber 12 from the communication portion 14.

In the nozzle plate 20, nozzle openings 21 communicating with the outside are formed in the vicinity of the end of each pressure generating chamber 12 on the side opposite to the ink supply path 15.
The nozzle plate 20 is made of glass ceramics, a silicon single crystal substrate, non-rust steel, or the like.
The flow path forming substrate 10 and the nozzle plate 20 are fixed by an adhesive, a heat welding film, or the like.

An elastic film 50 constituting a vibration plate is formed on the surface of the flow path forming substrate 10 that faces the surface on which the nozzle plate 20 is fixed. For example, the elastic film 50 is made of silicon dioxide obtained by thermally oxidizing the flow path forming substrate 10 in a diffusion furnace at about 1100 ° C.
An insulator film 55 made of an oxide film is formed on the elastic film 50 of the flow path forming substrate 10. For example, the insulator film 55 is made of zirconium oxide, and is obtained by forming a zirconium film by sputtering or the like and then thermally oxidizing the zirconium film in a diffusion furnace at 500 ° C. to 1200 ° C. Here, the elastic film 50 and the insulator film 55 constitute a diaphragm.

  Further, on the insulator film 55, a lower electrode 60 made of a metal such as platinum (Pt) or a metal oxide such as strontium ruthenate (SrRuO), a piezoelectric layer 70 having a perovskite structure, and gold (Au) The upper electrode 80 made of a metal such as iridium (Ir) is formed to constitute the piezoelectric element 300. Here, the piezoelectric element 300 refers to a portion including the lower electrode 60, the piezoelectric layer 70, and the upper electrode 80.

For example, the lower electrode 60 is formed by patterning a lower electrode film made of a metal oxide such as platinum (Pt), iridium (Ir), or strontium ruthenate (SrRuO) on the entire surface of the insulator film 55, and then patterning it into a predetermined shape. Obtained.
For example, the piezoelectric layer 70 and the upper electrode 80 can be formed by the following method.
First, a piezoelectric layer film made of a piezoelectric material is formed on the lower electrode 60 and the insulator film 55. As the piezoelectric material, a piezoelectric layer film made of lead zirconate titanate (PZT) can be used.
As a method for producing a piezoelectric layer film, a so-called sol in which a so-called sol in which a metal organic material is dissolved and dispersed in a catalyst is applied, dried, gelled, and further baked at a high temperature to obtain a piezoelectric layer film made of a metal oxide. -A gel method can be used.
The method is not limited to the sol-gel method, and for example, a MOD (Metal-Organic Decomposition) method or the like may be used. Furthermore, it is not limited to the manufacturing method of the piezoelectric layer film by these liquid phase methods, The manufacturing method of the piezoelectric layer film using vapor phase growth, such as sputtering, may be used.

The sol-gel method will be described in detail. First, a sol (solution) containing a metal organic compound is applied. Next, the piezoelectric precursor film obtained by coating is heated to a predetermined temperature and dried for a predetermined time, and the sol solvent is evaporated to dry the piezoelectric precursor film. Further, the piezoelectric precursor film is degreased at a constant temperature for a predetermined time in an air atmosphere.
Here, degreasing refers, the organic components of the sol film, for example, is to be detached as _{NO 2, CO 2, H 2} O or the like.

By repeating such coating, drying, and degreasing processes a predetermined number of times, for example, twice, a piezoelectric precursor film is formed to a predetermined thickness, and this piezoelectric precursor film is heated in a diffusion furnace or the like. To form a piezoelectric film. That is, by firing the piezoelectric precursor film, crystals grow and a piezoelectric film is formed.
The firing temperature is preferably about 650 ° C. to 850 ° C., for example, the piezoelectric precursor film is fired at about 700 ° C. for 30 minutes to form the piezoelectric film. Crystals of the piezoelectric film formed under such conditions are preferentially oriented in the (100) plane.
By repeating the above-described coating, drying, degreasing, and firing steps a plurality of times, a piezoelectric layer film having a predetermined thickness composed of a multilayer piezoelectric film is formed.

  As a material of the piezoelectric layer film, for example, a relaxor ferroelectric material obtained by adding a metal such as niobium, nickel, magnesium, bismuth or yttrium to a ferroelectric piezoelectric material such as lead zirconate titanate may be used. Good. Moreover, you may use the piezoelectric element which consists of what is called a lead-free piezoelectric material which does not contain lead in a piezoelectric material.

  After the piezoelectric layer film is formed, for example, an upper electrode film made of gold (Au), iridium (Ir), or the like is formed on the entire surface of the piezoelectric layer film. The upper electrode film can be formed by sputtering, for example, DC or RF sputtering.

  The piezoelectric layer film and the upper electrode film are patterned in a region facing each pressure generating chamber 12 to form the piezoelectric element 300 including the lower electrode 60, the piezoelectric layer 70, and the upper electrode 80.

In general, one of the electrodes of the piezoelectric element 300 is used as a common electrode, and the other electrode and the piezoelectric layer 70 are patterned into each pressure generating chamber 12. In addition, here, a portion that is configured by any one of the patterned electrodes and the piezoelectric layer 70 and in which piezoelectric distortion is generated by applying a voltage to both electrodes is referred to as a piezoelectric active portion.
In the embodiment, the lower electrode 60 is a common electrode of the piezoelectric element 300, and the upper electrode 80 is an individual electrode of the piezoelectric element 300. However, there is no problem even if it is reversed for the convenience of the drive circuit 200 and wiring. In either case, a piezoelectric active part is formed for each pressure generating chamber 12. Here, the piezoelectric element 300 and the elastic film 50 and the insulator film 55 (vibrating plate) that are displaced by driving the piezoelectric element 300 are collectively referred to as a piezoelectric actuator.

  In addition, a lead electrode 90 as an extraction electrode made of, for example, gold (Au) or the like is connected to the upper electrode 80 constituting each piezoelectric element 300, and the lead electrode 90 is connected to the pressure generating chamber 12. To the area between the columns 13.

  The lead electrode 90 forms a metal layer made of, for example, gold (Au) or the like over the entire surface of the flow path forming substrate 10, and then piezoelectrically moves the metal layer through a mask pattern (not shown) made of, for example, a resist or the like. It is obtained by forming the lead electrode 90 by patterning each element 300.

The protective substrate 30 has a piezoelectric element holding portion 31 in a state where a space that does not hinder the movement of the piezoelectric element 300 is secured in a region facing the piezoelectric element 300. Two piezoelectric element holding portions 31 are provided corresponding to the two rows 13 of each pressure generating chamber 12.
On the flow path forming substrate 10 on which the piezoelectric element 300 is formed, the protective substrate 30 is bonded by an adhesive 56.
Adhesion is performed by bringing the flow path forming substrate 10 on which the piezoelectric element 300 prepared separately from the protective substrate 30 and the protective substrate 30 face each other so that the piezoelectric element 300 can be accommodated in the piezoelectric element holding portion 31. Glue.
Adhesion is performed by treating the adhesive surface with a primer, transferring the adhesive 56 to the adhesive surface of the protective substrate 30, bonding the flow path forming substrate 10 and the protective substrate 30 together, temporarily adhering, and curing.

In the embodiment, each piezoelectric element holding portion 31 is integrally provided in a region corresponding to the row 13 of each pressure generating chamber 12, but may be provided independently for each piezoelectric element 300. .
Examples of the material of the protective substrate 30 include glass, ceramic material, metal, resin, and the like, but it is more preferable that the protective substrate 30 is formed of a material that is substantially the same as the coefficient of thermal expansion of the flow path forming substrate 10. Then, a silicon single crystal substrate made of the same material as the flow path forming substrate 10 is used.

  In addition, a reservoir portion 32 is provided on the protective substrate 30 from the region corresponding to the communication portion 14 of the flow path forming substrate 10 to the piezoelectric element holding portion 31. In the embodiment, the reservoir portion 32 is provided along the row 13 of the pressure generation chambers 12, and communicates with the communication portion 14 of the flow path forming substrate 10 to become a common ink chamber for the pressure generation chambers 12. A manifold 100 is configured.

Further, the protective substrate 30 is disposed in the thickness direction in the substantially central portion in the direction orthogonal to the longitudinal direction of the protective substrate 30 (the direction of the white arrow in the figure), that is, in the opposing region between the rows 13 of the pressure generating chambers 12. A through-hole 33 is provided to pass through.
The through hole 33 can be formed by, for example, dry etching. As the dry etching, for example, RIE (Reactive Ion Etching) can be used. For example, Fukahori RIE can be used. Fukahori RIE refers to reactive ion etching with a high aspect ratio (narrow and deep). The deep digging method usually uses high-density plasma, and uses a method of cooling the sample to a low temperature and a method using an etching technique called a Bosch process, or both.

The Bosch process is an etching method in which etching and etching sidewall protection are repeated, and etching with a high aspect ratio is possible.
The process repeats the following two processes. In some cases, additional steps may be added.
Etching step: Isotropic etching is mainly performed using sulfur hexafluoride (SF6). Since there is a case where a protective film is attached to the bottom of the etching hole, it also serves to remove the protective film on the bottom.
Protection step: Teflon (registered trademark) -based gas (such as C4F8) is used to protect the sidewall. The lateral etching is suppressed by protecting the side wall.
Since the etching in the lateral direction is suppressed by the protective film, a narrow and deep (high aspect ratio) hole can be dug. The sidewall angle can be nearly vertical, and can be changed to other angles by changing the process conditions.
As a method for generating high-density plasma, a method using a microwave called ICP (Inductively Coupled Plasma) RIE, ECR (Electron Cyclotron Resonance) RIE, or the like is mainly used.

The lead electrode 90 drawn from the piezoelectric element 300 has at least the tip portion exposed at the bottom of the through hole 33.
The drive circuit 200 is accommodated in the through hole 33. The drive circuit 200 is placed on the tip of the lead electrode 90 exposed in the through hole 33, and the tip of the lead electrode 90 and a terminal (not shown) of the drive circuit 200 are connected.

  The drive signal includes, for example, a drive system signal for driving the drive IC such as a drive power supply signal, and various control system signals such as a serial signal (SI), and the wiring includes a plurality of signals supplied with the respective signals. Consists of wiring.

A reservoir forming substrate 35 is stacked on the protective substrate 30, and a part of the reservoir portion 32 is formed on the through hole 33. Further, the reservoir forming substrate 35 is formed with a girder 36 over the longitudinal direction so as to cover the through-hole 33 at a substantially central portion in a direction perpendicular to the longitudinal direction (the direction of the white arrow in the figure). Here, the heat conducting member 400 is sandwiched between the beam 36 and the drive circuit 200, and is in contact with the beam 36 and the drive circuit 200.
As the heat conductive member 400, a resin such as an adhesive, silicon grease, grease in which silicon is highly filled with ceramic filler, or a heat dissipation sheet can be used.

  On the reservoir forming substrate 35, a compliance substrate 40 composed of a sealing film 41 as a pressure absorbing member and a fixing plate 42 is bonded. Here, the sealing film 41 is made of a material having low rigidity and flexibility (for example, a polyphenylene sulfide (PPS) film having a thickness of 6 μm). The sealing film 41 seals one surface of the reservoir portion 32. It has been stopped. The fixing plate 42 is formed of a hard material such as metal (for example, stainless steel (SUS) having a thickness of 30 μm). Since the area of the fixing plate 42 facing the manifold 100 is an opening 43 that is completely removed in the thickness direction, one surface of the manifold 100 is sealed only with a flexible sealing film 41. Has been.

  In the ink jet recording head 1, after taking ink from the cartridges 2 </ b> A and 2 </ b> B and filling the interior from the manifold 100 to the nozzle opening 21 with ink, each corresponding to the pressure generating chamber 12 according to the recording signal from the drive circuit 200. A voltage is applied between the lower electrode 60 and the upper electrode 80. By applying voltage, the elastic film 50 and the piezoelectric layer 70 are bent and deformed, the pressure in each pressure generating chamber 12 is increased, and ink droplets are ejected from the nozzle openings 21.

  The ink jet recording head 1 constitutes a part of a recording head unit having an ink flow path communicating with an ink cartridge or the like as ink supply means, and is mounted on the ink jet recording apparatus 1000.

According to such an embodiment, there are the following effects.
(1) Since the reservoir portion 32 is also formed on the through hole 33, the area of the sealing film 41 of the compliance substrate 40 can be increased, and the absorption efficiency of pressure fluctuation can be improved.
In particular, large pressure fluctuations generated in the reservoir portion 32, the pressure generating chamber 12, the communication portion 14, and the ink supply path 15 when the cartridges 2A and 2B are connected to the ink jet recording head 1 can be absorbed.
In addition, since a part of the reservoir portion 32 is also formed on the through hole 33 in the direction in which the flow path forming substrate 10, the protective substrate 30 and the reservoir forming substrate 35 are stacked, Compared to the case where the reservoir portion 32 is formed by expanding the substrate, a small-sized ink jet recording head 1 can be obtained with reduced costs.

  (2) Since the flexible substrate 210 is connected to the drive circuit 200 in a direction different from the direction in which the lead electrode 90 drawn from the piezoelectric element 300 is connected to the drive circuit 200, the lead electrode drawn from the piezoelectric element 300 A smaller inkjet recording head 1 can be obtained with respect to 90 directions.

  (3) The heat generated in the drive circuit 200 escapes through the reservoir forming substrate 35, changes in the characteristics of the piezoelectric element 300 due to the heat generated in the drive circuit 200, the pressure generation chamber 12, the communication portion 14, and the ink supply path 15 It is possible to suppress separation between the substrates due to a variation in capacity, a thermal expansion difference among the flow path forming substrate 10, the protective substrate 30, the reservoir forming substrate 35, and the compliance substrate 40. Accordingly, it is possible to obtain the ink jet recording head 1 with improved durability in which the variation in the ink ejection state is small and the leakage of ink from between the substrates is suppressed.

  (4) The ink jet recording apparatus 1000 that can achieve the above-described effects can be obtained.

In the above-described embodiment, an ink jet recording head has been described as an example of a liquid ejecting head. However, the present invention is widely intended for all liquid ejecting heads, and is a liquid ejecting head that ejects liquid other than ink. Of course, it can also be applied.
Other liquid ejecting heads include, for example, various recording heads used in image recording apparatuses such as printers, color material ejecting heads used in the manufacture of color filters such as liquid crystal displays, organic EL displays, and FEDs (field emission displays). Examples thereof include an electrode material ejection head used for electrode formation, a bioorganic matter ejection head used for biochip production, and the like.

  DESCRIPTION OF SYMBOLS 1 ... Inkjet recording head as a liquid ejecting head, 1A, 1B ... Recording head unit, 2A, 2B ... Cartridge, 3 ... Carriage, 4 ... Apparatus body, 5 ... Carriage shaft, 6 ... Drive motor, 7 ... Timing belt, DESCRIPTION OF SYMBOLS 8 ... Platen, 10 ... Flow path formation board | substrate, 12 ... Pressure generation chamber, 13 ... Row, 14 ... Communication part as a liquid supply path, 15 ... Ink supply path as a liquid supply path, 20 ... Nozzle plate, 21 ... Nozzle Opening, 30 ... protective substrate, 31 ... piezoelectric element holding portion, 32 ... reservoir portion, 33 ... through hole, 35 ... reservoir forming substrate, 36 ... girders, 40 ... compliance substrate, 41 ... sealing film as pressure absorbing member, 42 ... fixing plate, 43 ... opening, 50 ... elastic film, 55 ... insulator film, 56 ... adhesive, 60 ... lower electrode, 70 ... piezoelectric layer, 80 ... upper electrode, 90 ... removal Cathode electrode, 100 ... manifold, 200 ... driving circuit, 210 ... flexible substrate as a wiring substrate, 220 ... opening, 230 ... ink introduction port, 300 ... piezoelectric element, 400 ... heat conduction member, 1000 ... ink jet recording apparatus.

Claims (20)

A liquid ejecting head in which a plurality of nozzle openings for ejecting liquid are arranged side by side,
A flow path forming substrate having a liquid supply path for supplying the liquid to a pressure generating chamber communicating with the nozzle opening;
A piezoelectric element formed on the flow path forming substrate and changing the pressure of the pressure generating chamber;
A drive circuit connected to the piezoelectric element;
A piezoelectric element holding portion for protecting the piezoelectric element, and a protective substrate having a through-hole in which the drive circuit is disposed;
A wiring board connected to the drive circuit;
A reservoir forming substrate having an opening in which the wiring substrate is disposed and covering the through hole;
A liquid ejecting head comprising: the protective substrate; and a reservoir portion partially formed on the reservoir forming substrate. A liquid ejecting head in which a plurality of nozzle openings for ejecting liquid are arranged side by side,
A flow path forming substrate having a liquid supply path for supplying the liquid to a pressure generating chamber communicating with the nozzle opening;
A piezoelectric element formed on the flow path forming substrate and changing the pressure of the pressure generating chamber;
A drive circuit connected to the piezoelectric element;
A piezoelectric element holding portion for protecting the piezoelectric element, and a protective substrate having a through-hole in which the drive circuit is disposed;
A plurality of wiring boards connected to the driving circuit, the wiring boards arranged at positions sandwiching the driving circuit;
A reservoir forming substrate covering the through hole;
A liquid ejecting head comprising: the protective substrate; and a reservoir portion partially formed on the reservoir forming substrate. The liquid ejecting head according to claim 2 , further comprising:
The reservoir forming substrate has an opening in which the wiring substrate is disposed.
A liquid jet head characterized by that. The liquid ejecting head according to claim 1 , further comprising:
A plurality of the wiring boards, comprising a plurality of the wiring boards arranged at positions sandwiching the drive circuit;
A liquid jet head characterized by that. The liquid ejecting head according to any one of claims 1 to 4 , further comprising:
The wiring board is connected to the drive circuit via an electrode formed on the flow path forming substrate,
A liquid jet head characterized by that. In the liquid jet head according to any one of claims 1 to 5 ,
The reservoir unit is supplied with the liquid from the inlet,
A liquid jet head characterized by that. The liquid ejecting head according to any one of claims 1 to 6, further
The piezoelectric element holding unit protects the piezoelectric element for each piezoelectric element.
A liquid jet head characterized by that. The liquid ejecting head according to any one of claims 1 to 7, further
A liquid ejecting head comprising a pressure absorbing member that seals the reservoir and absorbs pressure fluctuations in the reservoir. A liquid ejecting head in which a plurality of nozzle openings for ejecting liquid are arranged side by side,
A flow path forming substrate having a liquid supply path for supplying the liquid to a pressure generating chamber communicating with the nozzle opening;
A piezoelectric element formed on the flow path forming substrate and changing the pressure of the pressure generating chamber;
A protective substrate having a piezoelectric element holding portion that protects the piezoelectric element and a through-hole that exposes a lead electrode drawn from the piezoelectric element;
A drive circuit housed in the through hole and connected to the lead electrode;
A reservoir part partially formed on a reservoir forming substrate on the through hole;
A compliance substrate that seals the reservoir and absorbs pressure fluctuations of the reservoir by a pressure absorbing member;
A wiring board connected to the drive circuit,
The liquid ejecting head, wherein the wiring substrate is inserted into an opening provided in the reservoir forming substrate. A liquid ejecting head in which a plurality of nozzle openings for ejecting liquid are arranged side by side,
A flow path forming substrate having a liquid supply path for supplying the liquid to a pressure generating chamber communicating with the nozzle opening;
A piezoelectric element formed on the flow path forming substrate and changing the pressure of the pressure generating chamber;
A protective substrate having a piezoelectric element holding portion that protects the piezoelectric element and a through-hole that exposes a lead electrode drawn from the piezoelectric element;
A drive circuit housed in the through hole and connected to the lead electrode;
A reservoir part partially formed on a reservoir forming substrate on the through hole;
A compliance substrate that seals the reservoir and absorbs pressure fluctuations of the reservoir by a pressure absorbing member;
A plurality of wiring boards connected to the drive circuit,
The liquid jet head, wherein the plurality of wiring boards are arranged at positions sandwiching the drive circuit. A liquid ejecting head in which a plurality of nozzle openings for ejecting liquid are arranged side by side,
A flow path forming substrate having a liquid supply path for supplying the liquid to a pressure generating chamber communicating with the nozzle opening;
A piezoelectric element formed on the flow path forming substrate and changing the pressure of the pressure generating chamber;
A protective substrate having a piezoelectric element holding portion that protects the piezoelectric element and a through-hole that exposes a lead electrode drawn from the piezoelectric element;
A drive circuit housed in the through hole and connected to the lead electrode;
A reservoir part partially formed on a reservoir forming substrate on the through hole;
A compliance substrate that seals the reservoir and absorbs pressure fluctuations of the reservoir by a pressure absorbing member;
A wiring board connected to the drive circuit,
The liquid ejecting head, wherein the driving circuit and the wiring board are connected via an electrode formed on the flow path forming substrate. A liquid ejecting head in which a plurality of nozzle openings for ejecting liquid are arranged side by side,
A flow path forming substrate having a liquid supply path for supplying the liquid to a pressure generating chamber communicating with the nozzle opening;
A piezoelectric element formed on the flow path forming substrate and changing the pressure of the pressure generating chamber;
A protective substrate having a piezoelectric element holding portion that protects the piezoelectric element and a through-hole that exposes a lead electrode drawn from the piezoelectric element;
A drive circuit housed in the through hole and connected to the lead electrode;
A reservoir part partially formed on a reservoir forming substrate on the through hole;
A compliance substrate that seals the reservoir and absorbs pressure fluctuations of the reservoir by a pressure absorbing member;
The liquid ejecting head, wherein the protective substrate has a hole forming a part of the reservoir portion. A liquid ejecting head in which a plurality of nozzle openings for ejecting liquid are arranged side by side,
A flow path forming substrate having a liquid supply path for supplying the liquid to a pressure generating chamber communicating with the nozzle opening;
A piezoelectric element formed on the flow path forming substrate and changing the pressure of the pressure generating chamber;
A protective substrate having a piezoelectric element holding portion that protects the piezoelectric element and a through-hole that exposes a lead electrode drawn from the piezoelectric element;
A drive circuit housed in the through hole and connected to the lead electrode;
A reservoir part partially formed on a reservoir forming substrate on the through hole;
A compliance substrate that seals the reservoir and absorbs pressure fluctuations of the reservoir by a pressure absorbing member;
The liquid ejecting head according to claim 1, wherein the protective substrate integrally includes a piezoelectric element holding portion that accommodates the plurality of piezoelectric elements in a region corresponding to the plurality of piezoelectric elements. The liquid ejecting head according to any one of claims 10 to 13 , further comprising:
Comprising a wiring board connected to the drive circuit;
The liquid ejecting head, wherein the wiring substrate is inserted into an opening provided in the reservoir forming substrate. The liquid ejecting head according to any one of claims 9 to 14 , wherein the liquid ejecting head according to any one of claims 9 to 14 (excluding claim 10 and a claim quoting claim 10) is further provided.
Comprising a plurality of wiring boards connected to the drive circuit;
The liquid jet head, wherein the plurality of wiring boards are arranged at positions sandwiching the drive circuit. The liquid ejecting head according to any one of claims 9 to 15 , wherein the liquid ejecting head according to any one of claims 9 to 15 (excluding claim 11 and a claim quoting claim 11) is further provided.
Comprising a wiring board connected to the drive circuit;
The liquid ejecting head, wherein the driving circuit and the wiring board are connected via an electrode formed on the flow path forming substrate. The liquid ejecting head according to any one of Claims 9 to 16 ,
The liquid ejecting head , wherein the reservoir is supplied with liquid from an introduction port. In the liquid ejecting head according to any one of claims 9 to 17 , except for claim 12 and a claim that cites claim 12 .
The liquid ejecting head, wherein the protective substrate has a hole forming a part of the reservoir portion. The liquid ejecting head according to any one of claims 9 to 18 (except for claim 13 and a claim that cites claim 13) .
The liquid ejecting head according to claim 1, wherein the protective substrate includes a piezoelectric element holding portion that accommodates the plurality of piezoelectric elements for each of the piezoelectric elements. A liquid ejecting apparatus comprising the liquid ejecting head according to any one of claims 1 to 19 .

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