JP6244667B2 - 量子カスケードレーザ - Google Patents
量子カスケードレーザ Download PDFInfo
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- 239000004065 semiconductor Substances 0.000 claims description 133
- 238000005253 cladding Methods 0.000 claims description 87
- 239000000758 substrate Substances 0.000 claims description 51
- 230000000903 blocking effect Effects 0.000 claims description 49
- 239000000463 material Substances 0.000 claims description 39
- 230000003287 optical effect Effects 0.000 claims description 27
- 238000002347 injection Methods 0.000 claims description 26
- 239000007924 injection Substances 0.000 claims description 26
- 229910004541 SiN Inorganic materials 0.000 claims description 11
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 11
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 11
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 11
- 239000000969 carrier Substances 0.000 claims description 9
- 239000004642 Polyimide Substances 0.000 claims description 7
- 229920001721 polyimide Polymers 0.000 claims description 7
- 230000010355 oscillation Effects 0.000 description 32
- 238000001228 spectrum Methods 0.000 description 26
- 238000004519 manufacturing process Methods 0.000 description 20
- 238000000034 method Methods 0.000 description 20
- 238000005530 etching Methods 0.000 description 16
- 150000001875 compounds Chemical class 0.000 description 13
- 239000013078 crystal Substances 0.000 description 13
- 230000017525 heat dissipation Effects 0.000 description 13
- 229910052804 chromium Inorganic materials 0.000 description 12
- 229910052742 iron Inorganic materials 0.000 description 12
- 229920002120 photoresistant polymer Polymers 0.000 description 12
- 229910052719 titanium Inorganic materials 0.000 description 12
- 229910052723 transition metal Inorganic materials 0.000 description 12
- 150000003624 transition metals Chemical class 0.000 description 12
- 230000007704 transition Effects 0.000 description 9
- 230000007423 decrease Effects 0.000 description 8
- 238000004544 sputter deposition Methods 0.000 description 8
- 229910000530 Gallium indium arsenide Inorganic materials 0.000 description 7
- 230000002093 peripheral effect Effects 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- 230000004888 barrier function Effects 0.000 description 6
- 238000001312 dry etching Methods 0.000 description 6
- 238000001039 wet etching Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 238000000206 photolithography Methods 0.000 description 5
- 238000004364 calculation method Methods 0.000 description 4
- 230000006872 improvement Effects 0.000 description 4
- 230000031700 light absorption Effects 0.000 description 4
- 238000004528 spin coating Methods 0.000 description 4
- 238000007740 vapor deposition Methods 0.000 description 4
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 239000002019 doping agent Substances 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 230000000737 periodic effect Effects 0.000 description 3
- 238000002310 reflectometry Methods 0.000 description 3
- 239000011800 void material Substances 0.000 description 3
- 230000002159 abnormal effect Effects 0.000 description 2
- 230000003667 anti-reflective effect Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000003745 diagnosis Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000005274 electronic transitions Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000012994 industrial processing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000002040 relaxant effect Effects 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
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- H01S5/00—Semiconductor lasers
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- H01S5/34—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
- H01S5/3401—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers having no PN junction, e.g. unipolar lasers, intersubband lasers, quantum cascade lasers
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- H01S5/3401—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers having no PN junction, e.g. unipolar lasers, intersubband lasers, quantum cascade lasers
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- H01S5/34—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
- H01S5/343—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
- H01S5/34313—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser with a well layer having only As as V-compound, e.g. AlGaAs, InGaAs
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- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
- H01S5/2205—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers
- H01S5/2213—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers based on polyimide or resin
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- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
- H01S5/2205—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers
- H01S5/2222—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers having special electric properties
- H01S5/2224—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers having special electric properties semi-insulating semiconductors
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Description
図1に、第1実施形態に係る量子カスケードレーザ1を示す。図1には、量子カスケードレーザ1の外形と共に、導波路に垂直な面(後述の基準方向Axと法線方向Nxとによって規定される面)における量子カスケードレーザ1の内部の構成が示されている。量子カスケードレーザ1は、半導体層2と、下部電極3と、上部電極4とを備える。下部電極3は、半導体層2の裏面2bに設けられる。上部電極4は、半導体層2の主面2aに設けられる。量子カスケードレーザ1の半導体層2は、n型半導体基板5と、メサ導波路Gと、電流ブロック層10a、電流ブロック層10bと、を備える。メサ導波路Gは、n型半導体基板5の主面5aに設けられている。n型半導体基板5の裏面(主面5aとは反対側の面であって、半導体層2の裏面2b)には、下部電極3が接続されている。メサ導波路Gは、n型下部クラッド層6、発光領域7と、n型上部クラッド層8と、n型コンタクト層9とを備える。メサ導波路Gは、基準方向Axにおける量子カスケードレーザ1の中央部に設けられている。基準方向Axは、主面5aに平行であってメサ導波路Gの延びる方向に直交する。
基板:n―InP、厚さ100μm。
下部クラッド層:n―InP、厚さ0.5μm。
コア領域:発振波長7.8μmに対応した活性層を有し、AlInAs/GaInAs超格子列で構成。厚さ1.4337μm。
上部クラッド層:n―InP、厚さ3μm。
コンタクト層:n―GaInAs、厚さ0.1μm。
埋め込み領域:Fe―InP、厚さ1.4337μm(コア領域と同じ厚さ)。
電流ブロック層:Fe―InP、厚さ5.0337μm(メサ導波路と同じ高さ)。
第1実施形態では、半絶縁性の半導体の埋め込み領域が発光領域のみに形成された構造を示したが、これには限定されず、埋め込み領域が発光領域外に延長されて形成された構造であっても良い。換言すれば、埋め込み領域は、発光領域から突出するように、n型半導体基板の主面の法線方向と、法線方向の逆方向とに延びている構成であっても良い。
以上の第1実施形態及び第2実施形態では、電流狭窄構造として、半絶縁性の半導体の電流ブロック層から構成されるBH構造を用いた例を示したが、電流狭窄構造はこれに限定されず、他の任意の構造を使用できる。例えば、図8の量子カスケードレーザ105に示されるように、電流狭窄構造として、半絶縁性の半導体の電流ブロック層10a、電流ブロック層10bに替えて、誘電体絶縁膜11a、誘電体絶縁膜11bがメサ導波路Gの側面Ga、側面Gbのそれぞれに形成された構成であっても良い。
Claims (9)
- n型半導体基板と、
メサ導波路と、
二つの電流ブロック層と、
を備え、
前記メサ導波路は、前記n型半導体基板の主面に設けられ、
前記二つの電流ブロック層のそれぞれは、前記メサ導波路の二つの側面のそれぞれに設けられ、
前記二つの側面は、何れも、基準方向と交差しており、
前記基準方向は、前記主面に平行であって前記メサ導波路の延びる方向に直交し、
前記メサ導波路は、発光領域と、n型上部クラッド層と、を備え、
前記n型上部クラッド層は、前記主面の法線方向において前記発光領域の上部に設けられ、
前記発光領域は、複数のコア領域と、複数の埋め込み領域と、を備え、前記主面と前記n型上部クラッド層との間に設けられ、
前記複数のコア領域は、前記主面の上において、前記基準方向に沿って順に設けられ、
前記複数の埋め込み領域は、前記主面の上において、前記基準方向に沿って順に設けられ、
前記コア領域と前記埋め込み領域とは、前記主面の上において、前記基準方向に沿って交互に設けられ、
前記複数のコア領域のうち、前記基準方向における前記メサ導波路の中心部の側にあるコア領域は、前記メサ導波路の前記側面の側にあるコア領域よりも前記基準方向において大きい幅を備え、
前記複数のコア領域は、互いに前記埋め込み領域を介して光学的に結合し、
前記複数のコア領域を含む前記発光領域は、一つの光導波路を形成し、
前記n型上部クラッド層は、前記複数のコア領域に共通に設けられている、
ことを特徴とする、量子カスケードレーザ。 - 前記基準方向における前記コア領域の幅は、0.5μm〜10μmの範囲にある、ことを特徴とする請求項1に記載の量子カスケードレーザ。
- 前記基準方向における前記埋め込み領域の幅は、0.5μm〜10μmの範囲にある、ことを特徴とする請求項1又は請求項2に記載の量子カスケードレーザ。
- 前記発光領域は、第1コア領域と、二つの第2コア領域と、を備え、
前記二つの第2コア領域は、前記基準方向において前記第1コア領域の両側に設けられ、
前記第1コア領域は、前記中心部に位置し、前記二つの第2コア領域の間に設けられ、
前記基準方向における前記二つの第2コア領域のそれぞれの幅は、前記基準方向における前記第1コア領域の幅の0.125倍以上で且つ1倍未満の範囲にある、
ことを特徴とする請求項1〜3の何れか一項に記載の量子カスケードレーザ。 - 前記電流ブロック層は、誘電体絶縁膜である、
ことを特徴とする請求項1〜4の何れか一項に記載の量子カスケードレーザ。 - 前記誘電体絶縁膜の材料は、SiO2、SiON、SiN、アルミナ、BCB、ポリイミドのうちの何れかである、
ことを特徴とする請求項5に記載の量子カスケードレーザ。 - 前記電流ブロック層の材料は、半絶縁性の第1の半導体である、
ことを特徴とする請求項1〜4の何れか一項に記載の量子カスケードレーザ。 - 前記埋め込み領域の材料は、半絶縁性の第2の半導体である、
ことを特徴とする請求項1〜7の何れか一項に記載の量子カスケードレーザ。 - 前記複数のコア領域のそれぞれは、複数の活性層と、複数の注入層と、を備え、
前記複数の活性層のそれぞれは、発光を生じ、
前記複数の注入層のそれぞれは、隣接する前記複数の活性層のそれぞれにキャリアを注入し、
前記複数の活性層のそれぞれと、前記複数の注入層のそれぞれとは、前記主面の上に向けて交互に設けられている、
ことを特徴とする請求項1〜8の何れか一項に記載の量子カスケードレーザ。
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JP2013115868A JP6244667B2 (ja) | 2013-05-31 | 2013-05-31 | 量子カスケードレーザ |
US14/292,250 US9240675B2 (en) | 2013-05-31 | 2014-05-30 | Quantum cascade laser |
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US9991677B2 (en) | 2014-05-13 | 2018-06-05 | California Institute Of Technology | Index-coupled distributed-feedback semiconductor quantum cascade lasers fabricated without epitaxial regrowth |
US9438011B2 (en) * | 2014-08-12 | 2016-09-06 | California Institute Of Technology | Single-mode, distributed feedback interband cascade lasers |
JP6464895B2 (ja) * | 2015-04-03 | 2019-02-06 | 住友電気工業株式会社 | 量子カスケード半導体レーザ |
JP6597037B2 (ja) * | 2015-08-06 | 2019-10-30 | 住友電気工業株式会社 | 量子カスケードレーザデバイス |
JP6720506B2 (ja) * | 2015-11-16 | 2020-07-08 | 住友電気工業株式会社 | 量子カスケードレーザデバイス |
WO2017123309A2 (en) * | 2016-01-06 | 2017-07-20 | Northwestern University | Monolithical widely tunable quantum cascade laser devices |
EP3639332A4 (en) * | 2017-06-13 | 2021-03-17 | Nuburu, Inc. | LASER SYSTEM WITH A COMBINATION OF HIGH DENSITY WAVELENGTH RAYS |
JP6818645B2 (ja) * | 2017-07-05 | 2021-01-20 | 浜松ホトニクス株式会社 | 流体分析装置 |
DE102019102499A1 (de) * | 2019-01-31 | 2020-08-06 | Forschungsverbund Berlin E.V. | Vorrichtung zur Erzeugung von Laserstrahlung |
US11456573B2 (en) | 2019-10-02 | 2022-09-27 | California Institute Of Technology | Tapered-grating single mode lasers and method of manufacturing |
JP7411483B2 (ja) * | 2020-04-02 | 2024-01-11 | 浜松ホトニクス株式会社 | 量子カスケードレーザ素子の製造方法 |
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US4751711A (en) * | 1985-08-16 | 1988-06-14 | Spectra Diode Laboratories, Inc. | Asymmetric offset stripe laser for emission in a single lobe |
US4727557A (en) * | 1985-12-30 | 1988-02-23 | Xerox Corporation | Phased array semiconductor lasers fabricated from impurity induced disordering |
US4860298A (en) * | 1988-04-12 | 1989-08-22 | Dan Botez | Phased-locked array of semiconductor lasers using closely spaced antiguides |
US5953356A (en) * | 1997-11-04 | 1999-09-14 | Wisconsin Alumni Research Foundation | Intersubband quantum box semiconductor laser |
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US6148012A (en) * | 1998-10-21 | 2000-11-14 | Lucent Technologies Inc. | Multiple wavelength quantum cascade light source |
US7826509B2 (en) * | 2006-12-15 | 2010-11-02 | President And Fellows Of Harvard College | Broadly tunable single-mode quantum cascade laser sources and sensors |
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