JP6244307B2 - 表面下欠陥検査用のサンプル作製のためのシステム及び方法 - Google Patents

表面下欠陥検査用のサンプル作製のためのシステム及び方法 Download PDF

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Publication number
JP6244307B2
JP6244307B2 JP2014544853A JP2014544853A JP6244307B2 JP 6244307 B2 JP6244307 B2 JP 6244307B2 JP 2014544853 A JP2014544853 A JP 2014544853A JP 2014544853 A JP2014544853 A JP 2014544853A JP 6244307 B2 JP6244307 B2 JP 6244307B2
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Japan
Prior art keywords
defect
marking
result file
electron microscope
ion beam
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JP2014544853A
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Japanese (ja)
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JP2014534452A (ja
JP2014534452A5 (enExample
Inventor
セシリア カンポキアロ
セシリア カンポキアロ
ホン シャオ
ホン シャオ
リート マイケル ヴァン
リート マイケル ヴァン
ベンジャミン クラーク
ベンジャミン クラーク
ハルシュ シンハ
ハルシュ シンハ
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KLA Corp
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KLA Corp
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Publication of JP2014534452A5 publication Critical patent/JP2014534452A5/ja
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/26—Electron or ion microscopes; Electron or ion diffraction tubes
    • H01J37/28—Electron or ion microscopes; Electron or ion diffraction tubes with scanning beams
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/31—Electron-beam or ion-beam tubes for localised treatment of objects for cutting or drilling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/26—Electron or ion microscopes
    • H01J2237/28—Scanning microscopes
    • H01J2237/2813—Scanning microscopes characterised by the application
    • H01J2237/2817—Pattern inspection

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2014544853A 2011-11-29 2012-11-28 表面下欠陥検査用のサンプル作製のためのシステム及び方法 Active JP6244307B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201161564733P 2011-11-29 2011-11-29
US61/564,733 2011-11-29
US13/687,244 US9318395B2 (en) 2011-11-29 2012-11-28 Systems and methods for preparation of samples for sub-surface defect review
US13/687,244 2012-11-28
PCT/US2012/066887 WO2013082181A1 (en) 2011-11-29 2012-11-28 Systems and methods for preparation of samples for sub-surface defect review

Publications (3)

Publication Number Publication Date
JP2014534452A JP2014534452A (ja) 2014-12-18
JP2014534452A5 JP2014534452A5 (enExample) 2016-01-21
JP6244307B2 true JP6244307B2 (ja) 2017-12-06

Family

ID=48467234

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014544853A Active JP6244307B2 (ja) 2011-11-29 2012-11-28 表面下欠陥検査用のサンプル作製のためのシステム及び方法

Country Status (8)

Country Link
US (1) US9318395B2 (enExample)
EP (1) EP2789008A4 (enExample)
JP (1) JP6244307B2 (enExample)
KR (1) KR101887730B1 (enExample)
IL (1) IL232703B (enExample)
SG (1) SG11201402475YA (enExample)
TW (1) TWI608232B (enExample)
WO (1) WO2013082181A1 (enExample)

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CN108061736B (zh) * 2017-11-14 2020-11-13 东旭光电科技股份有限公司 使用反射电子探针对玻璃缺陷进行分析的方法
CN116087733A (zh) * 2023-01-16 2023-05-09 长鑫存储技术有限公司 半导体结构上失效点的定位方法及治具的制作方法

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Also Published As

Publication number Publication date
TW201333457A (zh) 2013-08-16
US9318395B2 (en) 2016-04-19
KR101887730B1 (ko) 2018-08-10
JP2014534452A (ja) 2014-12-18
SG11201402475YA (en) 2014-06-27
WO2013082181A1 (en) 2013-06-06
US20130137193A1 (en) 2013-05-30
EP2789008A1 (en) 2014-10-15
TWI608232B (zh) 2017-12-11
IL232703B (en) 2018-03-29
KR20140108662A (ko) 2014-09-12
IL232703A0 (en) 2014-07-31
EP2789008A4 (en) 2015-07-22

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