JP6243699B2 - 脆性材料基板の分断装置 - Google Patents

脆性材料基板の分断装置 Download PDF

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Publication number
JP6243699B2
JP6243699B2 JP2013221702A JP2013221702A JP6243699B2 JP 6243699 B2 JP6243699 B2 JP 6243699B2 JP 2013221702 A JP2013221702 A JP 2013221702A JP 2013221702 A JP2013221702 A JP 2013221702A JP 6243699 B2 JP6243699 B2 JP 6243699B2
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JP
Japan
Prior art keywords
substrate
surface layer
break bar
substrate body
breaking
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2013221702A
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English (en)
Japanese (ja)
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JP2015083336A (ja
Inventor
佑磨 岩坪
佑磨 岩坪
村上　健二
健二 村上
武田　真和
真和 武田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
Original Assignee
Mitsuboshi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Priority to JP2013221702A priority Critical patent/JP6243699B2/ja
Priority to TW103121421A priority patent/TWI623402B/zh
Priority to CN201410290999.8A priority patent/CN104552614B/zh
Priority to KR1020140104287A priority patent/KR102232365B1/ko
Publication of JP2015083336A publication Critical patent/JP2015083336A/ja
Application granted granted Critical
Publication of JP6243699B2 publication Critical patent/JP6243699B2/ja
Active legal-status Critical Current
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/225—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising for scoring or breaking, e.g. tiles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/222—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising by pressing, e.g. presses
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/037—Controlling or regulating
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/027—Scoring tool holders; Driving mechanisms therefor
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mining & Mineral Resources (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Dicing (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
JP2013221702A 2013-10-25 2013-10-25 脆性材料基板の分断装置 Active JP6243699B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2013221702A JP6243699B2 (ja) 2013-10-25 2013-10-25 脆性材料基板の分断装置
TW103121421A TWI623402B (zh) 2013-10-25 2014-06-20 脆性材料基板之分斷方法及分斷裝置
CN201410290999.8A CN104552614B (zh) 2013-10-25 2014-06-25 脆性材料基板的切断方法及切断装置
KR1020140104287A KR102232365B1 (ko) 2013-10-25 2014-08-12 취성 재료 기판의 분단방법 및 분단장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013221702A JP6243699B2 (ja) 2013-10-25 2013-10-25 脆性材料基板の分断装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2016191692A Division JP2017001180A (ja) 2016-09-29 2016-09-29 脆性材料基板の表面層破断装置

Publications (2)

Publication Number Publication Date
JP2015083336A JP2015083336A (ja) 2015-04-30
JP6243699B2 true JP6243699B2 (ja) 2017-12-06

Family

ID=53047240

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013221702A Active JP6243699B2 (ja) 2013-10-25 2013-10-25 脆性材料基板の分断装置

Country Status (4)

Country Link
JP (1) JP6243699B2 (zh)
KR (1) KR102232365B1 (zh)
CN (1) CN104552614B (zh)
TW (1) TWI623402B (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6528581B2 (ja) * 2015-07-28 2019-06-12 三星ダイヤモンド工業株式会社 ブレーク装置、基板のブレーク方法、および、ブレーク装置の基板載置部用部材
JP6627326B2 (ja) * 2015-08-20 2020-01-08 三星ダイヤモンド工業株式会社 ブレイク装置
WO2018066508A1 (ja) * 2016-10-05 2018-04-12 日本電気硝子株式会社 ガラス樹脂積層体の製造方法及びガラス樹脂積層体
EP3410473B1 (de) * 2017-05-30 2021-02-24 Infineon Technologies AG Anordnung und verfahren zum vereinzeln von substraten
CN111263974A (zh) * 2017-10-27 2020-06-09 三星钻石工业股份有限公司 附金属膜衬底的分断方法
JP6949371B2 (ja) * 2017-12-15 2021-10-13 三星ダイヤモンド工業株式会社 基板分断装置
CN108724482B (zh) * 2018-08-01 2022-05-27 上海祖强能源有限公司 一种施压装置
CN111976030B (zh) * 2020-09-10 2022-01-14 天能炭素(江苏)有限公司 一种高吸附性活性炭制备加工系统

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2766123B2 (ja) * 1992-05-27 1998-06-18 鹿児島日本電気株式会社 ガラス基板のプレス式切断方法
JPH08194200A (ja) * 1995-01-17 1996-07-30 Ookubo Seisakusho:Kk 液晶セルの分断方法及び装置
US6402004B1 (en) * 1998-09-16 2002-06-11 Hoya Corporation Cutting method for plate glass mother material
TWI290128B (en) * 2002-04-01 2007-11-21 Mitsuboshi Diamond Ind Co Ltdl Parting method for fragile substrate and parting device using the method
TW200408061A (en) * 2002-07-02 2004-05-16 Mitsuboshi Diamond Ind Co Ltd Substrate slicing system for sealed substrates and the substrate slicing method
JP4210981B2 (ja) * 2002-09-27 2009-01-21 住友電気工業株式会社 劈開装置及び劈開方法
JP2006117480A (ja) * 2004-10-22 2006-05-11 Citizen Seimitsu Co Ltd ガラスブレーカー用ワークテーブル、及びその製造方法、及びそれを備えた自動ガラスブレーカー
JP2006192753A (ja) * 2005-01-14 2006-07-27 Matsushita Electric Ind Co Ltd 樹脂モールドセラミック基板の分割方法
JP2008201629A (ja) * 2007-02-21 2008-09-04 Epson Imaging Devices Corp 電気光学装置の製造方法、基板の分断方法、及び、基板分断装置
JP5192977B2 (ja) * 2008-10-10 2013-05-08 三星ダイヤモンド工業株式会社 貼り合せ基板のスクライブ方法
JP2011145489A (ja) * 2010-01-14 2011-07-28 Casio Computer Co Ltd 表示装置の製造方法
JP5216040B2 (ja) 2010-03-31 2013-06-19 三星ダイヤモンド工業株式会社 脆性材料基板の分断方法
JP5170195B2 (ja) * 2010-09-24 2013-03-27 三星ダイヤモンド工業株式会社 樹脂付き脆性材料基板の分割方法
JP5187421B2 (ja) 2010-11-30 2013-04-24 三星ダイヤモンド工業株式会社 脆性材料基板のブレイク方法
JP5244202B2 (ja) * 2011-01-27 2013-07-24 三星ダイヤモンド工業株式会社 脆性材料基板のスクライブ方法
KR20120107722A (ko) * 2011-03-22 2012-10-04 삼성디스플레이 주식회사 기판 절단 장치 및 그것을 이용한 기판 절단 방법
JP5210407B2 (ja) * 2011-04-06 2013-06-12 三星ダイヤモンド工業株式会社 ブレイク装置およびブレイク方法
JP5210409B2 (ja) * 2011-04-06 2013-06-12 三星ダイヤモンド工業株式会社 ブレイク装置
JP5548172B2 (ja) * 2011-08-26 2014-07-16 三星ダイヤモンド工業株式会社 脆性材料基板ブレイク装置
JP5824365B2 (ja) * 2012-01-16 2015-11-25 三星ダイヤモンド工業株式会社 脆性材料基板のブレイク方法
JP6119551B2 (ja) * 2013-10-16 2017-04-26 三星ダイヤモンド工業株式会社 弾性支持板、破断装置及び分断方法
JP6115438B2 (ja) * 2013-10-16 2017-04-19 三星ダイヤモンド工業株式会社 破断装置及び分断方法
JP6213134B2 (ja) * 2013-10-16 2017-10-18 三星ダイヤモンド工業株式会社 弾性支持板、破断装置及び分断方法
JP6119550B2 (ja) * 2013-10-16 2017-04-26 三星ダイヤモンド工業株式会社 エキスパンダ、破断装置及び分断方法

Also Published As

Publication number Publication date
TW201515799A (zh) 2015-05-01
TWI623402B (zh) 2018-05-11
JP2015083336A (ja) 2015-04-30
KR102232365B1 (ko) 2021-03-26
CN104552614A (zh) 2015-04-29
KR20150048024A (ko) 2015-05-06
CN104552614B (zh) 2018-02-02

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