JP6240866B2 - ボンディング装置及びボンディングツールの着地点位置を推定する方法 - Google Patents
ボンディング装置及びボンディングツールの着地点位置を推定する方法 Download PDFInfo
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Description
Claims (8)
- ボンディング装置であって、
ボンディングヘッドに取り付けられるボンディングツールと、
前記ボンディングヘッドをXY方向に摺動自在に移動させるステージと、
前記ボンディングツールをXY平面に垂直なZ方向に自在に移動させるZ移動機構と、
前記ボンディングツールの下方に配置され、前記ボンディングツールに関する像を受け止める平面物体と、
前記ボンディングツール、及び位置決めの基準となる基準パターンを有する前記平面物体を斜め上方から観測する斜め光学系と、
前記ボンディングツールと所定のオフセット距離だけ離れて前記ボンディングヘッドに取り付けられる位置決めカメラと、
前記ボンディングツールの着地点位置を推定する処理を実行する制御部と、
を備え、
前記制御部は、
前記平面物体における前記基準パターンの位置を前記位置決めカメラで検出し、前記検出された前記基準パターンの位置から前記所定のオフセット距離だけ前記ボンディングツールを移動させる工程と、
次に、前記ボンディングツールをZ方向に沿って前記平面物体に接触しない範囲で所定の第1高さ位置まで下降させる工程と、
前記第1高さ位置において、前記斜め光学系で、前記ボンディングツールの先端部と、前記平面物体が受け止める前記ボンディングツールの先端部の前記像とを撮像し、撮像面上における前記ボンディングツールの先端部の位置A11と前記ボンディングツールの先端部の前記像の位置をA12として算出する工程と、
前記ボンディングツールを前記平面物体に接触しない範囲で前記第1高さ位置よりも低い第2高さ位置まで下降させる工程と、
前記第2高さ位置において、前記斜め光学系で、前記ボンディングツールの先端部と、前記平面物体が受け止める前記ボンディングツールの先端部の前記像とを撮像し、前記撮像面上における前記ボンディングツールの先端部の位置A21と前記ボンディングツールの先端部の前記像の位置をA22として算出する工程と、
算出されたA11,A12,A21,A22の4つの位置データと、前記第1高さ位置と前記第2高さ位置とに基づいて、前記平面物体に対する前記ボンディングツールの前記着地点位置を推定する工程と、
前記基準パターンの位置と前記推定された着地点位置の差分から、ボンディングにおいて生じるボンディングオフセットの変化を検知する工程と、
前記制御部は、前記検知したボンディングオフセットの変化量をフィードバックしてボンディングを行う工程と、
を実行可能に構成される、ボンディング装置。 - 請求項1に記載のボンディング装置において、
前記平面物体は、ミラーであり、
前記ミラーが受け止める前記ボンディングツールに関する前記像は、前記ミラーに映る前記ボンディングツールの虚像である、ボンディング装置。 - 請求項1に記載のボンディング装置において、
前記平面物体は、鏡面状または拡散面状の表面にパターンを有する前記ボンディング対象物であるボンディング装置。 - 請求項1から3のいずれか1に記載のボンディング装置において、
前記ボンディングツールを挟んで前記斜め光学系と反対側の斜め上方から照明する照明装置を備え、
前記平面物体は、前記照明装置によって照明された前記ボンディングツールの影の像を受け止める平板であり、
前記斜め光学系は、前記ボンディングツールの先端部と、前記平面物体が受け止める前記ボンディングツールの先端部の前記影の像とを撮像する、ボンディング装置。 - 請求項1から4のいずれか1に記載のボンディング装置において、
前記ボンディングツールは、ワイヤボンディング処理を行うキャピラリ、またはダイボンディング処理を行うツール、またはフリップチップ実装処理を行うツールのいずれか1つである、ボンディング装置。 - 請求項1から4のいずれか1に記載のボンディング装置において、
前記斜め光学系は、
前記ボンディングツールと前記平面物体に対しシャインプルーフ条件を満たすレンズと投影面とを有する前段光学系を含み、
前記前段光学系の投影面上の像をテレセントリック光学系で撮像する、ボンディング装置。 - 請求項1から4のいずれか1に記載のボンディング装置において、
前記斜め光学系は、
前記ボンディングツールの先端部と、前記平面物体が受け止める前記ボンディングツールの先端部の前記像とのいずれか一方について、互いの光路長を同じとなるように調整する光路長補償光学素子を用いる、ボンディング装置。 - ボンディングツールの着地点位置を推定する方法であって、
ボンディングヘッドに取り付けられるボンディングツールと、
前記ボンディングヘッドをXY方向に摺動自在に移動させるステージと、
前記ボンディングツールをXY平面に垂直なZ方向に自在に移動させるZ移動機構と、
前記ボンディングツールの下方に配置され、前記ボンディングツールに関する像を受け止める平面物体と、
前記ボンディングツール、及び位置決めの基準となる基準パターンを有する前記平面物体を斜め上方から観測する斜め光学系と、
前記ボンディングツールと所定のオフセット距離だけ離れて前記ボンディングヘッドに取り付けられる位置決めカメラと、
前記ボンディングツールの着地点位置を推定する処理を実行する制御部と、
を備えるボンディング装置を準備する工程と、
前記制御部は、
前記平面物体における前記基準パターンの位置を前記位置決めカメラで検出し、前記検出された前記基準パターンの位置から前記所定のオフセット距離だけ前記ボンディングツールを移動させる工程と、
次に、前記ボンディングツールをZ方向に沿って前記平面物体に接触しない範囲で所定の第1高さ位置まで下降させる工程と、
前記第1高さ位置において、前記斜め光学系が備えるカメラで、前記ボンディングツールの先端部と、前記平面物体が受け止める前記ボンディングツールの先端部の前記像とを撮像し、撮像面上における前記ボンディングツールの先端部の位置A11と前記ボンディングツールの先端部の前記像の位置をA12として算出する工程と、
前記制御部により、前記ボンディングツールを前記平面物体に接触しない範囲で前記第1高さ位置よりも低い第2高さ位置まで下降させる工程と、
前記第2高さ位置において、前記斜め光学系が備えるにカメラで、前記ボンディングツールの先端部と、前記平面物体が受け止める前記ボンディングツールの先端部の前記像とを撮像し、前記制御部により、前記撮像面上における前記ボンディングツールの先端部の位置A21と前記ボンディングツールの先端部の前記像の位置をA22として算出する工程と、
算出されたA11,A12,A21,A22の4つの位置データと、前記第1高さ位置と前記第2高さ位置とに基づいて、前記平面物体に対する前記ボンディングツールの前記着地点位置を推定する工程と、
前記基準パターンの位置と前記推定された着地点位置の差分から、ボンディングにおいて生じるボンディングオフセットの変化を検知する工程と、
前記制御部は、前記検知したボンディングオフセットの変化量をフィードバックしてボンディングを行う工程と、
を含む、ボンディングツールの着地点位置を推定する方法。
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