JP6239311B2 - 発光素子 - Google Patents
発光素子 Download PDFInfo
- Publication number
- JP6239311B2 JP6239311B2 JP2013169421A JP2013169421A JP6239311B2 JP 6239311 B2 JP6239311 B2 JP 6239311B2 JP 2013169421 A JP2013169421 A JP 2013169421A JP 2013169421 A JP2013169421 A JP 2013169421A JP 6239311 B2 JP6239311 B2 JP 6239311B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- light emitting
- connection part
- disposed
- semiconductor layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
- H10H20/831—Electrodes characterised by their shape
- H10H20/8314—Electrodes characterised by their shape extending at least partially onto an outer side surface of the bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
- H10H20/018—Bonding of wafers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
- H10H20/82—Roughened surfaces, e.g. at the interface between epitaxial layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
- H10H20/831—Electrodes characterised by their shape
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
- H10H20/832—Electrodes characterised by their material
- H10H20/835—Reflective materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/858—Means for heat extraction or cooling
- H10H20/8585—Means for heat extraction or cooling being an interconnection
Landscapes
- Led Devices (AREA)
- Led Device Packages (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020120090679A KR101946919B1 (ko) | 2012-08-20 | 2012-08-20 | 발광소자 |
| KR10-2012-0090679 | 2012-08-20 | ||
| KR10-2012-0096911 | 2012-09-03 | ||
| KR1020120096911A KR101956096B1 (ko) | 2012-09-03 | 2012-09-03 | 발광소자 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014039039A JP2014039039A (ja) | 2014-02-27 |
| JP2014039039A5 JP2014039039A5 (enExample) | 2016-10-06 |
| JP6239311B2 true JP6239311B2 (ja) | 2017-11-29 |
Family
ID=48998517
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013169421A Active JP6239311B2 (ja) | 2012-08-20 | 2013-08-19 | 発光素子 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US9653667B2 (enExample) |
| EP (1) | EP2701212B1 (enExample) |
| JP (1) | JP6239311B2 (enExample) |
| CN (1) | CN103633233B (enExample) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101956101B1 (ko) * | 2012-09-06 | 2019-03-11 | 엘지이노텍 주식회사 | 발광소자 |
| JP6004265B2 (ja) * | 2012-09-28 | 2016-10-05 | ウシオ電機株式会社 | Led素子及びその製造方法 |
| DE102013103079A1 (de) * | 2013-03-26 | 2014-10-02 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterchip und Verfahren zur Herstellung eines optoelektronischen Halbleiterchips |
| DE102013107531A1 (de) * | 2013-07-16 | 2015-01-22 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterchip |
| JP2016134423A (ja) * | 2015-01-16 | 2016-07-25 | 株式会社東芝 | 半導体発光素子、発光装置、および半導体発光素子の製造方法 |
| KR102374268B1 (ko) * | 2015-09-04 | 2022-03-17 | 삼성전자주식회사 | 발광소자 패키지 |
| KR102351775B1 (ko) * | 2015-11-18 | 2022-01-14 | 휴렛-팩커드 디벨롭먼트 컴퍼니, 엘.피. | 화상 형성 장치 및 이에 포함되는 발광 소자 |
| CN105702827B (zh) * | 2016-02-04 | 2019-01-18 | 易美芯光(北京)科技有限公司 | 一种新型垂直结构芯片及其制备方法 |
| CN105702818B (zh) * | 2016-02-04 | 2019-01-01 | 易美芯光(北京)科技有限公司 | 一种垂直结构芯片及其制备方法 |
| JPWO2017154975A1 (ja) * | 2016-03-08 | 2019-01-24 | アルパッド株式会社 | 半導体発光装置 |
| TWI584491B (zh) * | 2016-11-03 | 2017-05-21 | 友達光電股份有限公司 | 發光裝置與其製作方法 |
| WO2019194618A1 (ko) | 2018-04-05 | 2019-10-10 | 엘지이노텍 주식회사 | 반도체 소자 패키지 |
| KR102737506B1 (ko) * | 2019-03-18 | 2024-12-05 | 삼성전자주식회사 | 반도체 발광소자 및 그 제조 방법 |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102009025015A1 (de) * | 2008-07-08 | 2010-02-18 | Seoul Opto Device Co. Ltd., Ansan | Lichtemittierende Vorrichtung und Verfahren zu ihrer Herstellung |
| JP5217787B2 (ja) * | 2008-08-27 | 2013-06-19 | 日亜化学工業株式会社 | 半導体発光素子 |
| JP5123269B2 (ja) * | 2008-09-30 | 2013-01-23 | ソウル オプト デバイス カンパニー リミテッド | 発光素子及びその製造方法 |
| CN102232250A (zh) * | 2008-10-01 | 2011-11-02 | 三星Led株式会社 | 使用液晶聚合物的发光二极管封装件 |
| US8008683B2 (en) * | 2008-10-22 | 2011-08-30 | Samsung Led Co., Ltd. | Semiconductor light emitting device |
| WO2010114250A2 (en) * | 2009-03-31 | 2010-10-07 | Seoul Semiconductor Co., Ltd. | Light emitting device having plurality of light emitting cells and method of fabricating the same |
| KR101007133B1 (ko) * | 2009-06-08 | 2011-01-10 | 엘지이노텍 주식회사 | 반도체 발광소자 및 그 제조방법 |
| KR100986570B1 (ko) * | 2009-08-31 | 2010-10-07 | 엘지이노텍 주식회사 | 반도체 발광소자 및 그 제조방법 |
| KR100986560B1 (ko) * | 2010-02-11 | 2010-10-07 | 엘지이노텍 주식회사 | 발광소자 및 그 제조방법 |
| KR100999733B1 (ko) | 2010-02-18 | 2010-12-08 | 엘지이노텍 주식회사 | 발광 소자, 발광 소자 제조방법 및 발광 소자 패키지 |
| JP5101645B2 (ja) * | 2010-02-24 | 2012-12-19 | 株式会社東芝 | 半導体発光装置 |
| KR101039879B1 (ko) * | 2010-04-12 | 2011-06-09 | 엘지이노텍 주식회사 | 발광소자 및 그 제조방법 |
| JP5356312B2 (ja) * | 2010-05-24 | 2013-12-04 | 株式会社東芝 | 半導体発光装置 |
| KR101154709B1 (ko) * | 2010-07-28 | 2012-06-08 | 엘지이노텍 주식회사 | 발광 소자, 발광 소자 제조방법, 발광 소자 패키지 및 조명 시스템 |
| KR101114191B1 (ko) * | 2010-09-17 | 2012-03-13 | 엘지이노텍 주식회사 | 발광소자 |
| KR101707118B1 (ko) * | 2010-10-19 | 2017-02-15 | 엘지이노텍 주식회사 | 발광소자 및 그 발광 소자의 제조 방법 |
| KR101746002B1 (ko) * | 2010-11-15 | 2017-06-12 | 엘지이노텍 주식회사 | 발광소자 |
| KR101830719B1 (ko) * | 2011-09-01 | 2018-02-21 | 엘지이노텍 주식회사 | 발광 소자 |
| KR101946914B1 (ko) * | 2012-06-08 | 2019-02-12 | 엘지이노텍 주식회사 | 발광소자, 발광소자 패키지 및 라이트 유닛 |
| KR101956101B1 (ko) * | 2012-09-06 | 2019-03-11 | 엘지이노텍 주식회사 | 발광소자 |
| EP2755244B1 (en) * | 2013-01-10 | 2018-08-15 | LG Innotek Co., Ltd. | Light emitting device |
-
2013
- 2013-08-19 JP JP2013169421A patent/JP6239311B2/ja active Active
- 2013-08-19 EP EP13180862.8A patent/EP2701212B1/en active Active
- 2013-08-20 CN CN201310364631.7A patent/CN103633233B/zh active Active
- 2013-08-20 US US13/970,803 patent/US9653667B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| EP2701212A3 (en) | 2016-04-27 |
| CN103633233A (zh) | 2014-03-12 |
| EP2701212A2 (en) | 2014-02-26 |
| EP2701212B1 (en) | 2020-06-17 |
| CN103633233B (zh) | 2017-12-05 |
| US20140048839A1 (en) | 2014-02-20 |
| US9653667B2 (en) | 2017-05-16 |
| JP2014039039A (ja) | 2014-02-27 |
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