JP6233707B2 - 光学式温度センサ及び光学式温度センサの製造方法 - Google Patents

光学式温度センサ及び光学式温度センサの製造方法 Download PDF

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Publication number
JP6233707B2
JP6233707B2 JP2014042137A JP2014042137A JP6233707B2 JP 6233707 B2 JP6233707 B2 JP 6233707B2 JP 2014042137 A JP2014042137 A JP 2014042137A JP 2014042137 A JP2014042137 A JP 2014042137A JP 6233707 B2 JP6233707 B2 JP 6233707B2
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temperature
temperature sensor
light
optical
led
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JP2014042137A
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Japanese (ja)
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JP2015169444A5 (enExample
JP2015169444A (ja
Inventor
能吏 山本
能吏 山本
建一郎 山田
建一郎 山田
山川　禎貴
禎貴 山川
悠司 水摩
悠司 水摩
谷口　浩一
浩一 谷口
田平　昌俊
昌俊 田平
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Priority to JP2014042137A priority Critical patent/JP6233707B2/ja
Priority to US15/116,569 priority patent/US10139290B2/en
Priority to TW104106435A priority patent/TWI663385B/zh
Priority to PCT/JP2015/056058 priority patent/WO2015133427A1/ja
Publication of JP2015169444A publication Critical patent/JP2015169444A/ja
Publication of JP2015169444A5 publication Critical patent/JP2015169444A5/ja
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K11/00—Measuring temperature based upon physical or chemical changes not covered by groups G01K3/00, G01K5/00, G01K7/00 or G01K9/00
    • G01K11/12—Measuring temperature based upon physical or chemical changes not covered by groups G01K3/00, G01K5/00, G01K7/00 or G01K9/00 using changes in colour, translucency or reflectance
    • G01K11/125—Measuring temperature based upon physical or chemical changes not covered by groups G01K3/00, G01K5/00, G01K7/00 or G01K9/00 using changes in colour, translucency or reflectance using changes in reflectance
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/08—Protective devices, e.g. casings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
JP2014042137A 2014-03-04 2014-03-04 光学式温度センサ及び光学式温度センサの製造方法 Active JP6233707B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2014042137A JP6233707B2 (ja) 2014-03-04 2014-03-04 光学式温度センサ及び光学式温度センサの製造方法
US15/116,569 US10139290B2 (en) 2014-03-04 2015-03-02 Optical temperature sensor and method for manufacturing optical temperature sensor
TW104106435A TWI663385B (zh) 2014-03-04 2015-03-02 光學式溫度感測器及光學式溫度感測器之製造方法
PCT/JP2015/056058 WO2015133427A1 (ja) 2014-03-04 2015-03-02 光学式温度センサ及び光学式温度センサの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014042137A JP6233707B2 (ja) 2014-03-04 2014-03-04 光学式温度センサ及び光学式温度センサの製造方法

Publications (3)

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JP2015169444A JP2015169444A (ja) 2015-09-28
JP2015169444A5 JP2015169444A5 (enExample) 2017-01-26
JP6233707B2 true JP6233707B2 (ja) 2017-11-22

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JP2014042137A Active JP6233707B2 (ja) 2014-03-04 2014-03-04 光学式温度センサ及び光学式温度センサの製造方法

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Country Link
US (1) US10139290B2 (enExample)
JP (1) JP6233707B2 (enExample)
TW (1) TWI663385B (enExample)
WO (1) WO2015133427A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016076650A1 (ko) * 2014-11-12 2016-05-19 (주)디엑스엠 펠티어소자에 의해 치과용 매트리얼을 가열하는 치과용 매트리얼 가열주입기
JP6736042B2 (ja) * 2016-09-09 2020-08-05 株式会社シミウス Ｆｂｇ温度センサ
CA2997985C (en) * 2016-09-20 2022-06-21 Lumasense Technologies Holdings, Inc. Temperature probe
CN110400772B (zh) * 2018-04-24 2021-10-15 北京北方华创微电子装备有限公司 静电卡盘和半导体加工设备
US12051607B2 (en) * 2018-07-24 2024-07-30 Asml Netherlands B.V. Substrate positioning device with remote temperature sensor
JP7329338B2 (ja) * 2019-03-05 2023-08-18 セイコーグループ株式会社 口腔内生体モニタリング装置

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4703174A (en) * 1984-03-02 1987-10-27 Fiberdynamics, Inc. Fiberoptic temperature/pressure sensor system
JPS61213738A (ja) 1985-03-20 1986-09-22 Nagoyashi 光フアイバ温度計測センサ
JPS61232684A (ja) 1985-04-08 1986-10-16 Mitsubishi Cable Ind Ltd 光半導体素子の温度安定化装置
JPS61233331A (ja) 1985-04-08 1986-10-17 Mitsubishi Cable Ind Ltd 光学式温度計
JPS6285832A (ja) 1985-10-11 1987-04-20 Mitsubishi Cable Ind Ltd 光学式温度計
JPH01242931A (ja) 1988-03-23 1989-09-27 Mitsubishi Electric Corp 温度センサ
US5446279A (en) * 1993-08-27 1995-08-29 Hughes Aircraft Company Fiber optic sensor sensing curvature of a diaphragm
US6572265B1 (en) * 2001-04-20 2003-06-03 Luxtron Corporation In situ optical surface temperature measuring techniques and devices
US7080940B2 (en) * 2001-04-20 2006-07-25 Luxtron Corporation In situ optical surface temperature measuring techniques and devices
US7056035B2 (en) * 2001-12-21 2006-06-06 The Furukawa Electric Co., Ltd. Optical module, optical apparatus including optical module, and method for using optical module
TWI246589B (en) * 2004-06-29 2006-01-01 Univ Feng Chia Lateral superstructure fiber grating pressure and temperature sensor
JP4748803B2 (ja) * 2005-12-06 2011-08-17 東京エレクトロン株式会社 基板処理装置、基板処理装置における被測定物の物理量測定方法及び記憶媒体
DE102008038875B3 (de) * 2008-08-13 2010-01-28 Abb Technology Ag Temperaturfühler für eine prozesstechnische industrielle Anlage
DE102009010289A1 (de) * 2009-02-24 2010-09-02 Siemens Aktiengesellschaft Vorrichtung zur Temperaturmessung in elektromagnetischen Feldern, Verwendung dieser Vorrichtung sowie zugehörige Messanordnung
US20110267598A1 (en) * 2010-04-30 2011-11-03 Vestas Wind Systems A/S Optical sensor system and detecting method for an enclosed semiconductor device module
DE202011003569U1 (de) * 2011-03-04 2012-06-05 Horst Sonnendorfer Messgerät
JP5730638B2 (ja) * 2011-03-28 2015-06-10 東京エレクトロン株式会社 基板処理装置の処理室内構成部材及びその温度測定方法
JP6263019B2 (ja) * 2013-12-16 2018-01-17 東京エレクトロン株式会社 温度測定方法、基板処理システム及び温度測定用部材

Also Published As

Publication number Publication date
WO2015133427A1 (ja) 2015-09-11
TWI663385B (zh) 2019-06-21
TW201546426A (zh) 2015-12-16
US10139290B2 (en) 2018-11-27
US20160363486A1 (en) 2016-12-15
JP2015169444A (ja) 2015-09-28

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