JP6230308B2 - 透明ポリイミド共重合体、ポリイミド樹脂組成物及び成形体、並びにこの共重合体の製造方法 - Google Patents
透明ポリイミド共重合体、ポリイミド樹脂組成物及び成形体、並びにこの共重合体の製造方法 Download PDFInfo
- Publication number
- JP6230308B2 JP6230308B2 JP2013148057A JP2013148057A JP6230308B2 JP 6230308 B2 JP6230308 B2 JP 6230308B2 JP 2013148057 A JP2013148057 A JP 2013148057A JP 2013148057 A JP2013148057 A JP 2013148057A JP 6230308 B2 JP6230308 B2 JP 6230308B2
- Authority
- JP
- Japan
- Prior art keywords
- polyimide copolymer
- copolymer
- dianhydride
- transparent polyimide
- polyimide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- XDTMQSROBMDMFD-UHFFFAOYSA-N C1CCCCC1 Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 2
- 0 CC1C(*)C(*)C(*)C(C)C1* Chemical compound CC1C(*)C(*)C(*)C(C)C1* 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1003—Preparatory processes
- C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
- C08G73/1028—Preparatory processes from tetracarboxylic acids or derivatives and diamines characterised by the process itself, e.g. steps, continuous
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
- C08G73/105—Polyimides containing oxygen in the form of ether bonds in the main chain with oxygen only in the diamino moiety
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
- C08G73/1053—Polyimides containing oxygen in the form of ether bonds in the main chain with oxygen only in the tetracarboxylic moiety
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
- C08G73/1064—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing sulfur
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
- C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
- C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013148057A JP6230308B2 (ja) | 2013-07-16 | 2013-07-16 | 透明ポリイミド共重合体、ポリイミド樹脂組成物及び成形体、並びにこの共重合体の製造方法 |
| US14/903,506 US10189949B2 (en) | 2013-07-16 | 2014-07-07 | Transparent polyimide copolymer, polyimide resin composition and molded article, and production method of said copolymer |
| CN201480040578.8A CN105408393B (zh) | 2013-07-16 | 2014-07-07 | 透明聚酰亚胺共聚物、聚酰亚胺树脂组合物及成形体、以及该共聚物的制造方法 |
| KR1020167003717A KR102097312B1 (ko) | 2013-07-16 | 2014-07-07 | 투명 폴리이미드 공중합체, 폴리이미드 수지 조성물 및 성형체, 및 이 공중합체의 제조 방법 |
| PCT/JP2014/068017 WO2015008643A1 (ja) | 2013-07-16 | 2014-07-07 | 透明ポリイミド共重合体、ポリイミド樹脂組成物及び成形体、並びにこの共重合体の製造方法 |
| TW103123907A TWI636096B (zh) | 2013-07-16 | 2014-07-11 | 透明聚醯亞胺共聚物、聚醯亞胺樹脂組成物及成形體、以及該共聚物之製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013148057A JP6230308B2 (ja) | 2013-07-16 | 2013-07-16 | 透明ポリイミド共重合体、ポリイミド樹脂組成物及び成形体、並びにこの共重合体の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015021022A JP2015021022A (ja) | 2015-02-02 |
| JP2015021022A5 JP2015021022A5 (OSRAM) | 2016-09-15 |
| JP6230308B2 true JP6230308B2 (ja) | 2017-11-15 |
Family
ID=52346111
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013148057A Active JP6230308B2 (ja) | 2013-07-16 | 2013-07-16 | 透明ポリイミド共重合体、ポリイミド樹脂組成物及び成形体、並びにこの共重合体の製造方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US10189949B2 (OSRAM) |
| JP (1) | JP6230308B2 (OSRAM) |
| KR (1) | KR102097312B1 (OSRAM) |
| CN (1) | CN105408393B (OSRAM) |
| TW (1) | TWI636096B (OSRAM) |
| WO (1) | WO2015008643A1 (OSRAM) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101928598B1 (ko) * | 2013-09-30 | 2018-12-12 | 주식회사 엘지화학 | 폴리이미드 필름 및 그 제조방법 |
| KR20210094129A (ko) | 2016-03-25 | 2021-07-28 | 코니카 미놀타 가부시키가이샤 | 폴리이미드 필름 및 그 제조 방법 |
| JP6758875B2 (ja) * | 2016-03-29 | 2020-09-23 | ソマール株式会社 | ポリイミド樹脂組成物およびそれを用いた成形体 |
| TWI609897B (zh) * | 2017-02-15 | 2018-01-01 | 律勝科技股份有限公司 | 聚醯亞胺樹脂及其製造方法與薄膜 |
| KR102524863B1 (ko) * | 2017-03-29 | 2023-04-24 | 도레이 카부시키가이샤 | 도전층 구비 필름, 터치 패널, 도전층 구비 필름의 제조 방법 및 터치 패널의 제조 방법 |
| TWI655097B (zh) * | 2017-12-27 | 2019-04-01 | 財團法人工業技術研究院 | 光波導元件及其製造方法 |
| CN108218797B (zh) * | 2018-01-16 | 2020-03-17 | 同济大学 | 液晶分子改性嘧啶二胺单体、源自其的液晶取向材料及其合成方法 |
| CN112313264A (zh) * | 2018-04-20 | 2021-02-02 | 宇部兴产株式会社 | 聚酰亚胺、层积体和包含它们的电子器件 |
| TWI833752B (zh) * | 2018-05-16 | 2024-03-01 | 美商杜邦股份有限公司 | 用於電子裝置中的聚合物 |
| EP3819283A4 (en) * | 2018-07-05 | 2022-03-16 | Unitika Ltd. | METHOD OF MAKING AN ORGANIC COMPOUND |
| CN110105571B (zh) * | 2019-05-31 | 2020-10-02 | 中国科学院大连化学物理研究所 | 一种新型嵌段聚酰亚胺材料及其制备与在气体分离中的应用 |
| KR102286207B1 (ko) * | 2020-05-04 | 2021-08-06 | 에스케이이노베이션 주식회사 | 폴리이미드계 필름 및 이를 포함하는 플렉서블 디스플레이 패널 |
| JP2023527141A (ja) | 2020-11-19 | 2023-06-27 | エルジー・ケム・リミテッド | ディスプレイ装置用またはフレキシブルディスプレイ装置用基板、およびディスプレイ装置またはフレキシブルディスプレイ装置 |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4629777A (en) * | 1983-05-18 | 1986-12-16 | Ciba-Geigy Corporation | Polyimides, a process for their preparation and their use |
| US4912197A (en) * | 1987-08-14 | 1990-03-27 | E. I. Du Pont De Nemours And Company | Highly soluble clear polyimides |
| US4897092A (en) | 1989-02-27 | 1990-01-30 | Air Products And Chemicals, Inc. | Polyimide membrane having improved flux |
| US4981497A (en) | 1989-06-01 | 1991-01-01 | E. I. Du Pont De Nemours And Company | Amine-modified polyimide membranes |
| US4932982A (en) * | 1989-06-01 | 1990-06-12 | E. I. Du Pont De Nemours And Company | Copolyimide gas separation membranes derived from substituted phenylene diamines and substituted methylene dianilines |
| JP2950521B2 (ja) * | 1991-03-18 | 1999-09-20 | 日本電信電話株式会社 | 光導波路用ポリイミド光学材料 |
| JPH05271411A (ja) * | 1992-03-26 | 1993-10-19 | Hitachi Chem Co Ltd | イミドオリゴマ型耐熱性樹脂組成物およびその製造方法 |
| JP3091657B2 (ja) * | 1994-12-26 | 2000-09-25 | キヤノン株式会社 | 電子写真感光体、該電子写真感光体を有するプロセスカ−トリッジ及び電子写真装置 |
| US5649045A (en) | 1995-12-13 | 1997-07-15 | Amoco Corporation | Polymide optical waveguide structures |
| JPH09258048A (ja) * | 1996-03-25 | 1997-10-03 | Nikon Corp | 集光グレーティングカップラの設計方法および製造方法 |
| US5750641A (en) | 1996-05-23 | 1998-05-12 | Minnesota Mining And Manufacturing Company | Polyimide angularity enhancement layer |
| US6139926A (en) * | 1998-05-21 | 2000-10-31 | E. I. Du Pont De Nemours And Company | Polyimide photo alignment film from 3,3,4,4-benzophenone tetracarboxylic dianhydride and ortho-substituted aromatic diamines for liquid crystal displays |
| JP2001040209A (ja) * | 1999-07-29 | 2001-02-13 | Hitachi Chemical Dupont Microsystems Ltd | 光配向液晶配向膜用組成物、光配向液晶配向膜、液晶挟持基板及び液晶表示装置 |
| US20020192445A1 (en) * | 2001-05-03 | 2002-12-19 | Ezzell Stephen A. | Plastic substrate for display applications |
| JP2003176354A (ja) | 2001-12-11 | 2003-06-24 | Manac Inc | 透明な耐熱性ポリイミドフイルム |
| US20050256295A1 (en) | 2004-03-31 | 2005-11-17 | Katsuya Sakayori | Polymer compound, highly transparent polyimide, resin composition and article |
| JP4821157B2 (ja) | 2004-03-31 | 2011-11-24 | 大日本印刷株式会社 | 高分子化合物、高透明性ポリイミド、樹脂組成物及び物品 |
| JP5018082B2 (ja) * | 2006-12-28 | 2012-09-05 | 新日本理化株式会社 | 新規なポリイミド樹脂組成物及びそのワニス |
| JP5321193B2 (ja) | 2009-03-30 | 2013-10-23 | デクセリアルズ株式会社 | ポリアミック酸溶液、ポリイミド及び光学装置 |
| JP2011140563A (ja) | 2010-01-07 | 2011-07-21 | Hitachi Chem Co Ltd | ポリイミド及び樹脂組成物 |
| JP2011144260A (ja) | 2010-01-14 | 2011-07-28 | Mitsubishi Gas Chemical Co Inc | 粘着剤及び粘着テープ |
-
2013
- 2013-07-16 JP JP2013148057A patent/JP6230308B2/ja active Active
-
2014
- 2014-07-07 CN CN201480040578.8A patent/CN105408393B/zh active Active
- 2014-07-07 KR KR1020167003717A patent/KR102097312B1/ko active Active
- 2014-07-07 US US14/903,506 patent/US10189949B2/en active Active
- 2014-07-07 WO PCT/JP2014/068017 patent/WO2015008643A1/ja not_active Ceased
- 2014-07-11 TW TW103123907A patent/TWI636096B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| WO2015008643A1 (ja) | 2015-01-22 |
| CN105408393B (zh) | 2019-08-06 |
| KR102097312B1 (ko) | 2020-04-06 |
| JP2015021022A (ja) | 2015-02-02 |
| CN105408393A (zh) | 2016-03-16 |
| KR20160032181A (ko) | 2016-03-23 |
| TWI636096B (zh) | 2018-09-21 |
| US20160168328A1 (en) | 2016-06-16 |
| TW201522504A (zh) | 2015-06-16 |
| US10189949B2 (en) | 2019-01-29 |
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