JP6227223B2 - 半導体装置、及び半導体装置の製造方法 - Google Patents

半導体装置、及び半導体装置の製造方法 Download PDF

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Publication number
JP6227223B2
JP6227223B2 JP2012082736A JP2012082736A JP6227223B2 JP 6227223 B2 JP6227223 B2 JP 6227223B2 JP 2012082736 A JP2012082736 A JP 2012082736A JP 2012082736 A JP2012082736 A JP 2012082736A JP 6227223 B2 JP6227223 B2 JP 6227223B2
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bonding
chip
wire
terminal
transmission
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Expired - Fee Related
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Japanese (ja)
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JP2013214546A (ja
Inventor
弘道 渡辺
弘道 渡辺
謙治 岡
謙治 岡
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Denso Ten Ltd
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Denso Ten Ltd
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Priority to CN201210211291.XA priority patent/CN103367337B/zh
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP2012082736A 2012-03-30 2012-03-30 半導体装置、及び半導体装置の製造方法 Expired - Fee Related JP6227223B2 (ja)

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JP2012082736A JP6227223B2 (ja) 2012-03-30 2012-03-30 半導体装置、及び半導体装置の製造方法
CN201210211291.XA CN103367337B (zh) 2012-03-30 2012-06-21 半导体装置以及半导体装置的制造方法

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JP2012082736A JP6227223B2 (ja) 2012-03-30 2012-03-30 半導体装置、及び半導体装置の製造方法

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JP6227223B2 true JP6227223B2 (ja) 2017-11-08

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Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59195856A (ja) * 1983-04-20 1984-11-07 Fujitsu Ltd 半導体装置及びその製造方法
JPS61113243A (ja) * 1984-11-07 1986-05-31 Fuji Xerox Co Ltd 混成集積回路の実装方法
JP2001015542A (ja) * 1999-07-02 2001-01-19 Sanken Electric Co Ltd 半導体装置及びその製造方法
JP4439090B2 (ja) * 2000-07-26 2010-03-24 日本テキサス・インスツルメンツ株式会社 半導体装置及びその製造方法
JP3753685B2 (ja) * 2002-09-19 2006-03-08 ローム株式会社 ワイヤボンディング方法
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WO2009113262A1 (ja) * 2008-03-11 2009-09-17 パナソニック株式会社 半導体デバイスおよび半導体デバイスの製造方法
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