JP6214901B2 - 切削装置 - Google Patents

切削装置 Download PDF

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Publication number
JP6214901B2
JP6214901B2 JP2013078333A JP2013078333A JP6214901B2 JP 6214901 B2 JP6214901 B2 JP 6214901B2 JP 2013078333 A JP2013078333 A JP 2013078333A JP 2013078333 A JP2013078333 A JP 2013078333A JP 6214901 B2 JP6214901 B2 JP 6214901B2
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JP
Japan
Prior art keywords
cutting
guide rail
cutting blade
spindle
axis
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2013078333A
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English (en)
Japanese (ja)
Other versions
JP2014203944A (ja
Inventor
宏彦 香西
宏彦 香西
優爾 中西
優爾 中西
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Priority to JP2013078333A priority Critical patent/JP6214901B2/ja
Priority to TW103107005A priority patent/TWI597767B/zh
Priority to US14/215,315 priority patent/US9396976B2/en
Priority to KR1020140037922A priority patent/KR102073430B1/ko
Priority to DE201410206297 priority patent/DE102014206297A1/de
Priority to CN201410130228.2A priority patent/CN104097267B/zh
Publication of JP2014203944A publication Critical patent/JP2014203944A/ja
Application granted granted Critical
Publication of JP6214901B2 publication Critical patent/JP6214901B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/06—Arrangements for feeding or delivering work of other than sheet, web, or filamentary form
    • B26D7/0616—Arrangements for feeding or delivering work of other than sheet, web, or filamentary form by carriages, e.g. for slicing machines
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/768—Rotatable disc tool pair or tool and carrier
    • Y10T83/7684—With means to support work relative to tool[s]
    • Y10T83/7722—Support and tool relatively adjustable
    • Y10T83/7726—By movement of the tool

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Forests & Forestry (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
JP2013078333A 2013-04-04 2013-04-04 切削装置 Active JP6214901B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2013078333A JP6214901B2 (ja) 2013-04-04 2013-04-04 切削装置
TW103107005A TWI597767B (zh) 2013-04-04 2014-03-03 Cutting device
US14/215,315 US9396976B2 (en) 2013-04-04 2014-03-17 Cutting apparatus
KR1020140037922A KR102073430B1 (ko) 2013-04-04 2014-03-31 절삭 장치
DE201410206297 DE102014206297A1 (de) 2013-04-04 2014-04-02 Schneidvorrichtung
CN201410130228.2A CN104097267B (zh) 2013-04-04 2014-04-02 切削装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013078333A JP6214901B2 (ja) 2013-04-04 2013-04-04 切削装置

Publications (2)

Publication Number Publication Date
JP2014203944A JP2014203944A (ja) 2014-10-27
JP6214901B2 true JP6214901B2 (ja) 2017-10-18

Family

ID=51567738

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013078333A Active JP6214901B2 (ja) 2013-04-04 2013-04-04 切削装置

Country Status (6)

Country Link
US (1) US9396976B2 (ko)
JP (1) JP6214901B2 (ko)
KR (1) KR102073430B1 (ko)
CN (1) CN104097267B (ko)
DE (1) DE102014206297A1 (ko)
TW (1) TWI597767B (ko)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2986175A1 (fr) * 2012-01-31 2013-08-02 St Microelectronics Tours Sas Procede et dispositif de decoupe d'une plaquette
JP6441737B2 (ja) * 2015-04-28 2018-12-19 株式会社ディスコ 切削装置
JP6560110B2 (ja) * 2015-11-30 2019-08-14 株式会社ディスコ 切削装置
JP6078201B1 (ja) * 2015-12-08 2017-02-08 日本製図器工業株式会社 シートを加工する方法及びシートの加工装置
JP2019079884A (ja) * 2017-10-23 2019-05-23 株式会社ディスコ ウェーハの加工方法
US10703016B2 (en) * 2018-06-20 2020-07-07 Texas Instruments Incorporated Semiconductor sawing method and system
CN108724498A (zh) * 2018-06-27 2018-11-02 昆明理工大学 一种靶材切割机
JP7184620B2 (ja) * 2018-12-11 2022-12-06 株式会社ディスコ 切削装置
CN110000616A (zh) * 2019-02-21 2019-07-12 宁波米诺机床有限公司 一种高精度的四主轴加工中心专机
CN110000613A (zh) * 2019-02-21 2019-07-12 宁波米诺机床有限公司 一种主轴可调节角度的四主轴加工中心专机
CN110000615A (zh) * 2019-02-21 2019-07-12 宁波米诺机床有限公司 一种自动清理碎屑的四主轴加工中心专机
CN110000617A (zh) * 2019-02-21 2019-07-12 宁波米诺机床有限公司 一种四主轴加工中心的双主轴箱结构
CN111230688A (zh) * 2020-01-17 2020-06-05 无锡立朵科技有限公司 一种y轴导轨水平布置的双龙门结构划片机
CN113752397B (zh) * 2021-09-02 2023-12-01 营口金辰机械股份有限公司 一种切削方法
CN114227481B (zh) * 2021-12-14 2023-03-24 湖南艾凯瑞斯智能科技有限公司 一种多工位同步给料的晶圆加工用砂轮划片机

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4277998A (en) * 1980-01-16 1981-07-14 Stoddard H. Pyle Wood member cutting apparatus
US4676129A (en) * 1984-10-02 1987-06-30 Gang-Nail Systems, Inc. Automated truss component saw apparatus
US5943239A (en) * 1995-03-22 1999-08-24 Alpine Engineered Products, Inc. Methods and apparatus for orienting power saws in a sawing system
JPH09207124A (ja) * 1996-01-31 1997-08-12 Deisuko Eng Service:Kk デュアルマルチブレードカッティングソー
US5752797A (en) * 1996-04-08 1998-05-19 International Business Machines Corporation Automated chamfering apparatus and method
US6102023A (en) * 1997-07-02 2000-08-15 Disco Corporation Precision cutting apparatus and cutting method using the same
JPH11274109A (ja) 1998-03-23 1999-10-08 Disco Abrasive Syst Ltd 多軸ダイシング装置
JP2002237472A (ja) * 2001-02-07 2002-08-23 Disco Abrasive Syst Ltd 被加工物の切削方法
US7267037B2 (en) * 2001-05-05 2007-09-11 David Walter Smith Bidirectional singulation saw and method
TWI272673B (en) * 2001-11-21 2007-02-01 Disco Corp Cutting machine
JP4494728B2 (ja) * 2003-05-26 2010-06-30 株式会社ディスコ 非金属基板の分割方法
JP4303041B2 (ja) * 2003-06-18 2009-07-29 株式会社ディスコ 半導体ウエーハの加工装置
JP4532895B2 (ja) * 2003-12-18 2010-08-25 株式会社ディスコ 板状物の切削装置
US7402520B2 (en) * 2004-11-26 2008-07-22 Applied Materials, Inc. Edge removal of silicon-on-insulator transfer wafer
JP4571851B2 (ja) * 2004-11-30 2010-10-27 株式会社ディスコ 切削装置
JP2006173462A (ja) * 2004-12-17 2006-06-29 Disco Abrasive Syst Ltd ウェーハの加工装置
JP4630692B2 (ja) * 2005-03-07 2011-02-09 株式会社ディスコ レーザー加工方法
JP2006278869A (ja) * 2005-03-30 2006-10-12 Disco Abrasive Syst Ltd ウェーハの切削方法及び切削装置
JP4876819B2 (ja) * 2006-09-25 2012-02-15 株式会社東京精密 ダイシング装置及びダイシング方法
JP2008112884A (ja) * 2006-10-31 2008-05-15 Disco Abrasive Syst Ltd ウエーハの加工方法
JP4851918B2 (ja) * 2006-11-24 2012-01-11 株式会社ディスコ ウエーハのレーザー加工方法およびレーザー加工装置
JP5149020B2 (ja) * 2008-01-23 2013-02-20 株式会社ディスコ ウエーハの研削方法
JP5198887B2 (ja) * 2008-01-24 2013-05-15 株式会社ディスコ 積層型半導体装置の製造方法
JP5284651B2 (ja) * 2008-01-29 2013-09-11 株式会社ディスコ ウエーハの加工方法
JP5384284B2 (ja) * 2009-10-09 2014-01-08 株式会社ディスコ レーザー加工装置
JP5770446B2 (ja) * 2010-09-30 2015-08-26 株式会社ディスコ 分割方法
JP5619559B2 (ja) * 2010-10-12 2014-11-05 株式会社ディスコ 加工装置

Also Published As

Publication number Publication date
KR102073430B1 (ko) 2020-02-04
US9396976B2 (en) 2016-07-19
TW201447996A (zh) 2014-12-16
CN104097267B (zh) 2017-05-17
DE102014206297A1 (de) 2014-10-09
CN104097267A (zh) 2014-10-15
TWI597767B (zh) 2017-09-01
KR20140120832A (ko) 2014-10-14
JP2014203944A (ja) 2014-10-27
US20140298969A1 (en) 2014-10-09

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