JP6211866B2 - 圧力センサ、マイクロフォン、血圧センサおよびタッチパネル - Google Patents
圧力センサ、マイクロフォン、血圧センサおよびタッチパネル Download PDFInfo
- Publication number
- JP6211866B2 JP6211866B2 JP2013196243A JP2013196243A JP6211866B2 JP 6211866 B2 JP6211866 B2 JP 6211866B2 JP 2013196243 A JP2013196243 A JP 2013196243A JP 2013196243 A JP2013196243 A JP 2013196243A JP 6211866 B2 JP6211866 B2 JP 6211866B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- bias
- magnetization
- magnetic
- sensing element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
- B81B3/0067—Mechanical properties
- B81B3/0078—Constitution or structural means for improving mechanical properties not provided for in B81B3/007 - B81B3/0075
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/02—Detecting, measuring or recording for evaluating the cardiovascular system, e.g. pulse, heart rate, blood pressure or blood flow
- A61B5/021—Measuring pressure in heart or blood vessels
- A61B5/02141—Details of apparatus construction, e.g. pump units or housings therefor, cuff pressurising systems, arrangements of fluid conduits or circuits
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/12—Measuring force or stress, in general by measuring variations in the magnetic properties of materials resulting from the application of stress
- G01L1/125—Measuring force or stress, in general by measuring variations in the magnetic properties of materials resulting from the application of stress by using magnetostrictive means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/16—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in the magnetic properties of material resulting from the application of stress
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/04—Microphones
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R23/00—Transducers other than those covered by groups H04R9/00 - H04R21/00
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R23/00—Transducers other than those covered by groups H04R9/00 - H04R21/00
- H04R23/006—Transducers other than those covered by groups H04R9/00 - H04R21/00 using solid state devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0257—Microphones or microspeakers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/06—Bio-MEMS
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0414—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using force sensing means to determine a position
- G06F3/04144—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using force sensing means to determine a position using an array of force sensing means
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
- H04R2201/003—Mems transducers or their use
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2410/00—Microphones
- H04R2410/03—Reduction of intrinsic noise in microphones
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2420/00—Details of connection covered by H04R, not provided for in its groups
- H04R2420/07—Applications of wireless loudspeakers or wireless microphones
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
- H04R2499/10—General applications
- H04R2499/11—Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R3/00—Circuits for transducers, loudspeakers or microphones
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
- H04R31/006—Interconnection of transducer parts
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Cardiology (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Biomedical Technology (AREA)
- General Health & Medical Sciences (AREA)
- Heart & Thoracic Surgery (AREA)
- Medical Informatics (AREA)
- Molecular Biology (AREA)
- Surgery (AREA)
- Animal Behavior & Ethology (AREA)
- Pathology (AREA)
- Public Health (AREA)
- Veterinary Medicine (AREA)
- Biophysics (AREA)
- Physiology (AREA)
- Vascular Medicine (AREA)
- Hall/Mr Elements (AREA)
- Measuring Fluid Pressure (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013196243A JP6211866B2 (ja) | 2013-09-20 | 2013-09-20 | 圧力センサ、マイクロフォン、血圧センサおよびタッチパネル |
| US14/476,200 US9654883B2 (en) | 2013-09-20 | 2014-09-03 | Strain sensing element, pressure sensor, microphone, blood pressure sensor, and touch panel |
| TW103130571A TW201522928A (zh) | 2013-09-20 | 2014-09-04 | 應變感測元件、壓力感測器、麥克風、血壓感測器及觸控面板 |
| US15/421,283 US10448845B2 (en) | 2013-09-20 | 2017-01-31 | Strain sensing element, having a first and second magnetic layer and a third layer that is antiferrimagnetic |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013196243A JP6211866B2 (ja) | 2013-09-20 | 2013-09-20 | 圧力センサ、マイクロフォン、血圧センサおよびタッチパネル |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017176353A Division JP6370980B2 (ja) | 2017-09-14 | 2017-09-14 | センサ、マイクロフォン、血圧センサおよびタッチパネル |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015061070A JP2015061070A (ja) | 2015-03-30 |
| JP2015061070A5 JP2015061070A5 (enExample) | 2016-05-12 |
| JP6211866B2 true JP6211866B2 (ja) | 2017-10-11 |
Family
ID=52689774
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013196243A Expired - Fee Related JP6211866B2 (ja) | 2013-09-20 | 2013-09-20 | 圧力センサ、マイクロフォン、血圧センサおよびタッチパネル |
Country Status (3)
| Country | Link |
|---|---|
| US (2) | US9654883B2 (enExample) |
| JP (1) | JP6211866B2 (enExample) |
| TW (1) | TW201522928A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7095813B2 (ja) | 2019-10-21 | 2022-07-05 | 株式会社村田製作所 | センサ、歪検知センサ、圧力センサ、およびマイクロフォン |
Families Citing this family (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5951454B2 (ja) * | 2012-11-20 | 2016-07-13 | 株式会社東芝 | マイクロフォンパッケージ |
| WO2014149023A1 (en) | 2013-03-15 | 2014-09-25 | Rinand Solutions Llc | Force sensing of inputs through strain analysis |
| JP6199730B2 (ja) | 2013-12-25 | 2017-09-20 | 株式会社東芝 | 電流センサ及び電流センサモジュール |
| AU2015100011B4 (en) | 2014-01-13 | 2015-07-16 | Apple Inc. | Temperature compensating transparent force sensor |
| JP6212000B2 (ja) | 2014-07-02 | 2017-10-11 | 株式会社東芝 | 圧力センサ、並びに圧力センサを用いたマイクロフォン、血圧センサ、及びタッチパネル |
| JP6523004B2 (ja) | 2015-03-24 | 2019-05-29 | 株式会社東芝 | 歪検知素子および圧力センサ |
| JP6198804B2 (ja) * | 2015-12-01 | 2017-09-20 | 日本写真印刷株式会社 | 多点計測用のひずみセンサとその製造方法 |
| KR102176280B1 (ko) * | 2015-12-18 | 2020-11-09 | 삼성전기주식회사 | 음향 공진기 및 그 제조 방법 |
| TWI587194B (zh) * | 2016-02-04 | 2017-06-11 | 恆顥科技股份有限公司 | 觸控顯示裝置 |
| US10545196B2 (en) | 2016-03-24 | 2020-01-28 | Nxp Usa, Inc. | Multiple axis magnetic sensor |
| US10145907B2 (en) * | 2016-04-07 | 2018-12-04 | Nxp Usa, Inc. | Magnetic field sensor with permanent magnet biasing |
| JP6619313B2 (ja) | 2016-09-21 | 2019-12-11 | 株式会社東芝 | センサ及びセンサパッケージ |
| US10444091B2 (en) | 2017-04-11 | 2019-10-15 | Apple Inc. | Row column architecture for strain sensing |
| JP6830527B2 (ja) | 2017-05-09 | 2021-02-17 | 富士フイルム株式会社 | 圧電マイクロフォンチップおよび圧電マイクロフォン |
| US10309846B2 (en) * | 2017-07-24 | 2019-06-04 | Apple Inc. | Magnetic field cancellation for strain sensors |
| US10119869B1 (en) * | 2017-12-21 | 2018-11-06 | Tactotek Oy | Method for manufacturing a strain gauge device, a strain gauge device, and the use of the device |
| WO2019134162A1 (zh) | 2018-01-08 | 2019-07-11 | 深圳市韶音科技有限公司 | 一种骨传导扬声器 |
| JP7410935B2 (ja) | 2018-05-24 | 2024-01-10 | ザ リサーチ ファウンデーション フォー ザ ステイト ユニバーシティー オブ ニューヨーク | 容量性センサ |
| JP6923494B2 (ja) | 2018-08-01 | 2021-08-18 | 株式会社東芝 | センサ |
| US10782818B2 (en) | 2018-08-29 | 2020-09-22 | Apple Inc. | Load cell array for detection of force input to an electronic device enclosure |
| JP6941085B2 (ja) | 2018-08-29 | 2021-09-29 | 株式会社東芝 | センサ、マイクロフォン、血圧センサ及びタッチパネル |
| JP6889135B2 (ja) * | 2018-09-14 | 2021-06-18 | 株式会社東芝 | センサ |
| JP2020106394A (ja) * | 2018-12-27 | 2020-07-09 | Tdk株式会社 | 磁場検出装置および磁場検出方法 |
| WO2021029113A1 (ja) * | 2019-08-13 | 2021-02-18 | 株式会社村田製作所 | センサ、歪検知センサ、圧力センサ、およびマイクロフォン |
| JP7496089B2 (ja) * | 2021-03-04 | 2024-06-06 | 株式会社東芝 | 磁気センサ及び検査装置 |
Family Cites Families (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4749900A (en) * | 1986-11-17 | 1988-06-07 | The Board Of Trustees Of The Leland Stanford Junior University | Multi-layer acoustic transducer for high frequency ultrasound |
| US5898548A (en) | 1997-10-24 | 1999-04-27 | International Business Machines Corporation | Shielded magnetic tunnel junction magnetoresistive read head |
| US6889555B1 (en) * | 1999-07-20 | 2005-05-10 | Fidelica Microsystems, Inc. | Magnetoresistive semiconductor pressure sensors and fingerprint identification/verification sensors using same |
| JP4355439B2 (ja) | 2000-11-09 | 2009-11-04 | 東北リコー株式会社 | 微小圧力検知素子、この素子を用いた装置及び健康監視システム |
| US6473279B2 (en) | 2001-01-04 | 2002-10-29 | International Business Machines Corporation | In-stack single-domain stabilization of free layers for CIP and CPP spin-valve or tunnel-valve read heads |
| JP2002357489A (ja) * | 2001-05-31 | 2002-12-13 | Matsushita Electric Ind Co Ltd | 応力センサー |
| DE10214946B4 (de) * | 2002-04-04 | 2006-01-19 | "Stiftung Caesar" (Center Of Advanced European Studies And Research) | TMR-Sensor |
| JP2005050842A (ja) * | 2003-07-29 | 2005-02-24 | Alps Electric Co Ltd | 交換結合膜及びこの交換結合膜の製造方法並びに前記交換結合膜を用いた磁気検出素子 |
| US7256971B2 (en) | 2004-03-09 | 2007-08-14 | Headway Technologies, Inc. | Process and structure to fabricate CPP spin valve heads for ultra-high recording density |
| US7180716B2 (en) | 2004-03-30 | 2007-02-20 | Headway Technologies, Inc. | Fabrication method for an in-stack stabilized synthetic stitched CPP GMR head |
| DE102004032484B3 (de) * | 2004-07-05 | 2005-11-24 | Infineon Technologies Ag | Sensor und Verfahren zum Herstellen eines Sensors |
| JP2006179566A (ja) * | 2004-12-21 | 2006-07-06 | Tdk Corp | 磁気抵抗効果素子、該磁気抵抗効果素子を備えた薄膜磁気ヘッド、該薄膜磁気ヘッドを備えたヘッドジンバルアセンブリ、該ヘッドジンバルアセンブリを備えた磁気ディスク装置、及び該磁気抵抗効果素子の製造方法 |
| US7690263B2 (en) * | 2006-11-24 | 2010-04-06 | Academia Sinica | Strain sensor and a method of making the same |
| US7974048B2 (en) | 2007-11-28 | 2011-07-05 | Tdk Corporation | Magneto-resistive effect device of CPP type having shield layers coupled with ferromagnetic layers |
| JP5214806B2 (ja) | 2009-09-29 | 2013-06-19 | 株式会社東芝 | 検体認証システム及び検体認証素子 |
| JP5101659B2 (ja) | 2010-05-25 | 2012-12-19 | 株式会社東芝 | 血圧センサ |
| JP5235964B2 (ja) | 2010-09-30 | 2013-07-10 | 株式会社東芝 | 歪検知素子、歪検知素子装置、および血圧センサ |
| JP5443421B2 (ja) | 2011-03-24 | 2014-03-19 | 株式会社東芝 | 磁気抵抗効果素子、磁気ヘッドジンバルアッセンブリ、及び、磁気記録再生装置 |
| JP5665707B2 (ja) * | 2011-09-21 | 2015-02-04 | 株式会社東芝 | 磁気抵抗効果素子、磁気メモリ及び磁気抵抗効果素子の製造方法 |
| JP5677258B2 (ja) * | 2011-09-27 | 2015-02-25 | 株式会社東芝 | 歪検知装置及びその製造方法 |
| JP5740268B2 (ja) * | 2011-09-27 | 2015-06-24 | 株式会社東芝 | 表示装置 |
| JP5766569B2 (ja) | 2011-09-27 | 2015-08-19 | 株式会社東芝 | 脈波伝播速度計測装置 |
| JP5579218B2 (ja) | 2012-03-28 | 2014-08-27 | 株式会社東芝 | 圧力検知素子の製造方法 |
| JP5701807B2 (ja) | 2012-03-29 | 2015-04-15 | 株式会社東芝 | 圧力センサ及びマイクロフォン |
| JP5367877B2 (ja) | 2012-06-19 | 2013-12-11 | 株式会社東芝 | Mems圧力センサ |
| JP5711705B2 (ja) | 2012-09-10 | 2015-05-07 | 株式会社東芝 | 圧力検知素子及びその製造方法 |
| JP2014074606A (ja) | 2012-10-03 | 2014-04-24 | Toshiba Corp | 圧力センサ、音響マイク、血圧センサ及びタッチパネル |
| JP5951454B2 (ja) | 2012-11-20 | 2016-07-13 | 株式会社東芝 | マイクロフォンパッケージ |
| JP6055286B2 (ja) | 2012-11-20 | 2016-12-27 | 株式会社東芝 | 圧力センサ、マイクロフォン、血圧センサ、およびタッチパネル |
| JP5607204B2 (ja) | 2013-04-09 | 2014-10-15 | 株式会社東芝 | Mems圧力センサシステムおよびmems圧力センサ |
| JP6196557B2 (ja) * | 2014-01-20 | 2017-09-13 | 株式会社東芝 | 圧力センサ、マイクロフォン、加速度センサ及び圧力センサの製造方法 |
| JP2015179779A (ja) * | 2014-03-19 | 2015-10-08 | 株式会社東芝 | 歪検出素子、圧力センサ、マイクロフォン、血圧センサ及びタッチパネル |
-
2013
- 2013-09-20 JP JP2013196243A patent/JP6211866B2/ja not_active Expired - Fee Related
-
2014
- 2014-09-03 US US14/476,200 patent/US9654883B2/en not_active Expired - Fee Related
- 2014-09-04 TW TW103130571A patent/TW201522928A/zh unknown
-
2017
- 2017-01-31 US US15/421,283 patent/US10448845B2/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7095813B2 (ja) | 2019-10-21 | 2022-07-05 | 株式会社村田製作所 | センサ、歪検知センサ、圧力センサ、およびマイクロフォン |
Also Published As
| Publication number | Publication date |
|---|---|
| US20190239760A9 (en) | 2019-08-08 |
| JP2015061070A (ja) | 2015-03-30 |
| TW201522928A (zh) | 2015-06-16 |
| US10448845B2 (en) | 2019-10-22 |
| US9654883B2 (en) | 2017-05-16 |
| US20150082901A1 (en) | 2015-03-26 |
| US20170135592A1 (en) | 2017-05-18 |
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