JP6199583B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
- Publication number
- JP6199583B2 JP6199583B2 JP2013052035A JP2013052035A JP6199583B2 JP 6199583 B2 JP6199583 B2 JP 6199583B2 JP 2013052035 A JP2013052035 A JP 2013052035A JP 2013052035 A JP2013052035 A JP 2013052035A JP 6199583 B2 JP6199583 B2 JP 6199583B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- oxide semiconductor
- region
- semiconductor film
- insulating film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
- H10D30/6755—Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6704—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6704—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device
- H10D30/6713—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device characterised by the properties of the source or drain regions, e.g. compositions or sectional shapes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6757—Thin-film transistors [TFT] characterised by the structure of the channel, e.g. transverse or longitudinal shape or doping profile
Landscapes
- Thin Film Transistor (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013052035A JP6199583B2 (ja) | 2012-04-27 | 2013-03-14 | 半導体装置 |
| US13/865,435 US9236490B2 (en) | 2012-04-27 | 2013-04-18 | Transistor including oxide semiconductor film having regions of different thickness |
| KR1020130043200A KR102053762B1 (ko) | 2012-04-27 | 2013-04-18 | 반도체 장치 |
| TW102113970A TWI594429B (zh) | 2012-04-27 | 2013-04-19 | 半導體裝置 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012103551 | 2012-04-27 | ||
| JP2012103551 | 2012-04-27 | ||
| JP2013052035A JP6199583B2 (ja) | 2012-04-27 | 2013-03-14 | 半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013243343A JP2013243343A (ja) | 2013-12-05 |
| JP2013243343A5 JP2013243343A5 (enExample) | 2016-04-28 |
| JP6199583B2 true JP6199583B2 (ja) | 2017-09-20 |
Family
ID=49476510
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013052035A Expired - Fee Related JP6199583B2 (ja) | 2012-04-27 | 2013-03-14 | 半導体装置 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US9236490B2 (enExample) |
| JP (1) | JP6199583B2 (enExample) |
| KR (1) | KR102053762B1 (enExample) |
| TW (1) | TWI594429B (enExample) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9318484B2 (en) | 2013-02-20 | 2016-04-19 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| DE102014203176A1 (de) * | 2014-02-21 | 2015-09-10 | MAHLE Behr GmbH & Co. KG | Thermoelektrische Vorrichtung, insbesondere thermoelektrischer Generator oder Wärmepumpe |
| JP2015204368A (ja) * | 2014-04-14 | 2015-11-16 | 日本放送協会 | 薄膜トランジスタおよび表示装置 |
| KR102280449B1 (ko) * | 2015-01-19 | 2021-07-23 | 삼성디스플레이 주식회사 | 산화물 박막트랜지스터의 제조방법 |
| WO2017158967A1 (ja) * | 2016-03-18 | 2017-09-21 | 三菱電機株式会社 | 薄膜トランジスタ、薄膜トランジスタ基板、液晶表示装置および薄膜トランジスタの製造方法 |
| KR102867884B1 (ko) | 2016-12-19 | 2025-10-02 | 삼성디스플레이 주식회사 | 트랜지스터 표시판 및 그 제조 방법 |
| WO2019139577A1 (en) * | 2018-01-10 | 2019-07-18 | Intel Corporation | Thin-film transistors with low contact resistance |
| JP2020107622A (ja) * | 2018-12-26 | 2020-07-09 | 株式会社ジャパンディスプレイ | 表示装置及び半導体装置 |
| CN113284915A (zh) * | 2021-05-24 | 2021-08-20 | 信利半导体有限公司 | 一种双栅π型薄膜晶体管光学感应器的制作方法及光学感应器及电子设备 |
| CN113388823A (zh) * | 2021-06-11 | 2021-09-14 | 苏州尚勤光电科技有限公司 | 一种氧化镓mocvd装置 |
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| JP2009105390A (ja) | 2007-10-05 | 2009-05-14 | Semiconductor Energy Lab Co Ltd | 半導体装置およびその作製方法 |
| KR101455304B1 (ko) * | 2007-10-05 | 2014-11-03 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 박막트랜지스터, 및 박막트랜지스터를 가지는 표시장치, 및그들의 제작방법 |
| TWI521712B (zh) | 2007-12-03 | 2016-02-11 | 半導體能源研究所股份有限公司 | 薄膜電晶體,包括該薄膜電晶體的顯示裝置,和其製造方法 |
| US8202365B2 (en) | 2007-12-17 | 2012-06-19 | Fujifilm Corporation | Process for producing oriented inorganic crystalline film, and semiconductor device using the oriented inorganic crystalline film |
| WO2009093462A1 (ja) * | 2008-01-25 | 2009-07-30 | Sharp Kabushiki Kaisha | 半導体素子およびその製造方法 |
| TWI500159B (zh) | 2008-07-31 | 2015-09-11 | Semiconductor Energy Lab | 半導體裝置和其製造方法 |
| JP4623179B2 (ja) | 2008-09-18 | 2011-02-02 | ソニー株式会社 | 薄膜トランジスタおよびその製造方法 |
| KR102668391B1 (ko) * | 2008-09-19 | 2024-05-24 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| JP5451280B2 (ja) | 2008-10-09 | 2014-03-26 | キヤノン株式会社 | ウルツ鉱型結晶成長用基板およびその製造方法ならびに半導体装置 |
| KR101667909B1 (ko) * | 2008-10-24 | 2016-10-28 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체장치의 제조방법 |
| EP2478563B1 (en) * | 2009-09-16 | 2021-04-07 | Semiconductor Energy Laboratory Co, Ltd. | Method for manufacturing a samesemiconductor device |
| TWI512997B (zh) * | 2009-09-24 | 2015-12-11 | Semiconductor Energy Lab | 半導體裝置,電源電路,和半導體裝置的製造方法 |
| US8803143B2 (en) | 2010-10-20 | 2014-08-12 | Semiconductor Energy Laboratory Co., Ltd. | Thin film transistor including buffer layers with high resistivity |
| US8569754B2 (en) | 2010-11-05 | 2013-10-29 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
-
2013
- 2013-03-14 JP JP2013052035A patent/JP6199583B2/ja not_active Expired - Fee Related
- 2013-04-18 KR KR1020130043200A patent/KR102053762B1/ko not_active Expired - Fee Related
- 2013-04-18 US US13/865,435 patent/US9236490B2/en active Active
- 2013-04-19 TW TW102113970A patent/TWI594429B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| TW201351648A (zh) | 2013-12-16 |
| KR102053762B1 (ko) | 2019-12-09 |
| KR20130121723A (ko) | 2013-11-06 |
| US9236490B2 (en) | 2016-01-12 |
| JP2013243343A (ja) | 2013-12-05 |
| TWI594429B (zh) | 2017-08-01 |
| US20130285047A1 (en) | 2013-10-31 |
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