JP6194752B2 - 記憶素子、記憶装置、磁気ヘッド - Google Patents

記憶素子、記憶装置、磁気ヘッド Download PDF

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Publication number
JP6194752B2
JP6194752B2 JP2013223352A JP2013223352A JP6194752B2 JP 6194752 B2 JP6194752 B2 JP 6194752B2 JP 2013223352 A JP2013223352 A JP 2013223352A JP 2013223352 A JP2013223352 A JP 2013223352A JP 6194752 B2 JP6194752 B2 JP 6194752B2
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JP
Japan
Prior art keywords
layer
magnetization
storage
magnetization fixed
magnetic
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Expired - Fee Related
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JP2013223352A
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English (en)
Japanese (ja)
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JP2015088520A5 (enExample
JP2015088520A (ja
Inventor
一陽 山根
一陽 山根
細見　政功
政功 細見
大森　広之
広之 大森
別所　和宏
和宏 別所
肥後　豊
豊 肥後
裕行 内田
裕行 内田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
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Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP2013223352A priority Critical patent/JP6194752B2/ja
Priority to TW103134937A priority patent/TWI639155B/zh
Priority to PCT/JP2014/005318 priority patent/WO2015064049A1/en
Priority to US15/031,092 priority patent/US9818932B2/en
Priority to CN201480057802.4A priority patent/CN105684178B/zh
Publication of JP2015088520A publication Critical patent/JP2015088520A/ja
Publication of JP2015088520A5 publication Critical patent/JP2015088520A5/ja
Application granted granted Critical
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N50/00—Galvanomagnetic devices
    • H10N50/80—Constructional details
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
    • G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
    • G11C11/161—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect details concerning the memory cell structure, e.g. the layers of the ferromagnetic memory cell
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
    • G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
    • G11C11/165—Auxiliary circuits
    • G11C11/1675—Writing or programming circuits or methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F10/00—Thin magnetic films, e.g. of one-domain structure
    • H01F10/08—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers
    • H01F10/10—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition
    • H01F10/12—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition being metals or alloys
    • H01F10/123—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition being metals or alloys having a L10 crystallographic structure, e.g. [Co,Fe][Pt,Pd] thin films
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F10/00—Thin magnetic films, e.g. of one-domain structure
    • H01F10/32—Spin-exchange-coupled multilayers, e.g. nanostructured superlattices
    • H01F10/324—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer
    • H01F10/3286—Spin-exchange coupled multilayers having at least one layer with perpendicular magnetic anisotropy
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N50/00—Galvanomagnetic devices
    • H10N50/10—Magnetoresistive devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N50/00—Galvanomagnetic devices
    • H10N50/80—Constructional details
    • H10N50/85—Materials of the active region
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F10/00—Thin magnetic films, e.g. of one-domain structure
    • H01F10/32—Spin-exchange-coupled multilayers, e.g. nanostructured superlattices
    • H01F10/324—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer
    • H01F10/3268—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer the exchange coupling being asymmetric, e.g. by use of additional pinning, by using antiferromagnetic or ferromagnetic coupling interface, i.e. so-called spin-valve [SV] structure, e.g. NiFe/Cu/NiFe/FeMn
    • H01F10/3272—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer the exchange coupling being asymmetric, e.g. by use of additional pinning, by using antiferromagnetic or ferromagnetic coupling interface, i.e. so-called spin-valve [SV] structure, e.g. NiFe/Cu/NiFe/FeMn by use of anti-parallel coupled [APC] ferromagnetic layers, e.g. artificial ferrimagnets [AFI], artificial [AAF] or synthetic [SAF] anti-ferromagnets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F10/00—Thin magnetic films, e.g. of one-domain structure
    • H01F10/32—Spin-exchange-coupled multilayers, e.g. nanostructured superlattices
    • H01F10/324—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer
    • H01F10/329—Spin-exchange coupled multilayers wherein the magnetisation of the free layer is switched by a spin-polarised current, e.g. spin torque effect
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B61/00—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices
    • H10B61/20—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices comprising components having three or more electrodes, e.g. transistors
    • H10B61/22—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices comprising components having three or more electrodes, e.g. transistors of the field-effect transistor [FET] type

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Mram Or Spin Memory Techniques (AREA)
  • Hall/Mr Elements (AREA)
  • Magnetic Heads (AREA)
JP2013223352A 2013-10-28 2013-10-28 記憶素子、記憶装置、磁気ヘッド Expired - Fee Related JP6194752B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2013223352A JP6194752B2 (ja) 2013-10-28 2013-10-28 記憶素子、記憶装置、磁気ヘッド
TW103134937A TWI639155B (zh) 2013-10-28 2014-10-07 儲存元件、儲存裝置及磁頭
PCT/JP2014/005318 WO2015064049A1 (en) 2013-10-28 2014-10-20 Stt mram and magnetic head
US15/031,092 US9818932B2 (en) 2013-10-28 2014-10-20 Storage element, storage device, and magnetic head
CN201480057802.4A CN105684178B (zh) 2013-10-28 2014-10-20 基于自旋力矩转移的磁性随机存取储存器(stt-mram)和磁头

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013223352A JP6194752B2 (ja) 2013-10-28 2013-10-28 記憶素子、記憶装置、磁気ヘッド

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2017154321A Division JP2017212464A (ja) 2017-08-09 2017-08-09 記憶素子、記憶装置、磁気ヘッド

Publications (3)

Publication Number Publication Date
JP2015088520A JP2015088520A (ja) 2015-05-07
JP2015088520A5 JP2015088520A5 (enExample) 2016-02-25
JP6194752B2 true JP6194752B2 (ja) 2017-09-13

Family

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JP2013223352A Expired - Fee Related JP6194752B2 (ja) 2013-10-28 2013-10-28 記憶素子、記憶装置、磁気ヘッド

Country Status (5)

Country Link
US (1) US9818932B2 (enExample)
JP (1) JP6194752B2 (enExample)
CN (1) CN105684178B (enExample)
TW (1) TWI639155B (enExample)
WO (1) WO2015064049A1 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102451098B1 (ko) 2015-09-23 2022-10-05 삼성전자주식회사 자기 메모리 장치 및 이의 제조 방법
US11563169B2 (en) 2015-11-18 2023-01-24 Tohoku University Magnetic tunnel junction element and magnetic memory
US10490732B2 (en) 2016-03-11 2019-11-26 Toshiba Memory Corporation Magnetic memory device with sidewall layer containing boron and manufacturing method thereof
JP2017195269A (ja) 2016-04-20 2017-10-26 ソニー株式会社 磁気記憶素子
JP2018032805A (ja) * 2016-08-26 2018-03-01 ソニー株式会社 磁気抵抗素子及び電子デバイス
TWI688131B (zh) * 2016-09-14 2020-03-11 日商東芝記憶體股份有限公司 半導體裝置
JP7018652B2 (ja) * 2017-01-18 2022-02-14 国立大学法人東北大学 磁気抵抗効果素子、磁気メモリ及び磁気抵抗効果素子の製造方法
JP2020068214A (ja) * 2017-02-28 2020-04-30 Tdk株式会社 強磁性多層膜、磁気抵抗効果素子、及び強磁性多層膜を製造する方法
US9911483B1 (en) 2017-03-21 2018-03-06 International Business Machines Corporation Thermally-assisted spin transfer torque memory with improved bit error rate performance
JP2019054095A (ja) 2017-09-14 2019-04-04 東芝メモリ株式会社 磁気抵抗素子
US10727401B2 (en) * 2017-11-10 2020-07-28 Taiwan Semiconductor Manufacturing Co., Ltd. Magnetic random access memory
CN113517015B (zh) * 2021-04-29 2024-05-14 中国科学院上海微系统与信息技术研究所 一种实现存储单元多级存储的方法及装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6130814A (en) 1998-07-28 2000-10-10 International Business Machines Corporation Current-induced magnetic switching device and memory including the same
JP2003017782A (ja) 2001-07-04 2003-01-17 Rikogaku Shinkokai キャリヤスピン注入磁化反転型磁気抵抗効果膜と該膜を用いた不揮発性メモリー素子及び該素子を用いたメモリー装置
JP2008028362A (ja) * 2006-06-22 2008-02-07 Toshiba Corp 磁気抵抗素子及び磁気メモリ
US20070297220A1 (en) * 2006-06-22 2007-12-27 Masatoshi Yoshikawa Magnetoresistive element and magnetic memory
US8374025B1 (en) * 2007-02-12 2013-02-12 Avalanche Technology, Inc. Spin-transfer torque magnetic random access memory (STTMRAM) with laminated free layer
US20090218645A1 (en) * 2007-02-12 2009-09-03 Yadav Technology Inc. multi-state spin-torque transfer magnetic random access memory
DE102007007874A1 (de) * 2007-02-14 2008-08-21 Evonik Degussa Gmbh Verfahren zur Herstellung höherer Silane
JP4682998B2 (ja) 2007-03-15 2011-05-11 ソニー株式会社 記憶素子及びメモリ
JP2009239121A (ja) * 2008-03-27 2009-10-15 Toshiba Corp 磁気抵抗効果素子及び磁気ランダムアクセスメモリ
US8223533B2 (en) * 2008-09-26 2012-07-17 Kabushiki Kaisha Toshiba Magnetoresistive effect device and magnetic memory
JP5203871B2 (ja) * 2008-09-26 2013-06-05 株式会社東芝 磁気抵抗効果素子及び磁気メモリ
JP2012043967A (ja) 2010-08-19 2012-03-01 Sony Corp 磁気メモリ素子

Also Published As

Publication number Publication date
WO2015064049A1 (en) 2015-05-07
CN105684178A (zh) 2016-06-15
TW201532040A (zh) 2015-08-16
US20160268496A1 (en) 2016-09-15
TWI639155B (zh) 2018-10-21
JP2015088520A (ja) 2015-05-07
US9818932B2 (en) 2017-11-14
CN105684178B (zh) 2019-02-01

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