JP6174625B2 - 研磨方法及び組成調整剤 - Google Patents

研磨方法及び組成調整剤 Download PDF

Info

Publication number
JP6174625B2
JP6174625B2 JP2015104552A JP2015104552A JP6174625B2 JP 6174625 B2 JP6174625 B2 JP 6174625B2 JP 2015104552 A JP2015104552 A JP 2015104552A JP 2015104552 A JP2015104552 A JP 2015104552A JP 6174625 B2 JP6174625 B2 JP 6174625B2
Authority
JP
Japan
Prior art keywords
polishing
composition
water
soluble polymer
polishing composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2015104552A
Other languages
English (en)
Japanese (ja)
Other versions
JP2016215336A5 (OSRAM
JP2016215336A (ja
Inventor
博之 織田
博之 織田
高見　信一郎
信一郎 高見
修平 ▲高▼橋
修平 ▲高▼橋
誠 田畑
誠 田畑
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujimi Inc
Original Assignee
Fujimi Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujimi Inc filed Critical Fujimi Inc
Priority to JP2015104552A priority Critical patent/JP6174625B2/ja
Priority to KR1020177023361A priority patent/KR102574629B1/ko
Priority to PCT/JP2016/064226 priority patent/WO2016190128A1/ja
Priority to TW109122108A priority patent/TW202041646A/zh
Priority to TW105115551A priority patent/TWI758249B/zh
Publication of JP2016215336A publication Critical patent/JP2016215336A/ja
Publication of JP2016215336A5 publication Critical patent/JP2016215336A5/ja
Application granted granted Critical
Publication of JP6174625B2 publication Critical patent/JP6174625B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/12—Devices for exhausting mist of oil or coolant; Devices for collecting or recovering materials resulting from grinding or polishing, e.g. of precious metals, precious stones, diamonds or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
JP2015104552A 2015-05-22 2015-05-22 研磨方法及び組成調整剤 Active JP6174625B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2015104552A JP6174625B2 (ja) 2015-05-22 2015-05-22 研磨方法及び組成調整剤
KR1020177023361A KR102574629B1 (ko) 2015-05-22 2016-05-13 연마 방법 및 조성 조정제
PCT/JP2016/064226 WO2016190128A1 (ja) 2015-05-22 2016-05-13 研磨方法及び組成調整剤
TW109122108A TW202041646A (zh) 2015-05-22 2016-05-19 研磨方法及組成調整劑
TW105115551A TWI758249B (zh) 2015-05-22 2016-05-19 研磨方法及組成調整劑

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015104552A JP6174625B2 (ja) 2015-05-22 2015-05-22 研磨方法及び組成調整剤

Publications (3)

Publication Number Publication Date
JP2016215336A JP2016215336A (ja) 2016-12-22
JP2016215336A5 JP2016215336A5 (OSRAM) 2017-06-29
JP6174625B2 true JP6174625B2 (ja) 2017-08-02

Family

ID=57392757

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015104552A Active JP6174625B2 (ja) 2015-05-22 2015-05-22 研磨方法及び組成調整剤

Country Status (4)

Country Link
JP (1) JP6174625B2 (OSRAM)
KR (1) KR102574629B1 (OSRAM)
TW (2) TWI758249B (OSRAM)
WO (1) WO2016190128A1 (OSRAM)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102478439B1 (ko) * 2018-01-18 2022-12-15 쇼와덴코머티리얼즈가부시끼가이샤 연마액, 연마액 세트 및 연마 방법
US10683439B2 (en) * 2018-03-15 2020-06-16 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing composition and method of polishing a substrate having enhanced defect inhibition
JP7237933B2 (ja) * 2018-03-28 2023-03-13 株式会社フジミインコーポレーテッド 研磨用組成物
JP7253335B2 (ja) * 2018-07-31 2023-04-06 株式会社フジミインコーポレーテッド 研磨用組成物、その製造方法および研磨用組成物を用いた研磨方法
TWI794474B (zh) * 2019-04-15 2023-03-01 日商昭和電工材料股份有限公司 研磨液、研磨液套組及研磨方法
KR102804301B1 (ko) * 2023-10-04 2025-05-12 주식회사 플롯퍼실리티스 반도체 공정 챔버 내 오염물 세정용 패드

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5598607U (OSRAM) 1978-12-28 1980-07-09
JP5148948B2 (ja) * 2007-08-23 2013-02-20 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 研磨用スラリーのリサイクル方法
JP5297695B2 (ja) * 2008-05-30 2013-09-25 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 スラリー供給装置及び同装置を用いる半導体ウェーハの研磨方法
JP5760403B2 (ja) * 2010-11-24 2015-08-12 株式会社Sumco 薬液リサイクル方法および該方法に用いる装置
US20130302984A1 (en) * 2011-01-26 2013-11-14 Fujimi Incorporated Polishing composition, polishing method using same, and substrate production method
JP5656960B2 (ja) * 2012-11-14 2015-01-21 株式会社フジミインコーポレーテッド Ｌｐｄ低減剤及びそれを用いたシリコンウエハの欠陥低減方法
JP5843036B1 (ja) * 2015-06-23 2016-01-13 コニカミノルタ株式会社 再生研磨材スラリーの調製方法

Also Published As

Publication number Publication date
WO2016190128A1 (ja) 2016-12-01
KR20180011046A (ko) 2018-01-31
TWI758249B (zh) 2022-03-21
TW202041646A (zh) 2020-11-16
JP2016215336A (ja) 2016-12-22
KR102574629B1 (ko) 2023-09-06
TW201710458A (zh) 2017-03-16

Similar Documents

Publication Publication Date Title
JP6193959B2 (ja) リンス用組成物及びリンス方法
JP6829191B2 (ja) 研磨方法
JP6174625B2 (ja) 研磨方法及び組成調整剤
TW201702347A (zh) 矽晶圓研磨用組成物及研磨方法
TWI814722B (zh) 研磨用組成物及研磨方法
KR20170021230A (ko) 실리콘 웨이퍼 연마용 조성물
JP6649828B2 (ja) シリコン基板の研磨方法および研磨用組成物セット
KR102617007B1 (ko) 기판의 연마 방법 및 연마용 조성물 세트
JPWO2016143323A1 (ja) 研磨用組成物及びシリコン基板の研磨方法
JP6691774B2 (ja) 研磨用組成物およびその製造方法
JPWO2018088371A1 (ja) 研磨用組成物及びシリコンウェーハの研磨方法
CN108966673B (zh) 硅基板的研磨方法和研磨用组合物套组
JP7253335B2 (ja) 研磨用組成物、その製造方法および研磨用組成物を用いた研磨方法
JP6829192B2 (ja) 研磨方法
JP6373029B2 (ja) 研磨用組成物
JP2016207875A (ja) 研磨方法
JPWO2018088370A1 (ja) 研磨用組成物及びシリコンウェーハの研磨方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20170512

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20170512

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20170512

TRDD Decision of grant or rejection written
A975 Report on accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A971005

Effective date: 20170612

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20170620

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20170706

R150 Certificate of patent or registration of utility model

Ref document number: 6174625

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250