TWI758249B - 研磨方法及組成調整劑 - Google Patents

研磨方法及組成調整劑 Download PDF

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Publication number
TWI758249B
TWI758249B TW105115551A TW105115551A TWI758249B TW I758249 B TWI758249 B TW I758249B TW 105115551 A TW105115551 A TW 105115551A TW 105115551 A TW105115551 A TW 105115551A TW I758249 B TWI758249 B TW I758249B
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TW
Taiwan
Prior art keywords
polishing
composition
water
polishing composition
soluble polymer
Prior art date
Application number
TW105115551A
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English (en)
Chinese (zh)
Other versions
TW201710458A (zh
Inventor
織田博之
高見信一郎
髙橋修平
田畑誠
Original Assignee
日商福吉米股份有限公司
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Publication date
Application filed by 日商福吉米股份有限公司 filed Critical 日商福吉米股份有限公司
Publication of TW201710458A publication Critical patent/TW201710458A/zh
Application granted granted Critical
Publication of TWI758249B publication Critical patent/TWI758249B/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/12—Devices for exhausting mist of oil or coolant; Devices for collecting or recovering materials resulting from grinding or polishing, e.g. of precious metals, precious stones, diamonds or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
TW105115551A 2015-05-22 2016-05-19 研磨方法及組成調整劑 TWI758249B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015-104552 2015-05-22
JP2015104552A JP6174625B2 (ja) 2015-05-22 2015-05-22 研磨方法及び組成調整剤

Publications (2)

Publication Number Publication Date
TW201710458A TW201710458A (zh) 2017-03-16
TWI758249B true TWI758249B (zh) 2022-03-21

Family

ID=57392757

Family Applications (2)

Application Number Title Priority Date Filing Date
TW109122108A TW202041646A (zh) 2015-05-22 2016-05-19 研磨方法及組成調整劑
TW105115551A TWI758249B (zh) 2015-05-22 2016-05-19 研磨方法及組成調整劑

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW109122108A TW202041646A (zh) 2015-05-22 2016-05-19 研磨方法及組成調整劑

Country Status (4)

Country Link
JP (1) JP6174625B2 (OSRAM)
KR (1) KR102574629B1 (OSRAM)
TW (2) TW202041646A (OSRAM)
WO (1) WO2016190128A1 (OSRAM)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019142292A1 (ja) * 2018-01-18 2019-07-25 日立化成株式会社 研磨液、研磨液セット及び研磨方法
US10683439B2 (en) * 2018-03-15 2020-06-16 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing composition and method of polishing a substrate having enhanced defect inhibition
WO2019189124A1 (ja) * 2018-03-28 2019-10-03 株式会社フジミインコーポレーテッド 研磨用組成物
JP7253335B2 (ja) * 2018-07-31 2023-04-06 株式会社フジミインコーポレーテッド 研磨用組成物、その製造方法および研磨用組成物を用いた研磨方法
TWI794474B (zh) * 2019-04-15 2023-03-01 日商昭和電工材料股份有限公司 研磨液、研磨液套組及研磨方法
KR102804301B1 (ko) * 2023-10-04 2025-05-12 주식회사 플롯퍼실리티스 반도체 공정 챔버 내 오염물 세정용 패드

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200918653A (en) * 2007-08-23 2009-05-01 Sumco Techxiv Corp Recycling method of polishing slurry
JP2012114225A (ja) * 2010-11-24 2012-06-14 Sumco Corp 薬液リサイクル方法および該方法に用いる装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5598607U (OSRAM) 1978-12-28 1980-07-09
JP5297695B2 (ja) * 2008-05-30 2013-09-25 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 スラリー供給装置及び同装置を用いる半導体ウェーハの研磨方法
US20130302984A1 (en) * 2011-01-26 2013-11-14 Fujimi Incorporated Polishing composition, polishing method using same, and substrate production method
JP5656960B2 (ja) * 2012-11-14 2015-01-21 株式会社フジミインコーポレーテッド Ｌｐｄ低減剤及びそれを用いたシリコンウエハの欠陥低減方法
JP5843036B1 (ja) * 2015-06-23 2016-01-13 コニカミノルタ株式会社 再生研磨材スラリーの調製方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200918653A (en) * 2007-08-23 2009-05-01 Sumco Techxiv Corp Recycling method of polishing slurry
JP2012114225A (ja) * 2010-11-24 2012-06-14 Sumco Corp 薬液リサイクル方法および該方法に用いる装置

Also Published As

Publication number Publication date
KR102574629B1 (ko) 2023-09-06
TW202041646A (zh) 2020-11-16
KR20180011046A (ko) 2018-01-31
JP2016215336A (ja) 2016-12-22
TW201710458A (zh) 2017-03-16
WO2016190128A1 (ja) 2016-12-01
JP6174625B2 (ja) 2017-08-02

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