JP6172654B2 - 部品加圧装置及び部品加圧装置を用いた加熱システム - Google Patents
部品加圧装置及び部品加圧装置を用いた加熱システム Download PDFInfo
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- JP6172654B2 JP6172654B2 JP2013051682A JP2013051682A JP6172654B2 JP 6172654 B2 JP6172654 B2 JP 6172654B2 JP 2013051682 A JP2013051682 A JP 2013051682A JP 2013051682 A JP2013051682 A JP 2013051682A JP 6172654 B2 JP6172654 B2 JP 6172654B2
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- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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- H01L2924/1204—Optical Diode
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
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- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
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Description
先ず、電子部品に対して加圧を行い電子部品を基板に押し付ける部品加圧装置の構成について説明する(図1及び図2参照)。
次に、部品加圧装置1に対して加熱を行う加熱炉の構成について説明する(図3参照)。加熱炉は部品加圧装置1を用いた加熱システムにおいて使用され、後述する複数の電子部品を後述する基板に固相拡散により接合するために、部品加圧装置1に対して加熱を行う機能を有する。
次に、部品加圧装置1の配置空間7に配置される回路基板の一例について概略を説明する(図4参照)。
以下に、電子部品52、52、・・・の基板51に対する固相拡散接合の手順について説明する(図5乃至図12参照)。固相拡散接合は、部品加圧装置1を用いた加熱システムにおいて、所定の温度と圧力を加えて電子部品52の電極端子52aと基板51の電極51aとを接合することにより行われる。
次に、部品加圧装置の第1の変形例について説明する(図13参照)。
次に、部品加圧装置の第2の変形例について説明する(図14参照)。
次に、部品加圧装置の第3の変形例について説明する(図15参照)。
以上に記載した通り、部品加圧装置1、1A、1B、1Cにあっては、オイル封止材14、14A、14Bが高さの異なる複数の電子部品52、52、・・・に接して加圧が行われオイル17の圧力によって各電極端子52a、52a、・・・がそれぞれ基板51の各電極51a、51a、・・・に押し付けられる。
上記には、電子部品52の電極端子52aを基板51の電極51aに固相拡散により接合する例を示したが、本発明は、例えば、半導体チップ(電子部品)同士を接合し複合部品化する所謂チップオンチップや半導体パッケージ等における電極の接合等の実装基板(回路基板)や半導体装置の分野に広く適用することが可能である。
2…ベースケース
3…第1のベース
4…第2のベース
7…配置空間
9…油圧変化部
14…オイル封止材
20…加熱炉
21b…投入口
21c…取出口
23…コンベア
24…ヒーター
51…基板
51a…電極
52…電子部品
52a…電極端子
1A…部品加圧装置
2A…ベースケース
14A…オイル封止材
1B…部品加圧装置
9B…油圧変化部
14B…オイル封止材
41…蛇腹部
1C…部品加圧装置
9C…油圧変化部
Claims (5)
- 高さが異なる少なくとも二つの電子部品を含む複数の電子部品の電極端子を基板の複数の電極にそれぞれ押し付ける部品加圧装置であって、
結合及び分離可能な第1のベースと第2のベースを有し前記第1のベースと前記第2のベースが結合された状態において内部に前記基板と前記電子部品が配置される配置空間が形成されるベースケースと、
前記配置空間において封止されたオイルと、
前記配置空間に前記オイルを封止すると共に前記オイルの圧力に応じて変形されるオイル封止材と、
前記ベースケースに支持され前記オイルの圧力を変化させる油圧変化部とを備え、
前記オイル封止材は外周部が前記ベースケースに取り付けられると共に前記配置空間を分割し、
前記オイルは前記ベースケースの一部と前記オイル封止材によって封止され、
前記各電極端子がそれぞれ前記各電極に位置合わせされて載置された状態で前記配置空間に前記基板と前記複数の電子部品とが配置されたときに、前記油圧変化部により前記オイルの圧力が変化されて前記オイル封止材の前記複数の電子部品に対する加圧が行われ、
前記各電極端子がそれぞれ前記各電極に押し付けられるようにした
部品加圧装置。 - 前記油圧変化部が前記ベースケースに対して変位されることにより前記オイルの圧力が変化される
請求項1に記載の部品加圧装置。 - 前記オイル封止材に、前記電子部品に離接する方向において伸縮される複数の蛇腹部が設けられ、
前記複数の電子部品にそれぞれ前記複数の蛇腹部が接し前記蛇腹部が前記電子部品の高さに応じて伸縮されるようにした
請求項1に記載の部品加圧装置。 - 高さが異なる少なくとも二つの電子部品を含む複数の電子部品の電極端子を基板の複数の電極にそれぞれ押し付ける部品加圧装置を用いた加熱システムであって、
前記部品加圧装置は、
結合及び分離可能な第1のベースと第2のベースを有し前記第1のベースと前記第2のベースが結合された状態において内部に前記基板と前記電子部品が配置される配置空間が形成されるベースケースと、
前記配置空間において封止されたオイルと、
前記配置空間に前記オイルを封止すると共に前記オイルの圧力に応じて変形されるオイル封止材と、
前記ベースケースに支持され前記オイルの圧力を変化させる油圧変化部とを備え、
前記オイル封止材は外周部が前記ベースケースに取り付けられると共に前記配置空間を分割し、
前記オイルは前記ベースケースの一部と前記オイル封止材によって封止され、
前記各電極端子がそれぞれ前記各電極に位置合わせされて載置された状態で前記配置空間に前記基板と前記複数の電子部品とが配置されたときに、前記油圧変化部により前記オイルの圧力が変化されて前記オイル封止材の前記複数の電子部品に対する加圧が行われ、
前記各電極端子がそれぞれ前記各電極に押し付けられるようにし、
前記オイル封止材の前記複数の電子部品に対する加圧が行われた状態で前記部品加圧装置がヒーターを有する加熱炉において加熱されるようにした
部品加圧装置を用いた加熱システム。 - 前記加熱炉に前記部品加圧装置が投入される投入口と投入された前記部品加圧装置が取り出される取出口とが形成され、
前記加熱炉に前記部品加圧装置を前記投入口から前記取出口まで搬送するコンベアが設けられた
請求項4に記載の部品加圧装置を用いた加熱システム。
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