JP6158959B2 - 小型化された多コンポーネント部品および製造方法 - Google Patents
小型化された多コンポーネント部品および製造方法 Download PDFInfo
- Publication number
- JP6158959B2 JP6158959B2 JP2015560596A JP2015560596A JP6158959B2 JP 6158959 B2 JP6158959 B2 JP 6158959B2 JP 2015560596 A JP2015560596 A JP 2015560596A JP 2015560596 A JP2015560596 A JP 2015560596A JP 6158959 B2 JP6158959 B2 JP 6158959B2
- Authority
- JP
- Japan
- Prior art keywords
- thin film
- circuit component
- component
- dsa
- film cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 239000010409 thin film Substances 0.000 claims description 52
- 239000004020 conductor Substances 0.000 claims description 9
- 239000010408 film Substances 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 6
- 238000010295 mobile communication Methods 0.000 claims description 5
- 230000005540 biological transmission Effects 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 239000003990 capacitor Substances 0.000 claims description 3
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 230000008021 deposition Effects 0.000 claims description 2
- 239000012528 membrane Substances 0.000 claims description 2
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 claims description 2
- 239000000758 substrate Substances 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 230000006698 induction Effects 0.000 description 2
- 230000001939 inductive effect Effects 0.000 description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000010897 surface acoustic wave method Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000012447 hatching Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000000284 resting effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
- H03H9/0542—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a lateral arrangement
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
- H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
- H03H9/0566—Constructional combinations of supports or holders with electromechanical or other electronic elements for duplexers
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1057—Mounting in enclosures for microelectro-mechanical devices
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Micromachines (AREA)
Description
− 支持体を準備するステップ、
− 支持体上に第1の機能構造物を配置するステップ、
− 薄膜カバーにより第1の機能構造物を覆うステップ、
− 薄膜カバー上に第1の回路コンポーネントを形成するステップ、
− 第1の回路コンポーネントを第1の機能構造物と接続するステップ
を含んでいる。
B 部品
BAWS BAW構造物
DK ビア
DSA 薄膜カバー
DU デュプレクサ
FS 機能構造物
GBAWS GBAW構造物
H 空洞
MEMSS MEMS構造物
PR 並列共振器
RX 受信フィルタ
SAWS SAW構造物
SB はんだボール
SK 回路コンポーネント
SR 直列共振器
TR 支持体
TX 送信フィルタ
W コイル
Z 導線
Claims (8)
- 支持体(TR)、
前記支持体(TR)上の、機能構造物(FS)としての、音波によって動作する多数の直列共振器(SR)及び多数の並列共振器(PR)、
前記機能構造物(FS)を覆う薄膜カバー(DSA)、
前記薄膜カバー(DSA)の上の第1の回路コンポーネント(SK)を含む部品(B)であって、
前記第1の回路コンポーネント(SK)が、導線(Z)を介して前記機能構造物(FS)と接続されており、
その際、前記多数の直列共振器(SR)は、全体として単一の薄膜カバー(DSA)を有しており、この薄膜カバー(DSA)内で、1つの空洞内にまとめて、または共通の膜の下の幾つかの空洞内に配置されており、
前記多数の並列共振器(PR)はそれぞれ、自らの空洞を備えたそれ自体の薄膜カバー(DSA)を有しており、
前記機能構造物(FS)はHFフィルタへと接続されており、
前記第1の回路コンポーネント(SK)は、前記HFフィルタのためのインピーダンス整合素子である部品(B)。 - 前記第1の回路コンポーネント(SK)が、誘導素子、容量素子、抵抗素子、能動回路素子を備えたSMDから選択される、請求項1に記載の部品(B)。
- さらに、前記支持体(TR)上に端子パッド(AP)を含み、前記端子パッド(AP)が前記導線(Z)と接続されており、かつ前記端子パッド(AP)を介して前記機能構造物(FS)の1つが前記第1の回路コンポーネント(SK)と接続されている、請求項1または2に記載の部品(B)。
- さらに、前記機能構造物(FS)の上方に、前記機能構造物(FS)と接続された1つまたは複数のさらなる回路コンポーネントを含んでいる、請求項1から3のいずれか一項に記載の部品(B)。
- モバイル通信機器内で使用するための送信フィルタ、受信フィルタ、またはデュプレクサである、請求項1から4のいずれか一項に記載の部品(B)。
- 前記第1の回路コンポーネント(SK)が、
窒化チタンもしくは窒化タンタルから成る薄膜抵抗であるか、または2つの導電膜の間に少なくとも1つの誘電膜を備えた薄膜コンデンサである、請求項1から5のいずれか一項に記載の部品(B)。 - 請求項1から6のいずれか一項に記載の部品(B)の製造方法であって、
前記支持体(TR)を準備するステップ、
前記支持体(TR)上に前記機能構造物(FS)を配置するステップ、
前記薄膜カバー(DSA)により前記機能構造物(FS)を覆うステップ、
前記薄膜カバー(DSA)上に前記第1の回路コンポーネント(SK)を形成するステップ、
前記第1の回路コンポーネント(SK)を前記機能構造物(FS)と接続するステップを含んでいる方法。 - 前記第1の回路コンポーネント(SK)を形成するために、前記薄膜カバー(DSA)上に金属膜が堆積および構造化され、かつ
前記金属膜の堆積が、形成と同時に、前記第1の回路コンポーネント(SK)の材料と前記機能構造物(FS)への前記導線(Z)との間の導電的接触を作り出す、請求項7に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102013102223.5 | 2013-03-06 | ||
DE102013102223.5A DE102013102223B4 (de) | 2013-03-06 | 2013-03-06 | Miniaturisiertes Mehrkomponentenbauelement und Verfahren zur Herstellung |
PCT/EP2014/051710 WO2014135311A1 (de) | 2013-03-06 | 2014-01-29 | Miniaturisiertes mehrkomponentenbauelement und verfahren zur herstellung |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016510959A JP2016510959A (ja) | 2016-04-11 |
JP6158959B2 true JP6158959B2 (ja) | 2017-07-05 |
Family
ID=50023586
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015560596A Expired - Fee Related JP6158959B2 (ja) | 2013-03-06 | 2014-01-29 | 小型化された多コンポーネント部品および製造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US10076035B2 (ja) |
JP (1) | JP6158959B2 (ja) |
KR (1) | KR101709885B1 (ja) |
DE (1) | DE102013102223B4 (ja) |
WO (1) | WO2014135311A1 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102013102206B4 (de) * | 2013-03-06 | 2016-04-07 | Epcos Ag | Bauelement mit gestapelten funktionalen Strukturen und Verfahren zur Herstellung |
JP6494470B2 (ja) * | 2015-03-18 | 2019-04-03 | 太陽誘電株式会社 | 弾性波デバイス |
US10218334B2 (en) | 2015-03-18 | 2019-02-26 | Taiyo Yuden Co., Ltd. | Acoustic wave device |
DE102016111911A1 (de) * | 2016-06-29 | 2018-01-04 | Snaptrack, Inc. | Bauelement mit Dünnschicht-Abdeckung und Verfahren zur Herstellung |
US10410988B2 (en) * | 2016-08-09 | 2019-09-10 | Semtech Corporation | Single-shot encapsulation |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5991719A (ja) * | 1982-11-17 | 1984-05-26 | Nippon Dempa Kogyo Co Ltd | 圧電振動子 |
JP4382945B2 (ja) | 2000-01-31 | 2009-12-16 | 京セラ株式会社 | 弾性表面波装置 |
US7045459B2 (en) * | 2002-02-19 | 2006-05-16 | Northrop Grumman Corporation | Thin film encapsulation of MEMS devices |
JP2004297619A (ja) * | 2003-03-27 | 2004-10-21 | Kyocera Corp | 弾性表面波装置 |
JP2007036829A (ja) * | 2005-07-28 | 2007-02-08 | Toshiba Corp | 薄膜圧電共振器、フィルタ及び薄膜圧電共振器の製造方法 |
JP2009010121A (ja) * | 2007-06-27 | 2009-01-15 | Hitachi Media Electoronics Co Ltd | 中空封止素子、その製造方法ならびに中空封止素子を用いた移動通信機器 |
JP2009010559A (ja) | 2007-06-27 | 2009-01-15 | Nippon Dempa Kogyo Co Ltd | 圧電部品及びその製造方法 |
JP5214627B2 (ja) | 2007-10-30 | 2013-06-19 | 京セラ株式会社 | 弾性波装置 |
DE102009014068B4 (de) | 2009-03-20 | 2011-01-13 | Epcos Ag | Kompaktes, hochintegriertes elektrisches Modul mit Verschaltung aus BAW-Filter und Symmetrierschaltung und Herstellungsverfahren |
JP5398561B2 (ja) * | 2010-01-29 | 2014-01-29 | 京セラ株式会社 | 弾性波装置およびその製造方法 |
JP2011188255A (ja) * | 2010-03-09 | 2011-09-22 | Panasonic Corp | 弾性波素子 |
US8283835B2 (en) * | 2010-04-30 | 2012-10-09 | Epcos Ag | Guided bulk acoustic wave device having reduced height and method for manufacturing |
DE102010036256B4 (de) * | 2010-09-03 | 2018-09-27 | Epcos Ag | Mikroakustisches Bauelement und Herstellungsverfahren |
DE102010056562B4 (de) * | 2010-12-30 | 2018-10-11 | Snaptrack, Inc. | Elektroakustisches Bauelement und Verfahren zur Herstellung des elektroakustischen Bauelements |
DE102010056572B4 (de) * | 2010-12-30 | 2018-12-27 | Snaptrack, Inc. | Elektronisches Bauelement und Verfahren zur Herstellung des elektronischen Bauelements |
DE102011102266B4 (de) * | 2011-05-23 | 2013-04-11 | Epcos Ag | Anordnung mit einem MEMS-Bauelement mit einer PFPE Schicht und Verfahren zur Herstellung |
DE102013102217B4 (de) * | 2013-03-06 | 2015-11-12 | Epcos Ag | Mikroakustisches Bauelement und Verfahren zur Herstellung |
DE102013102206B4 (de) * | 2013-03-06 | 2016-04-07 | Epcos Ag | Bauelement mit gestapelten funktionalen Strukturen und Verfahren zur Herstellung |
DE102014112672B4 (de) * | 2014-09-03 | 2018-05-09 | Snaptrack, Inc. | Abdeckung für ein Bauelement und Verfahren zur Herstellung einer Abdeckung für ein Bauelement |
-
2013
- 2013-03-06 DE DE102013102223.5A patent/DE102013102223B4/de not_active Expired - Fee Related
-
2014
- 2014-01-29 WO PCT/EP2014/051710 patent/WO2014135311A1/de active Application Filing
- 2014-01-29 US US14/772,587 patent/US10076035B2/en not_active Expired - Fee Related
- 2014-01-29 JP JP2015560596A patent/JP6158959B2/ja not_active Expired - Fee Related
- 2014-01-29 KR KR1020157027307A patent/KR101709885B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
DE102013102223A1 (de) | 2014-09-11 |
WO2014135311A1 (de) | 2014-09-12 |
KR20150122784A (ko) | 2015-11-02 |
US20160014902A1 (en) | 2016-01-14 |
US10076035B2 (en) | 2018-09-11 |
JP2016510959A (ja) | 2016-04-11 |
DE102013102223B4 (de) | 2014-09-18 |
KR101709885B1 (ko) | 2017-02-23 |
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