JP6157047B2 - Ｉｃデバイス用ソケット - Google Patents

Ｉｃデバイス用ソケット Download PDF

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Publication number
JP6157047B2
JP6157047B2 JP2011019937A JP2011019937A JP6157047B2 JP 6157047 B2 JP6157047 B2 JP 6157047B2 JP 2011019937 A JP2011019937 A JP 2011019937A JP 2011019937 A JP2011019937 A JP 2011019937A JP 6157047 B2 JP6157047 B2 JP 6157047B2
Authority
JP
Japan
Prior art keywords
layer
substrate
power supply
conductive contact
divided
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2011019937A
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English (en)
Japanese (ja)
Other versions
JP2012159422A5 (enExample
JP2012159422A (ja
Inventor
良尚 川手
良尚 川手
裕一 椿
裕一 椿
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Priority to JP2011019937A priority Critical patent/JP6157047B2/ja
Priority to PCT/US2012/023061 priority patent/WO2012106220A1/en
Priority to TW101103120A priority patent/TWI521815B/zh
Publication of JP2012159422A publication Critical patent/JP2012159422A/ja
Publication of JP2012159422A5 publication Critical patent/JP2012159422A5/ja
Application granted granted Critical
Publication of JP6157047B2 publication Critical patent/JP6157047B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
    • H05K7/1069—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting with spring contact pieces
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Connecting Device With Holders (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
JP2011019937A 2011-02-01 2011-02-01 Ｉｃデバイス用ソケット Expired - Fee Related JP6157047B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2011019937A JP6157047B2 (ja) 2011-02-01 2011-02-01 Ｉｃデバイス用ソケット
PCT/US2012/023061 WO2012106220A1 (en) 2011-02-01 2012-01-30 Socket for ic device
TW101103120A TWI521815B (zh) 2011-02-01 2012-01-31 用於積體電路裝置之插座

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011019937A JP6157047B2 (ja) 2011-02-01 2011-02-01 Ｉｃデバイス用ソケット

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2015180991A Division JP6484532B2 (ja) 2015-09-14 2015-09-14 Ｉｃデバイス用ソケット

Publications (3)

Publication Number Publication Date
JP2012159422A JP2012159422A (ja) 2012-08-23
JP2012159422A5 JP2012159422A5 (enExample) 2014-03-20
JP6157047B2 true JP6157047B2 (ja) 2017-07-05

Family

ID=45563617

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011019937A Expired - Fee Related JP6157047B2 (ja) 2011-02-01 2011-02-01 Ｉｃデバイス用ソケット

Country Status (3)

Country Link
JP (1) JP6157047B2 (enExample)
TW (1) TWI521815B (enExample)
WO (1) WO2012106220A1 (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI494576B (zh) * 2013-12-03 2015-08-01 Tohoku Seiki Ind Co Ltd IC processor
CN106716143B (zh) 2014-06-20 2019-08-13 艾科塞拉公司 测试插座组件和相关方法
KR101735774B1 (ko) 2015-11-30 2017-05-16 주식회사 아이에스시 테스트용 러버 소켓
US9958918B2 (en) * 2016-05-23 2018-05-01 Qualcomm Incorporated Systems and methods to separate power domains in a processing device
IT201600127581A1 (it) * 2016-12-16 2018-06-16 Technoprobe Spa Testa di misura per un’apparecchiatura di test di dispositivi elettronici con migliorate proprietà di filtraggio
TWI713807B (zh) * 2016-12-16 2020-12-21 義大利商探針科技公司 具有增進的頻率性質的測試頭
IT201700021389A1 (it) * 2017-02-24 2018-08-24 Technoprobe Spa Testa di misura con migliorate proprietà in frequenza
IT201700021400A1 (it) * 2017-02-24 2018-08-24 Technoprobe Spa Testa di misura a sonde verticali con migliorate proprietà in frequenza
IT201700021397A1 (it) * 2017-02-24 2018-08-24 Technoprobe Spa Testa di misura con migliorate proprietà in frequenza
KR101920822B1 (ko) * 2017-04-21 2019-02-13 리노공업주식회사 프로브 소켓
WO2019079595A1 (en) * 2017-10-20 2019-04-25 Formfactor, Inc. DIRECT METALLIC GUIDE PLATE
JP7346026B2 (ja) * 2018-12-26 2023-09-19 株式会社日本マイクロニクス 電気的接続装置
KR102295761B1 (ko) 2020-06-01 2021-09-01 리노공업주식회사 검사소켓
WO2021261288A1 (ja) * 2020-06-22 2021-12-30 株式会社ヨコオ 検査装置
TWI788113B (zh) 2021-11-23 2022-12-21 創意電子股份有限公司 檢測裝置及其測試插座
CN119335233A (zh) * 2024-09-20 2025-01-21 强一半导体(苏州)股份有限公司 用于探针卡的金属化导引板及其制造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001249163A (ja) * 2000-03-06 2001-09-14 Takai Kogyo Kk Ｉｃデバイスの試験用ソケット
JP4259928B2 (ja) 2003-06-11 2009-04-30 株式会社リコー 移送物体検出装置，原稿読取装置および画像形成装置
JP4607004B2 (ja) * 2005-12-27 2011-01-05 株式会社ヨコオ 検査ユニット
JP5259945B2 (ja) * 2006-10-30 2013-08-07 スリーエム イノベイティブ プロパティズ カンパニー 熱放散機能を備えたｉｃソケット
US7663387B2 (en) * 2007-09-27 2010-02-16 Yokowo Co., Ltd. Test socket
JP4985779B2 (ja) * 2007-10-24 2012-07-25 富士通株式会社 プリント基板ユニットおよびソケット
JP4659087B2 (ja) * 2008-12-17 2011-03-30 パナソニック株式会社 差動平衡信号伝送基板
KR101126690B1 (ko) * 2009-07-02 2012-04-02 남재우 Ｍｅｍｓ 기술을 이용한 테스트 소켓 및 그 제조방법

Also Published As

Publication number Publication date
TWI521815B (zh) 2016-02-11
WO2012106220A1 (en) 2012-08-09
JP2012159422A (ja) 2012-08-23
TW201246727A (en) 2012-11-16

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