JP6156991B2 - 銅膜形成用組成物及びそれを用いた銅膜の製造方法 - Google Patents

銅膜形成用組成物及びそれを用いた銅膜の製造方法 Download PDF

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Publication number
JP6156991B2
JP6156991B2 JP2013154522A JP2013154522A JP6156991B2 JP 6156991 B2 JP6156991 B2 JP 6156991B2 JP 2013154522 A JP2013154522 A JP 2013154522A JP 2013154522 A JP2013154522 A JP 2013154522A JP 6156991 B2 JP6156991 B2 JP 6156991B2
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JP
Japan
Prior art keywords
copper
copper film
composition
forming
mol
Prior art date
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JP2013154522A
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English (en)
Japanese (ja)
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JP2015025157A (ja
Inventor
阿部　徹司
徹司 阿部
和也 斎藤
和也 斎藤
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Adeka Corp
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Adeka Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Adeka Corp filed Critical Adeka Corp
Priority to JP2013154522A priority Critical patent/JP6156991B2/ja
Priority to CN201480042051.9A priority patent/CN105408517B/zh
Priority to PCT/JP2014/069150 priority patent/WO2015012209A1/ja
Priority to KR1020167002893A priority patent/KR101734789B1/ko
Priority to TW103125479A priority patent/TWI602947B/zh
Publication of JP2015025157A publication Critical patent/JP2015025157A/ja
Priority to PH12015502793A priority patent/PH12015502793A1/en
Application granted granted Critical
Publication of JP6156991B2 publication Critical patent/JP6156991B2/ja
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/08—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Chemically Coating (AREA)
  • Paints Or Removers (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Inorganic Chemistry (AREA)
JP2013154522A 2013-07-25 2013-07-25 銅膜形成用組成物及びそれを用いた銅膜の製造方法 Active JP6156991B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2013154522A JP6156991B2 (ja) 2013-07-25 2013-07-25 銅膜形成用組成物及びそれを用いた銅膜の製造方法
CN201480042051.9A CN105408517B (zh) 2013-07-25 2014-07-18 铜膜形成用组合物及使用其的铜膜的制造方法
PCT/JP2014/069150 WO2015012209A1 (ja) 2013-07-25 2014-07-18 銅膜形成用組成物及びそれを用いた銅膜の製造方法
KR1020167002893A KR101734789B1 (ko) 2013-07-25 2014-07-18 구리막 형성용 조성물 및 이를 이용한 구리막의 제조방법
TW103125479A TWI602947B (zh) 2013-07-25 2014-07-25 Composition for copper film formation, and the manufacturing method of the copper film using the same
PH12015502793A PH12015502793A1 (en) 2013-07-25 2015-12-16 Composition for copper film formation and copper film production method using same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013154522A JP6156991B2 (ja) 2013-07-25 2013-07-25 銅膜形成用組成物及びそれを用いた銅膜の製造方法

Publications (2)

Publication Number Publication Date
JP2015025157A JP2015025157A (ja) 2015-02-05
JP6156991B2 true JP6156991B2 (ja) 2017-07-05

Family

ID=52393250

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013154522A Active JP6156991B2 (ja) 2013-07-25 2013-07-25 銅膜形成用組成物及びそれを用いた銅膜の製造方法

Country Status (6)

Country Link
JP (1) JP6156991B2 (ko)
KR (1) KR101734789B1 (ko)
CN (1) CN105408517B (ko)
PH (1) PH12015502793A1 (ko)
TW (1) TWI602947B (ko)
WO (1) WO2015012209A1 (ko)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6387280B2 (ja) * 2014-10-03 2018-09-05 株式会社Adeka 銅膜形成用組成物及びそれを用いた銅膜の製造方法
JP6775531B2 (ja) * 2015-06-11 2020-10-28 ナショナル リサーチ カウンシル オブ カナダ 高導電性銅フィルムの調製
JP6884470B2 (ja) * 2017-06-26 2021-06-09 東ソー株式会社 導電性銅インク組成物
CN111051442B (zh) * 2017-08-01 2023-10-03 加拿大国家研究委员会 铜油墨
CA3085837A1 (en) * 2017-12-22 2019-06-27 National Research Council Of Canada Copper ink for high conductivity fine printing
KR20210131166A (ko) 2020-04-23 2021-11-02 엘지전자 주식회사 팬모터
KR20210133008A (ko) 2020-04-28 2021-11-05 엘지전자 주식회사 팬모터
KR20210133544A (ko) 2020-04-29 2021-11-08 엘지전자 주식회사 팬모터

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01168865A (ja) 1987-12-24 1989-07-04 Mitsubishi Gas Chem Co Inc 銅膜形成物品の製造法
JPH01168866A (ja) 1987-12-24 1989-07-04 Mitsubishi Gas Chem Co Inc 銅膜形成物品の製造法
JPH01168867A (ja) 1987-12-24 1989-07-04 Mitsubishi Gas Chem Co Inc 銅膜形成物品の製造法
JPH01168868A (ja) 1987-12-24 1989-07-04 Mitsubishi Gas Chem Co Inc 銅膜形成物品の製造法
CN1137285C (zh) * 1997-04-30 2004-02-04 高松研究所 金属糊和金属膜的制造方法
JP4852272B2 (ja) 2005-07-25 2012-01-11 ナミックス株式会社 金属ペースト
JP2008205430A (ja) 2007-01-26 2008-09-04 Konica Minolta Holdings Inc 金属パターン形成方法及び金属塩混合物
JP2009256218A (ja) * 2008-04-14 2009-11-05 Toray Ind Inc 銅前駆体組成物およびそれを用いた銅膜の製造方法。
JP2010242118A (ja) * 2009-04-01 2010-10-28 Adeka Corp 銅薄膜形成用組成物および該組成物を用いた銅薄膜の製造方法
JP5620795B2 (ja) * 2010-11-26 2014-11-05 株式会社Adeka 銅膜形成用組成物及び該組成物を用いた銅膜の製造方法
US8454815B2 (en) * 2011-10-24 2013-06-04 Rohm And Haas Electronics Materials Llc Plating bath and method

Also Published As

Publication number Publication date
KR20160027174A (ko) 2016-03-09
TW201510273A (zh) 2015-03-16
PH12015502793A1 (en) 2016-03-21
CN105408517A (zh) 2016-03-16
KR101734789B1 (ko) 2017-05-11
WO2015012209A1 (ja) 2015-01-29
CN105408517B (zh) 2017-08-25
TWI602947B (zh) 2017-10-21
JP2015025157A (ja) 2015-02-05

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