JP6147675B2 - パワーエレクトロニクスモジュールの構成要素を接合するためのペーストおよび方法 - Google Patents
パワーエレクトロニクスモジュールの構成要素を接合するためのペーストおよび方法 Download PDFInfo
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- JP6147675B2 JP6147675B2 JP2013555804A JP2013555804A JP6147675B2 JP 6147675 B2 JP6147675 B2 JP 6147675B2 JP 2013555804 A JP2013555804 A JP 2013555804A JP 2013555804 A JP2013555804 A JP 2013555804A JP 6147675 B2 JP6147675 B2 JP 6147675B2
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- paste
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- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
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- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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- H01L2224/32505—Material outside the bonding interface, e.g. in the bulk of the layer connector
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Description
本発明に係るペーストの変形例は、半田粉末、金属粉末および様々なアルコールの混合物から構成される。半田粉末は、SnAg4Cu0.5である。金属粉末はCuであり、約10μmの直径を有する小さなボール形状で存在する。混合物では、様々なアルコールをバインダとして使用しており、本例の場合、ブタノールとテルピネオールが1:2の比率で混合されている。バインダは、フラックスを含有しない。ペーストは、更なる構成要素を含まない。
金属粉末が銀のボール(Ag粒子)(または、Cu粒子およびAg粒子の混合)であり、バインダにロジンが3重量%含まれる以外は、例1のペーストと同様の構成を有する。
本実施形態の例を下記の各項目として示す。
[項目1]
望ましくは、パワーエレクトロニクスモジュールの構成要素を接合するためのペーストであって、
半田粉末と、
金属粉末とを備え、
加熱段階の前に、バインダによって前記半田粉末および前記金属粉末が結合され、
前記バインダは、フラックスを含まない、または、活性の低いフラックスを含むペースト。
[項目2]
前記バインダが前記フラックスを含む場合、
前記フラックスの前記バインダ中の比率が、5重量%未満であり、望ましくは、前記フラックス中のL0型以外のフラックスの割合が、20重量%未満である項目1に記載のペースト。
[項目3]
前記半田粉末は、半田ベースとして、すず、インジウムもしくはガリウムを含む、または、すず、インジウムもしくはビスマスの混合物を含む、項目1に記載のペースト。
[項目4]
前記金属粉末は、銅、銀、ニッケル、パラジウム、プラチナまたは金を含む項目1から3の何れか一項に記載のペースト。
[項目5]
前記フラックスを含まない前記バインダは、少なくとも、1つのアルコール、1つのアルカンまたは1つのフェノールを含む項目1から4の何れか一項に記載のペースト。
[項目6]
弱い活性のフラックスを有する前記バインダは、ロジン、望ましくは、純粋なロジンを含む項目1から3の何れか一項に記載のペースト。
[項目7]
前記半田粉末および前記金属粉末は、25重量%:75重量%から最大80重量%:20重量%の比率で存在する項目1から6の何れか一項に記載のペースト。
[項目8]
前記バインダと、前記半田粉末及び前記金属粉末の合計とが、2重量%:98重量%から最大25重量%:75重量%の比率で存在する項目1から7の何れか一項に記載のペースト。
[項目9]
前記金属粉末の平均粒子サイズは、1μm、望ましくは、3μmから、50μm、望ましくは30μmの間である項目1から8の何れか一項に記載のペースト。
[項目10]
前記ぺーストの融点は、200℃を超える、望ましくは、300℃を超える項目1から9の何れか一項に記載のペースト。
[項目11]
項目1から10の何れか一項に記載のペーストを使用して、パワー半導体と基板とを、または、基板とベースプレートとを接合する方法。
[項目12]
項目1から9の何れか一項に記載のペーストを使用して、パワーエレクトロニクスモジュールの構成要素を接合する方法であって、
前記ペーストを、第1構成要素の一領域に塗布する段階と、
第2構成要素を、前記ペーストが塗布された前記一領域に圧接して、前記半田粉末を溶融する段階とを備える方法。
[項目13]
前記第1構成要素および前記第2構成要素は望ましくは、活性雰囲気下で加熱され、前記ペーストの構成要素が再溶融されて、前記バインダが揮発する項目12に記載の方法。
[項目14]
前記半田粉末の表面が還元された後、前記半田が再び溶融される項目12または13に記載の方法。
[項目15]
項目1から10の何れか一項に記載のペーストを使用する中間接合層を有する、第1構成要素および第2構成要素からなるシステムであって、
再溶融された前記接合層は、局所的にのみ空洞を含むシステム。
Claims (9)
- パワーエレクトロニクスモジュールの構成要素を接合するためのペーストであって、
半田粉末と、
金属粉末とを備え、
加熱段階の前に、バインダによって前記半田粉末および前記金属粉末が結合され、
前記バインダは、フラックスを含まない、または、前記バインダ中の比率が5質量%未満で、L0型のフラックスまたはロジンであるフラックスを含むペースト。 - 前記半田粉末は、半田ベースとして、すず、インジウムもしくはガリウムを含む、または、すず、インジウムもしくはビスマスの混合物を含む、請求項1に記載のペースト。
- 前記金属粉末は、銅、銀、ニッケル、パラジウム、プラチナまたは金を含む請求項1または2に記載のペースト。
- 前記フラックスを含まない前記バインダは、少なくとも、1つのアルコール、1つのアルカンまたは1つのフェノールを含む請求項1から3の何れか一項に記載のペースト。
- 前記バインダは、純粋なロジンを含む請求項1または2に記載のペースト。
- 前記半田粉末および前記金属粉末は、25質量%:75質量%から最大80質量%:20質量%の比率で存在する請求項1から5の何れか一項に記載のペースト。
- 前記バインダと、前記半田粉末及び前記金属粉末の合計とが、2質量%:98質量%から最大25質量%:75質量%の比率で存在する請求項1から6の何れか一項に記載のペースト。
- 前記金属粉末の平均粒子サイズは、1μmから50μmの間である請求項1から7の何れか一項に記載のペースト。
- 請求項1から8の何れか一項に記載のペーストを使用して、パワーエレクトロニクスモジュールの構成要素を接合する方法であって、
前記ペーストを、第1構成要素の一領域に塗布する段階と、
第2構成要素を、ペーストが塗布された前記一領域に圧接して、前記半田粉末を溶融する段階と、
前記半田粉末を溶融する段階の後に、前記第1構成要素および第2構成要素を活性雰囲気下で加熱して、前記ペーストの構成要素を再溶融し、前記バインダが揮発する段階と
を備える方法。
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Application Number | Priority Date | Filing Date | Title |
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DE102011013172.8 | 2011-02-28 | ||
DE102011013172A DE102011013172A1 (de) | 2011-02-28 | 2011-02-28 | Paste zum Verbinden von Bauteilen elektronischer Leistungsmodule, System und Verfahren zum Auftragen der Paste |
PCT/EP2012/000978 WO2012116846A1 (de) | 2011-02-28 | 2012-02-28 | Paste zum verbinden von bauteilen elektronischer module, system und verfahren zum auftragen der paste |
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JP2014511279A JP2014511279A (ja) | 2014-05-15 |
JP6147675B2 true JP6147675B2 (ja) | 2017-06-14 |
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US (1) | US9815146B2 (ja) |
EP (1) | EP2681007A1 (ja) |
JP (1) | JP6147675B2 (ja) |
DE (1) | DE102011013172A1 (ja) |
WO (1) | WO2012116846A1 (ja) |
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CN104737630B (zh) * | 2012-10-15 | 2016-02-03 | 千住金属工业株式会社 | 低温焊膏的焊接方法 |
JP6011734B2 (ja) * | 2014-01-07 | 2016-10-19 | 株式会社村田製作所 | 構造材接合方法および接合構造 |
US9682533B1 (en) * | 2014-09-09 | 2017-06-20 | Hrl Laboratories, Llc | Methods to form electrical-mechanical connections between two surfaces, and systems and compositions suitable for such methods |
JP6511768B2 (ja) * | 2014-10-21 | 2019-05-15 | 三菱マテリアル株式会社 | はんだバンプの形成方法 |
US10043731B2 (en) | 2015-09-01 | 2018-08-07 | Toyota Motor Engineering & Manufacturing North America, Inc. | Multi-step processes for high temperature bonding and bonded substrates formed therefrom |
JP6721329B2 (ja) | 2015-12-21 | 2020-07-15 | 三菱電機株式会社 | パワー半導体装置およびその製造方法 |
US10879102B2 (en) * | 2017-08-07 | 2020-12-29 | Boston Process Technologies, Inc | Flux-free solder ball mount arrangement |
NL2020406B1 (nl) * | 2018-02-09 | 2019-08-19 | Inteco B V | Werkwijze en inrichting voor het vervaardigen van warmtewisselende elementen, en elemten als zodanig |
CN112756842A (zh) * | 2020-12-30 | 2021-05-07 | 福达合金材料股份有限公司 | 一种银基钎焊膏及其制备方法和应用 |
CN113399863B (zh) * | 2021-06-25 | 2022-06-21 | 西安热工研究院有限公司 | TA1-Q345中间层焊接用Ni-Cu-Ag-Co焊丝及其制备方法 |
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JPS51108624A (en) * | 1975-03-20 | 1976-09-27 | Tokyo Shibaura Electric Co | Biisnnin keigokin |
JPS5694796A (en) * | 1979-12-28 | 1981-07-31 | Fujitsu Ltd | Method of soldering electronic part |
JPS57107501A (en) * | 1980-12-25 | 1982-07-05 | Sony Corp | Conduction material |
JPS62179889A (ja) * | 1986-01-31 | 1987-08-07 | Senjiyu Kinzoku Kogyo Kk | クリ−ムはんだ |
GB8628916D0 (en) * | 1986-12-03 | 1987-01-07 | Multicore Solders Ltd | Solder composition |
JP2563293B2 (ja) * | 1986-12-29 | 1996-12-11 | 株式会社 徳力本店 | 複合ろう材のろう付方法 |
JPH02194632A (ja) * | 1989-01-24 | 1990-08-01 | Toshiba Corp | 電子部品の半田付方法 |
US4995921A (en) * | 1990-05-11 | 1991-02-26 | Motorola, Inc. | Solder pastes using alcohol blends as rheological aids |
JPH07303981A (ja) * | 1994-05-12 | 1995-11-21 | Asahi Chem Ind Co Ltd | はんだ組成物 |
US5976628A (en) * | 1995-12-08 | 1999-11-02 | Mitsuboshi Belting Ltd. | Copper conductor paste and production method of copper conductor film |
US5928404A (en) * | 1997-03-28 | 1999-07-27 | Ford Motor Company | Electrical solder and method of manufacturing |
JPH11189894A (ja) * | 1997-12-24 | 1999-07-13 | Murata Mfg Co Ltd | Sn合金メッキ皮膜、電子部品およびチップ型セラミック電子部品 |
US6235996B1 (en) * | 1998-01-28 | 2001-05-22 | International Business Machines Corporation | Interconnection structure and process module assembly and rework |
JP2001237512A (ja) * | 1999-12-14 | 2001-08-31 | Nitto Denko Corp | 両面回路基板およびこれを用いた多層配線基板ならびに両面回路基板の製造方法 |
JP3671815B2 (ja) * | 2000-06-12 | 2005-07-13 | 株式会社村田製作所 | はんだ組成物およびはんだ付け物品 |
JP3597810B2 (ja) * | 2001-10-10 | 2004-12-08 | 富士通株式会社 | はんだペーストおよび接続構造 |
JP2003211289A (ja) * | 2002-01-21 | 2003-07-29 | Fujitsu Ltd | 導電性接合材料、それを用いた接合方法及び電子機器 |
JP3797990B2 (ja) * | 2003-08-08 | 2006-07-19 | 株式会社東芝 | 熱硬化性フラックス及びはんだペースト |
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EP1837119B1 (en) | 2005-01-11 | 2015-02-11 | Murata Manufacturing Co., Ltd. | Solder paste and electronic device |
EP2017031B1 (en) * | 2006-04-26 | 2017-09-13 | Senju Metal Industry Co., Ltd | Solder paste |
JP4385061B2 (ja) * | 2006-08-28 | 2009-12-16 | ハリマ化成株式会社 | はんだペースト組成物およびその用途 |
CN101641176B (zh) | 2007-01-22 | 2013-05-22 | 马里兰大学 | 高温焊接材料 |
US7821130B2 (en) * | 2008-03-31 | 2010-10-26 | Infineon Technologies Ag | Module including a rough solder joint |
-
2011
- 2011-02-28 DE DE102011013172A patent/DE102011013172A1/de not_active Withdrawn
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2012
- 2012-02-28 WO PCT/EP2012/000978 patent/WO2012116846A1/de active Application Filing
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- 2012-02-28 EP EP12710028.7A patent/EP2681007A1/de not_active Withdrawn
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US9815146B2 (en) | 2017-11-14 |
US20140079472A1 (en) | 2014-03-20 |
WO2012116846A1 (de) | 2012-09-07 |
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