JP6145032B2 - 有機単分子膜の形成方法および形成装置 - Google Patents
有機単分子膜の形成方法および形成装置 Download PDFInfo
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- 238000000034 method Methods 0.000 title claims description 29
- 239000001257 hydrogen Substances 0.000 claims description 89
- 229910052739 hydrogen Inorganic materials 0.000 claims description 89
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 73
- 239000007789 gas Substances 0.000 claims description 54
- 239000011368 organic material Substances 0.000 claims description 29
- 238000006243 chemical reaction Methods 0.000 claims description 27
- 125000000217 alkyl group Chemical group 0.000 claims description 19
- 230000005284 excitation Effects 0.000 claims description 18
- 230000007246 mechanism Effects 0.000 claims description 18
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 14
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 9
- 239000000126 substance Substances 0.000 claims description 9
- -1 hydrogen ions Chemical class 0.000 claims description 7
- 150000002431 hydrogen Chemical class 0.000 claims description 6
- 239000002120 nanofilm Substances 0.000 claims description 5
- 239000002094 self assembled monolayer Substances 0.000 description 50
- 239000013545 self-assembled monolayer Substances 0.000 description 50
- 239000000758 substrate Substances 0.000 description 48
- 239000010408 film Substances 0.000 description 47
- 239000000463 material Substances 0.000 description 40
- 230000015572 biosynthetic process Effects 0.000 description 11
- 239000012159 carrier gas Substances 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 6
- 239000007788 liquid Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- 238000012864 cross contamination Methods 0.000 description 3
- 125000000524 functional group Chemical group 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000035484 reaction time Effects 0.000 description 3
- 239000002356 single layer Substances 0.000 description 3
- 238000006467 substitution reaction Methods 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000005764 inhibitory process Effects 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 150000002894 organic compounds Chemical class 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- YZCKVEUIGOORGS-IGMARMGPSA-N Protium Chemical compound [1H] YZCKVEUIGOORGS-IGMARMGPSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 230000005587 bubbling Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 1
- GPRLSGONYQIRFK-UHFFFAOYSA-N hydron Chemical compound [H+] GPRLSGONYQIRFK-UHFFFAOYSA-N 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000002940 repellent Effects 0.000 description 1
- 239000005871 repellent Substances 0.000 description 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 239000006200 vaporizer Substances 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/60—Deposition of organic layers from vapour phase
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/04—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases
- B05D3/0433—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases the gas being a reactive gas
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/448—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
- C23C16/452—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials by activating reactive gas streams before their introduction into the reaction chamber, e.g. by ionisation or addition of reactive species
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/62—Plasma-deposition of organic layers
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- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Manufacturing & Machinery (AREA)
- Formation Of Insulating Films (AREA)
- Chemical Vapour Deposition (AREA)
Description
<有機単分子膜の形成装置>
最初に、本発明の一実施形態に係る有機単分子膜の形成方法を実施するための装置の一例について説明する。
次に、本発明の一実施形態に係る有機単分子膜の形成方法について説明する。
SAMの形成に当たっては、SAM材料として、基板の表面と化学結合を形成する結合サイトを有する有機分子からなるものを用いる。典型的な例として、一般式R′−Si(O−R)3で表される有機分子からなる物質(シランカップリング剤)を用いることができる。ここで、R′はアルキル基であり、O−Rは、加水分解可能な官能基、例えばメトキシ基、エトキシ基である。このO−Rが、結合サイトとして機能する。このようなシランカップリング剤としては、例えばオクタメチルトリメトキシシラン(OTS)を挙げることができる。
R′−Si(O−R)3+H2O→R′−Si(OH)3+ROH (1)
R′−Si(OH)3+SiO(表面)→R′−SiO+Si(表面)+H2O (2)
R′−Si(O−R)3+H+→R′−Si(OH)3+RH (3)
R′−Si(OH)3+SiN(表面)→R′−SiN+Si(表面)+NH3 (4)
なお、本発明は上記実施形態に限定されることなく種々変形可能である。例えば、上記実施形態では、有機単分子膜を形成するSAM材料としてシランカップリング剤を例に挙げて説明したが、これに限るものではない。
2;基板ホルダ
3;SAM材料供給系
4;励起水素生成機構
5;排気系
6;制御部
11;ガス生成容器
12;SAM材料収容容器
13;キャリアガス導入管
14;SAM材料ガス供給管
15;H2ガス供給源
16;H2ガス供給管
17;励起部
100;有機単分子膜の形成装置
S;基板
Claims (12)
- 被処理体表面に有機材料ガスを供給して有機単分子膜を形成する有機単分子膜の形成方法であって、
被処理体に、被処理体の表面と化学結合を形成する結合サイトを有する有機分子を含む有機材料ガスを供給するとともに、前記有機材料ガスが前記被処理体に到達する前に前記有機材料ガスに励起水素を供給して前記有機分子の結合サイトの末端を水素に置換し、その後、該水素に置換された末端と前記被処理体との反応により有機単分子膜を形成することを特徴とする有機単分子膜の形成方法。 - 前記有機単分子膜は、自己組織化単分子膜であることを特徴とする請求項1に記載の有機単分子膜の形成方法。
- 前記有機材料ガスは、シランカップリング剤であることを特徴とする請求項2に記載の有機単分子膜の形成方法。
- 前記有機材料ガスの前記結合サイトの末端がアルキル基であり、前記励起水素によりアルキル基が水素に置換されることを特徴とする請求項1から請求項3のいずれか1項に記載の有機単分子膜の形成方法。
- 前記励起水素は、水素イオン、水素ラジカル、水素プラズマの少なくとも一種であることを特徴とする請求項1から請求項4のいずれか1項に記載の有機単分子膜の形成方法。
- 被処理体表面に有機単分子膜を形成する有機単分子膜の形成装置であって、
被処理体を収容するチャンバと、
前記チャンバ内に被処理体の表面と化学結合を形成する結合サイトを有する有機分子を含む有機材料ガスを供給する有機材料ガス供給部と、
前記チャンバ内に励起水素を生成させる励起水素生成機構と、
前記チャンバ内を排気する排気機構と
を具備し、
前記チャンバ内において、前記有機材料ガス供給部から供給された前記有機材料ガスが被処理体に到達する前に、前記励起水素生成機構からの励起水素が前記有機材料ガスに混合され、これにより前記有機分子の結合サイトの末端が水素に置換され、該水素に置換された末端と前記被処理体との反応により有機単分子膜が形成されることを特徴とする有機単分子膜の形成装置。 - 前記励起水素生成機構は、前記チャンバ内に水素ガスを供給する水素ガス供給手段と、前記チャンバ内で水素ガスを励起する励起部とを有することを特徴とする請求項6に記載の有機単分子膜の形成装置。
- 前記励起水素生成機構は、前記チャンバ外で励起水素を生成する励起部と、前記励起部で励起した励起水素を前記チャンバ内に導入する励起水素導入部材とを有することを特徴とする請求項6に記載の有機単分子膜の形成装置。
- 前記有機単分子膜は、自己組織化単分子膜であることを特徴とする請求項6から請求項8のいずれか1項に記載の有機単分子膜の形成装置。
- 前記有機材料ガスは、シランカップリング剤であることを特徴とする請求項9に記載の有機単分子膜の形成装置。
- 前記有機材料ガスの前記結合サイトの末端がアルキル基であり、前記励起水素によりアルキル基が水素に置換されることを特徴とする請求項6から請求項10のいずれか1項に記載の有機単分子膜の形成装置。
- 前記励起水素生成機構は、励起水素として、水素イオン、水素ラジカル、水素プラズマの少なくとも一種を生成することを特徴とする請求項6から請求項11のいずれか1項に記載の有機単分子膜の形成装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
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JP2013244184A JP6145032B2 (ja) | 2013-11-26 | 2013-11-26 | 有機単分子膜の形成方法および形成装置 |
KR1020140164178A KR20150060564A (ko) | 2013-11-26 | 2014-11-24 | 유기 단분자막의 형성 방법 및 형성 장치 |
US14/553,914 US20150147487A1 (en) | 2013-11-26 | 2014-11-25 | Method and apparatus for forming organic monolayer |
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JP2013244184A JP6145032B2 (ja) | 2013-11-26 | 2013-11-26 | 有機単分子膜の形成方法および形成装置 |
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JP2015101772A JP2015101772A (ja) | 2015-06-04 |
JP6145032B2 true JP6145032B2 (ja) | 2017-06-07 |
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US (1) | US20150147487A1 (ja) |
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JP7365898B2 (ja) * | 2019-12-27 | 2023-10-20 | 東京エレクトロン株式会社 | 成膜方法及び成膜装置 |
CN111468344B (zh) * | 2020-04-20 | 2021-03-09 | 亚洲硅业(青海)股份有限公司 | 还原炉钟罩内壁喷涂装置、喷涂方法和还原炉 |
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US6902947B2 (en) * | 2001-05-07 | 2005-06-07 | Applied Materials, Inc. | Integrated method for release and passivation of MEMS structures |
JP4660700B2 (ja) * | 2001-09-03 | 2011-03-30 | 独立行政法人産業技術総合研究所 | 有機分子自己組織化膜のパターン形成方法 |
JP2005086147A (ja) * | 2003-09-11 | 2005-03-31 | Sony Corp | 金属単層膜形成方法、配線形成方法、及び、電界効果型トランジスタの製造方法 |
JP4697162B2 (ja) * | 2007-03-16 | 2011-06-08 | セイコーエプソン株式会社 | 表面処理装置及び方法 |
JP2009259855A (ja) * | 2008-04-11 | 2009-11-05 | Sony Corp | 有機半導体素子及びその製造方法 |
US20130022752A1 (en) * | 2011-07-20 | 2013-01-24 | U.S. Government As Represented By The Secretary Of The Army | Methods for treating a surface of a substrate by atmospheric plasma processing |
WO2013146715A1 (ja) * | 2012-03-30 | 2013-10-03 | Jsr株式会社 | パターン形成方法 |
US8785215B2 (en) * | 2012-05-31 | 2014-07-22 | Asm Ip Holding B.V. | Method for repairing damage of dielectric film by cyclic processes |
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KR20150060564A (ko) | 2015-06-03 |
US20150147487A1 (en) | 2015-05-28 |
JP2015101772A (ja) | 2015-06-04 |
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