JP6130502B2 - 構造化ハイブリッド接着剤物品の製造方法 - Google Patents

構造化ハイブリッド接着剤物品の製造方法 Download PDF

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Publication number
JP6130502B2
JP6130502B2 JP2015520252A JP2015520252A JP6130502B2 JP 6130502 B2 JP6130502 B2 JP 6130502B2 JP 2015520252 A JP2015520252 A JP 2015520252A JP 2015520252 A JP2015520252 A JP 2015520252A JP 6130502 B2 JP6130502 B2 JP 6130502B2
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Japan
Prior art keywords
epoxy
curing agent
article
embossed
adhesive article
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JP2015520252A
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English (en)
Japanese (ja)
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JP2015525809A (ja
JP2015525809A5 (enExample
Inventor
エス．ヘバート ラリー
エス．ヘバート ラリー
サルニコフ ドミトリー
サルニコフ ドミトリー
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3M Innovative Properties Co
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3M Innovative Properties Co
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/56—Amines together with other curing agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/005—Surface shaping of articles, e.g. embossing; Apparatus therefor characterised by the choice of material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/66—Mercaptans
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24—Electrically-conducting paints
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2063/00—Use of EP, i.e. epoxy resins or derivatives thereof, as moulding material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/0097—Glues or adhesives, e.g. hot melts or thermofusible adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
    • B29K2995/0003—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular electrical or magnetic properties, e.g. piezoelectric
    • B29K2995/0005—Conductive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2015520252A 2012-07-03 2013-06-13 構造化ハイブリッド接着剤物品の製造方法 Active JP6130502B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261667637P 2012-07-03 2012-07-03
US61/667,637 2012-07-03
PCT/US2013/045623 WO2014007963A1 (en) 2012-07-03 2013-06-13 Method of making structured hybrid adhesive articles

Publications (3)

Publication Number Publication Date
JP2015525809A JP2015525809A (ja) 2015-09-07
JP2015525809A5 JP2015525809A5 (enExample) 2016-08-04
JP6130502B2 true JP6130502B2 (ja) 2017-05-17

Family

ID=48692684

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015520252A Active JP6130502B2 (ja) 2012-07-03 2013-06-13 構造化ハイブリッド接着剤物品の製造方法

Country Status (9)

Country Link
US (2) US20150165670A1 (enExample)
EP (1) EP2870190B1 (enExample)
JP (1) JP6130502B2 (enExample)
KR (1) KR20150036272A (enExample)
CN (1) CN104619742B (enExample)
BR (1) BR112015000114A2 (enExample)
CA (1) CA2877863A1 (enExample)
PL (1) PL2870190T3 (enExample)
WO (1) WO2014007963A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9669426B2 (en) * 2013-05-14 2017-06-06 Boe Hyundai Lcd Inc. Heat conductive adhesive film, method for manufacturing the same and OLED panel
CN107406576B (zh) 2015-02-27 2019-04-26 3M创新有限公司 包含增韧的固化剂的双组分粘合剂
WO2020061431A2 (en) 2018-09-20 2020-03-26 Ppg Industries Ohio, Inc. Thiol-containing composition
CN114269974A (zh) 2019-08-19 2022-04-01 3M创新有限公司 包含可交联和交联粘合剂组合物的皮芯长丝及其打印方法
CN115244150B (zh) 2020-03-06 2024-12-17 3M创新有限公司 通过图案化表面引发的固化而可调节的复合psa/结构粘合剂粘结

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1460571A (en) 1973-11-16 1977-01-06 Ciba Geigy Ag Adhesive compositions
JPH0288684A (ja) * 1988-09-27 1990-03-28 Nitto Denko Corp 接着方法及びそれに使用する液状接着剤
ES2087069T3 (es) 1988-11-23 1996-07-16 Ciba Geigy Ag Mezclas de resinas epoxi reticulables que contienen polioxialquilenditioles y poliaminas.
DE69120006T2 (de) 1990-09-11 1997-01-30 Hitachi Chemical Co Ltd Epoxyharz-Film und Verfahren zu seiner Herstellung
DE4126877C1 (en) 1991-08-14 1992-11-26 Kernforschungszentrum Karlsruhe Gmbh, 7500 Karlsruhe, De Plastic microstructure prodn. for high temp. resistance - by forming poly:methyl methacrylate] mould unit, filling with plastic resin and dissolving in solvent, for high accuracy moulds
CA2086770A1 (en) * 1992-01-10 1993-07-11 Jyi-Faa Hwang Epoxy interpenetrating polymer networks having internetwork bonds
US5942330A (en) * 1994-05-19 1999-08-24 Bostik, Incorporated Adhesive compositions and methods and articles of manufacture comprising same
CA2196024A1 (en) 1996-02-28 1997-08-28 Craig N. Ernsberger Multilayer electronic assembly utilizing a sinterable composition and related method of forming
IL136344A0 (en) 1998-01-16 2001-05-20 Loctite R & D Ltd Curable epoxy-based compositions
JP2002118144A (ja) 2000-10-06 2002-04-19 Sony Chem Corp 接着剤及び電気装置
US7125510B2 (en) 2002-05-15 2006-10-24 Zhili Huang Microstructure fabrication and microsystem integration
JP4326190B2 (ja) 2002-07-10 2009-09-02 スリーエム イノベイティブ プロパティズ カンパニー 可とう性成形型及びその製造方法
ITTO20030530A1 (it) 2003-07-09 2005-01-10 Infm Istituto Naz Per La Fisi Ca Della Mater Reticolo olografico di diffrazione, procedimento per la
JP2007046003A (ja) * 2005-08-12 2007-02-22 Three M Innovative Properties Co 被着体の貼付方法
ES2325089T3 (es) 2006-01-05 2009-08-25 Cognis Ip Management Gmbh Procedimiento para la obtencion de composiciones acuosas que comprenden agentes de curado de resinas epoxi.
JP4827861B2 (ja) * 2008-01-18 2011-11-30 中国電力株式会社 流入量予測システム、流入量予測方法及びプログラム
CN102037049B (zh) * 2008-05-22 2014-09-03 陶氏环球技术公司 环氧树脂的加合物及其制备方法
KR101662856B1 (ko) * 2008-07-23 2016-10-05 쓰리엠 이노베이티브 프로퍼티즈 컴파니 2액형 에폭시계 구조용 접착제
WO2010091072A1 (en) 2009-02-06 2010-08-12 3M Innovative Properties Company Room temperature curing epoxy adhesive
EP2223966B1 (en) 2009-02-25 2017-08-16 3M Innovative Properties Company Epoxy adhesive compositions with high mechanical strength over a wide temperature range
US20100227981A1 (en) 2009-03-04 2010-09-09 Air Products And Chemicals, Inc. Epoxide-based composition
BRPI1006600B1 (pt) 2009-04-17 2019-10-08 3M Innovative Properties Company Revestimento de proteção contra descarga atmosférica
WO2010121058A2 (en) 2009-04-17 2010-10-21 3M Innovative Properties Company Lightning protection sheet with patterned discriminator
CN101665674B (zh) * 2009-09-30 2012-05-30 烟台德邦科技有限公司 一种单组分螺纹锁固环氧预涂胶及其制备方法
PL2512978T3 (pl) 2009-12-14 2015-12-31 Sicpa Holding Sa Odlana warstwa polimerowa o wysokim współczynniku proporcji
JP5818893B2 (ja) * 2010-08-20 2015-11-18 スリーエム イノベイティブ プロパティズ カンパニー 低温硬化性エポキシテープ及びその製造方法
JP5981451B2 (ja) 2010-12-29 2016-08-31 スリーエム イノベイティブ プロパティズ カンパニー 構造用ハイブリッド接着剤
EP2744860B1 (en) * 2011-08-18 2021-02-24 Blue Cube IP LLC Curable resin compositions

Also Published As

Publication number Publication date
EP2870190A1 (en) 2015-05-13
US10625463B2 (en) 2020-04-21
KR20150036272A (ko) 2015-04-07
EP2870190B1 (en) 2019-02-13
CN104619742A (zh) 2015-05-13
PL2870190T3 (pl) 2019-07-31
US20190160729A1 (en) 2019-05-30
BR112015000114A2 (pt) 2017-06-27
JP2015525809A (ja) 2015-09-07
CN104619742B (zh) 2016-08-17
US20150165670A1 (en) 2015-06-18
WO2014007963A1 (en) 2014-01-09
CA2877863A1 (en) 2014-01-09

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