JP6121782B2 - 多層セラミック基板およびその製造方法 - Google Patents
多層セラミック基板およびその製造方法 Download PDFInfo
- Publication number
- JP6121782B2 JP6121782B2 JP2013082648A JP2013082648A JP6121782B2 JP 6121782 B2 JP6121782 B2 JP 6121782B2 JP 2013082648 A JP2013082648 A JP 2013082648A JP 2013082648 A JP2013082648 A JP 2013082648A JP 6121782 B2 JP6121782 B2 JP 6121782B2
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- JP
- Japan
- Prior art keywords
- glass
- firing
- insulating layer
- substrate
- insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000919 ceramic Substances 0.000 title claims description 133
- 239000000758 substrate Substances 0.000 title claims description 111
- 238000004519 manufacturing process Methods 0.000 title claims description 52
- 238000010304 firing Methods 0.000 claims description 134
- 239000011521 glass Substances 0.000 claims description 101
- 239000000463 material Substances 0.000 claims description 81
- 238000002425 crystallisation Methods 0.000 claims description 21
- 230000008025 crystallization Effects 0.000 claims description 21
- 239000011810 insulating material Substances 0.000 claims description 9
- 230000000149 penetrating effect Effects 0.000 claims description 7
- 239000007772 electrode material Substances 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 163
- 239000004020 conductor Substances 0.000 description 49
- 238000000034 method Methods 0.000 description 44
- 230000008569 process Effects 0.000 description 29
- 239000000843 powder Substances 0.000 description 28
- 239000002344 surface layer Substances 0.000 description 24
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 18
- 229910010293 ceramic material Inorganic materials 0.000 description 14
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 13
- 230000008859 change Effects 0.000 description 12
- 238000010586 diagram Methods 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- 229920005989 resin Polymers 0.000 description 9
- 239000005388 borosilicate glass Substances 0.000 description 8
- 239000000203 mixture Substances 0.000 description 8
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 description 7
- 239000002002 slurry Substances 0.000 description 7
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 6
- 239000001856 Ethyl cellulose Substances 0.000 description 6
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 6
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 6
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 6
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 6
- 229920001249 ethyl cellulose Polymers 0.000 description 6
- 235000019325 ethyl cellulose Nutrition 0.000 description 6
- 230000009477 glass transition Effects 0.000 description 6
- 238000005245 sintering Methods 0.000 description 6
- 229940116411 terpineol Drugs 0.000 description 6
- 239000011230 binding agent Substances 0.000 description 5
- 230000008602 contraction Effects 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 5
- 239000011256 inorganic filler Substances 0.000 description 5
- 229910003475 inorganic filler Inorganic materials 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 239000002994 raw material Substances 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- 230000004048 modification Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 3
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 229910052788 barium Inorganic materials 0.000 description 3
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 3
- 238000007606 doctor blade method Methods 0.000 description 3
- 239000002003 electrode paste Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 3
- 239000011295 pitch Substances 0.000 description 3
- 229910052814 silicon oxide Inorganic materials 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 229920005822 acrylic binder Polymers 0.000 description 2
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Chemical compound [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 description 2
- 238000004590 computer program Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 239000004014 plasticizer Substances 0.000 description 2
- 230000000452 restraining effect Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000007730 finishing process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
Images
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013082648A JP6121782B2 (ja) | 2013-04-11 | 2013-04-11 | 多層セラミック基板およびその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013082648A JP6121782B2 (ja) | 2013-04-11 | 2013-04-11 | 多層セラミック基板およびその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014207265A JP2014207265A (ja) | 2014-10-30 |
| JP2014207265A5 JP2014207265A5 (enrdf_load_stackoverflow) | 2016-03-03 |
| JP6121782B2 true JP6121782B2 (ja) | 2017-04-26 |
Family
ID=52120630
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013082648A Active JP6121782B2 (ja) | 2013-04-11 | 2013-04-11 | 多層セラミック基板およびその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6121782B2 (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102470168B1 (ko) * | 2015-12-08 | 2022-11-23 | 삼성전기주식회사 | 패키지기판 |
| JP2020030127A (ja) * | 2018-08-23 | 2020-02-27 | 日本特殊陶業株式会社 | 電気検査用基板およびその製造方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3961033B2 (ja) * | 1995-02-27 | 2007-08-15 | 京セラ株式会社 | 積層ガラス−セラミック回路基板 |
| JP2006137618A (ja) * | 2004-11-10 | 2006-06-01 | Sanyo Electric Co Ltd | 誘電体セラミック基板 |
-
2013
- 2013-04-11 JP JP2013082648A patent/JP6121782B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2014207265A (ja) | 2014-10-30 |
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