JP6120621B2 - 真空処理装置及びその運転方法 - Google Patents

真空処理装置及びその運転方法 Download PDF

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Publication number
JP6120621B2
JP6120621B2 JP2013051971A JP2013051971A JP6120621B2 JP 6120621 B2 JP6120621 B2 JP 6120621B2 JP 2013051971 A JP2013051971 A JP 2013051971A JP 2013051971 A JP2013051971 A JP 2013051971A JP 6120621 B2 JP6120621 B2 JP 6120621B2
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Japan
Prior art keywords
vacuum
chamber
vacuum transfer
processing
container
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JP2013051971A
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English (en)
Japanese (ja)
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JP2014179431A (ja
JP2014179431A5 (enExample
Inventor
僚一 磯村
僚一 磯村
工藤　豊
豊 工藤
隆浩 下村
隆浩 下村
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Hitachi High Tech Corp
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Hitachi High Technologies Corp
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Publication date
Application filed by Hitachi High Technologies Corp filed Critical Hitachi High Technologies Corp
Priority to JP2013051971A priority Critical patent/JP6120621B2/ja
Priority to TW103101817A priority patent/TWI555115B/zh
Priority to KR1020140010133A priority patent/KR101590533B1/ko
Priority to CN201410044844.6A priority patent/CN104051295B/zh
Priority to US14/183,645 priority patent/US9748124B2/en
Publication of JP2014179431A publication Critical patent/JP2014179431A/ja
Publication of JP2014179431A5 publication Critical patent/JP2014179431A5/ja
Application granted granted Critical
Publication of JP6120621B2 publication Critical patent/JP6120621B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67184—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the presence of more than one transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2013051971A 2013-03-14 2013-03-14 真空処理装置及びその運転方法 Active JP6120621B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2013051971A JP6120621B2 (ja) 2013-03-14 2013-03-14 真空処理装置及びその運転方法
TW103101817A TWI555115B (zh) 2013-03-14 2014-01-17 Vacuum processing device and its operation method
KR1020140010133A KR101590533B1 (ko) 2013-03-14 2014-01-28 진공 처리 장치 및 그 운전 방법
CN201410044844.6A CN104051295B (zh) 2013-03-14 2014-02-07 真空处理装置及其运转方法
US14/183,645 US9748124B2 (en) 2013-03-14 2014-02-19 Vacuum processing apparatus and operating method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013051971A JP6120621B2 (ja) 2013-03-14 2013-03-14 真空処理装置及びその運転方法

Publications (3)

Publication Number Publication Date
JP2014179431A JP2014179431A (ja) 2014-09-25
JP2014179431A5 JP2014179431A5 (enExample) 2016-04-28
JP6120621B2 true JP6120621B2 (ja) 2017-04-26

Family

ID=51503975

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013051971A Active JP6120621B2 (ja) 2013-03-14 2013-03-14 真空処理装置及びその運転方法

Country Status (5)

Country Link
US (1) US9748124B2 (enExample)
JP (1) JP6120621B2 (enExample)
KR (1) KR101590533B1 (enExample)
CN (1) CN104051295B (enExample)
TW (1) TWI555115B (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6718755B2 (ja) * 2016-06-22 2020-07-08 株式会社日立ハイテク 真空処理装置およびその運転方法
KR20240017095A (ko) * 2016-06-30 2024-02-06 가부시키가이샤 코쿠사이 엘렉트릭 기판 처리 장치, 반도체 장치의 제조 방법 및 기록 매체
JP6902379B2 (ja) 2017-03-31 2021-07-14 東京エレクトロン株式会社 処理システム
JP7115879B2 (ja) * 2018-03-23 2022-08-09 株式会社日立ハイテク 真空処理装置の運転方法
CN110544660B (zh) * 2018-08-02 2022-08-16 北京北方华创微电子装备有限公司 模块化晶圆传输系统和半导体设备
US10483142B1 (en) * 2018-09-14 2019-11-19 Lam Research Corporation Vacuum robot positioning system with reduced sensitivity to chamber pressure
CN113728422B (zh) 2020-03-24 2024-01-09 株式会社日立高新技术 真空处理装置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000150618A (ja) * 1998-11-17 2000-05-30 Tokyo Electron Ltd 真空処理システム
JP2003045947A (ja) * 2001-07-27 2003-02-14 Canon Inc 基板処理装置及び露光装置
JP2003059999A (ja) * 2001-08-14 2003-02-28 Tokyo Electron Ltd 処理システム
KR101050275B1 (ko) * 2002-05-21 2011-07-19 에이에스엠 아메리카, 인코포레이티드 반도체 프로세싱 도구 내 챔버 간의 상호 오염 감소 방법
US8029226B2 (en) * 2003-11-10 2011-10-04 Brooks Automation, Inc. Semiconductor manufacturing systems
US10086511B2 (en) * 2003-11-10 2018-10-02 Brooks Automation, Inc. Semiconductor manufacturing systems
JP2007258347A (ja) * 2006-03-22 2007-10-04 Nitto Koki Kk 化合物半導体の製造方法及び化合物半導体の製造装置
KR100847888B1 (ko) * 2006-12-12 2008-07-23 세메스 주식회사 반도체 소자 제조 장치
JP4825689B2 (ja) * 2007-01-12 2011-11-30 株式会社日立ハイテクノロジーズ 真空処理装置
JP2009062604A (ja) * 2007-09-10 2009-03-26 Tokyo Electron Ltd 真空処理システムおよび基板搬送方法
JP5295808B2 (ja) * 2009-02-09 2013-09-18 東京エレクトロン株式会社 パーティクル付着防止方法及び被処理基板の搬送方法
TW201123340A (en) * 2009-11-12 2011-07-01 Hitachi High Tech Corp Vacuum processing system and vacuum processing method of semiconductor processing substrate
JP2012028659A (ja) * 2010-07-27 2012-02-09 Hitachi High-Technologies Corp 真空処理装置
JP5710194B2 (ja) * 2010-09-28 2015-04-30 株式会社日立ハイテクノロジーズ 真空処理装置
JP5785712B2 (ja) * 2010-12-28 2015-09-30 株式会社日立ハイテクノロジーズ 真空処理装置

Also Published As

Publication number Publication date
TWI555115B (zh) 2016-10-21
KR101590533B1 (ko) 2016-02-01
CN104051295A (zh) 2014-09-17
US20140271049A1 (en) 2014-09-18
US9748124B2 (en) 2017-08-29
KR20140113324A (ko) 2014-09-24
JP2014179431A (ja) 2014-09-25
CN104051295B (zh) 2017-05-10
TW201448095A (zh) 2014-12-16

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