JP6116112B2 - Ｉｃデバイス用ソケット - Google Patents

Ｉｃデバイス用ソケット Download PDF

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Publication number
JP6116112B2
JP6116112B2 JP2011022735A JP2011022735A JP6116112B2 JP 6116112 B2 JP6116112 B2 JP 6116112B2 JP 2011022735 A JP2011022735 A JP 2011022735A JP 2011022735 A JP2011022735 A JP 2011022735A JP 6116112 B2 JP6116112 B2 JP 6116112B2
Authority
JP
Japan
Prior art keywords
substrate
conductive
conductive contact
pin
pins
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2011022735A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012164469A (ja
JP2012164469A5 (enExample
Inventor
良尚 川手
良尚 川手
裕一 椿
裕一 椿
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Priority to JP2011022735A priority Critical patent/JP6116112B2/ja
Priority to PCT/US2012/023066 priority patent/WO2012106221A1/en
Priority to TW101103587A priority patent/TWI563753B/zh
Publication of JP2012164469A publication Critical patent/JP2012164469A/ja
Publication of JP2012164469A5 publication Critical patent/JP2012164469A5/ja
Application granted granted Critical
Publication of JP6116112B2 publication Critical patent/JP6116112B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for unleaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Connecting Device With Holders (AREA)
JP2011022735A 2011-02-04 2011-02-04 Ｉｃデバイス用ソケット Expired - Fee Related JP6116112B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2011022735A JP6116112B2 (ja) 2011-02-04 2011-02-04 Ｉｃデバイス用ソケット
PCT/US2012/023066 WO2012106221A1 (en) 2011-02-04 2012-01-30 Ic device socket
TW101103587A TWI563753B (en) 2011-02-04 2012-02-03 Ic device socket

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011022735A JP6116112B2 (ja) 2011-02-04 2011-02-04 Ｉｃデバイス用ソケット

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2015134651A Division JP6109247B2 (ja) 2015-07-03 2015-07-03 Ｉｃデバイス用ソケット

Publications (3)

Publication Number Publication Date
JP2012164469A JP2012164469A (ja) 2012-08-30
JP2012164469A5 JP2012164469A5 (enExample) 2014-03-20
JP6116112B2 true JP6116112B2 (ja) 2017-04-19

Family

ID=45809569

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011022735A Expired - Fee Related JP6116112B2 (ja) 2011-02-04 2011-02-04 Ｉｃデバイス用ソケット

Country Status (3)

Country Link
JP (1) JP6116112B2 (enExample)
TW (1) TWI563753B (enExample)
WO (1) WO2012106221A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240126252A (ko) 2023-02-13 2024-08-20 주식회사 피엠티 반도체소자 테스트 소켓

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9341671B2 (en) * 2013-03-14 2016-05-17 Taiwan Semiconductor Manufacturing Company, Ltd. Testing holders for chip unit and die package
JP6520179B2 (ja) * 2015-02-13 2019-05-29 日本電産リード株式会社 中継コネクタ、及び基板検査装置
JP6796596B2 (ja) * 2015-03-31 2020-12-09 テクノプローベ エス．ピー．エー． フィルタリング特性を強化した、電子機器の試験装置のプローブカード
TWI620936B (zh) * 2017-02-22 2018-04-11 中華精測科技股份有限公司 積體電路之測試探針卡
CN109411937B (zh) * 2017-08-14 2021-09-21 富顶精密组件（深圳）有限公司 电连接器及其制造方法
JP2019090632A (ja) * 2017-11-13 2019-06-13 リード・エレクトロニクス株式会社 Ｉｃ検査装置
JP7112004B2 (ja) * 2019-01-31 2022-08-03 山一電機株式会社 検査用ソケット
CN112824912B (zh) * 2019-11-20 2024-12-27 嘉联益电子(昆山)有限公司 传输线测试模块与传输线测试方法
US12085587B2 (en) * 2021-01-23 2024-09-10 Essai, Inc. Hybrid shielding sockets with impedance tuning for integrated circuit device test tooling
AT18455U1 (de) * 2023-04-18 2025-04-15 Rainer Gaggl Dipl Ing Dr Vorrichtung zum elektrischen Prüfen von Halbleiterbauteilen

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2709990B2 (ja) * 1991-09-10 1998-02-04 日立電子エンジニアリング株式会社 Ｉｃテスターの測定治具
JPH0550365U (ja) * 1991-12-05 1993-07-02 日本合成ゴム株式会社 面状コネクター装置
JPH1167396A (ja) 1997-08-11 1999-03-09 Toshiba Chem Corp 端子ピッチ変換基板
JP2000082553A (ja) 1998-09-08 2000-03-21 Tokyo Cosmos Electric Co Ltd Ｉｃ用ソケット
US6392160B1 (en) * 1998-11-25 2002-05-21 Lucent Technologies Inc. Backplane for radio frequency signals
TW555993B (en) * 2002-01-15 2003-10-01 Via Tech Inc Chip test device to test the chip using BGA package
US6972958B2 (en) * 2003-03-10 2005-12-06 Hewlett-Packard Development Company, L.P. Multiple integrated circuit package module
JP4695447B2 (ja) * 2005-06-23 2011-06-08 株式会社日本マイクロニクス プローブ組立体およびこれを用いた電気的接続装置
JP2007080592A (ja) * 2005-09-12 2007-03-29 Fujitsu Component Ltd 半導体装置実装用ソケット
JP4607004B2 (ja) * 2005-12-27 2011-01-05 株式会社ヨコオ 検査ユニット
JP2008066076A (ja) * 2006-09-06 2008-03-21 Sumitomo Electric Ind Ltd 異方導電性シート，その形成方法，積層シート体および検査ユニット
US7663387B2 (en) * 2007-09-27 2010-02-16 Yokowo Co., Ltd. Test socket
JP2011146334A (ja) * 2010-01-18 2011-07-28 Three M Innovative Properties Co コンタクトピンホルダ

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240126252A (ko) 2023-02-13 2024-08-20 주식회사 피엠티 반도체소자 테스트 소켓
KR20250030455A (ko) 2023-02-13 2025-03-05 주식회사 피엠티 반도체소자 테스트 소켓

Also Published As

Publication number Publication date
JP2012164469A (ja) 2012-08-30
TWI563753B (en) 2016-12-21
WO2012106221A1 (en) 2012-08-09
TW201244299A (en) 2012-11-01

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