TWI563753B - Ic device socket - Google Patents

Ic device socket

Info

Publication number
TWI563753B
TWI563753B TW101103587A TW101103587A TWI563753B TW I563753 B TWI563753 B TW I563753B TW 101103587 A TW101103587 A TW 101103587A TW 101103587 A TW101103587 A TW 101103587A TW I563753 B TWI563753 B TW I563753B
Authority
TW
Taiwan
Prior art keywords
device socket
socket
Prior art date
Application number
TW101103587A
Other languages
Chinese (zh)
Other versions
TW201244299A (en
Inventor
Yoshihisa Kawate
Yuichi Tsubaki
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of TW201244299A publication Critical patent/TW201244299A/en
Application granted granted Critical
Publication of TWI563753B publication Critical patent/TWI563753B/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Connecting Device With Holders (AREA)
TW101103587A 2011-02-04 2012-02-03 Ic device socket TWI563753B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011022735A JP6116112B2 (en) 2011-02-04 2011-02-04 IC device socket

Publications (2)

Publication Number Publication Date
TW201244299A TW201244299A (en) 2012-11-01
TWI563753B true TWI563753B (en) 2016-12-21

Family

ID=45809569

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101103587A TWI563753B (en) 2011-02-04 2012-02-03 Ic device socket

Country Status (3)

Country Link
JP (1) JP6116112B2 (en)
TW (1) TWI563753B (en)
WO (1) WO2012106221A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI735794B (en) * 2017-08-14 2021-08-11 英屬開曼群島商鴻騰精密科技股份有限公司 Electrical connector and manufacturing method thereof

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9341671B2 (en) * 2013-03-14 2016-05-17 Taiwan Semiconductor Manufacturing Company, Ltd. Testing holders for chip unit and die package
JP6520179B2 (en) * 2015-02-13 2019-05-29 日本電産リード株式会社 Relay connector and board inspection device
DE112016001535T5 (en) * 2015-03-31 2018-03-08 Technoprobe S.P.A Probe card for a tester of electronic devices with improved filter characteristics
TWI620936B (en) * 2017-02-22 2018-04-11 中華精測科技股份有限公司 Testing probe card for integrated circuit
JP2019090632A (en) * 2017-11-13 2019-06-13 リード・エレクトロニクス株式会社 IC inspection device
CN111742228B (en) * 2019-01-31 2023-03-21 山一电机株式会社 Socket for inspection
CN112824912A (en) * 2019-11-20 2021-05-21 嘉联益电子(昆山)有限公司 Transmission line test module and transmission line test method
US20220236302A1 (en) * 2021-01-23 2022-07-28 Essai, Inc. Hybrid shielding sockets with impedance tuning for integrated circuit device test tooling

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6392160B1 (en) * 1998-11-25 2002-05-21 Lucent Technologies Inc. Backplane for radio frequency signals
TW555993B (en) * 2002-01-15 2003-10-01 Via Tech Inc Chip test device to test the chip using BGA package
WO2011088308A1 (en) * 2010-01-18 2011-07-21 3M Innovative Properties Company Contact pin holder

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2709990B2 (en) * 1991-09-10 1998-02-04 日立電子エンジニアリング株式会社 IC tester measurement jig
JPH0550365U (en) * 1991-12-05 1993-07-02 日本合成ゴム株式会社 Planar connector device
JPH1167396A (en) 1997-08-11 1999-03-09 Toshiba Chem Corp Board with variable terminal pitch
JP2000082553A (en) 1998-09-08 2000-03-21 Tokyo Cosmos Electric Co Ltd Ic socket
US6972958B2 (en) * 2003-03-10 2005-12-06 Hewlett-Packard Development Company, L.P. Multiple integrated circuit package module
JP4695447B2 (en) * 2005-06-23 2011-06-08 株式会社日本マイクロニクス Probe assembly and electrical connection device using the same
JP2007080592A (en) * 2005-09-12 2007-03-29 Fujitsu Component Ltd Socket for mounting semiconductor device
JP4607004B2 (en) * 2005-12-27 2011-01-05 株式会社ヨコオ Inspection unit
JP2008066076A (en) * 2006-09-06 2008-03-21 Sumitomo Electric Ind Ltd Anisotropic conductive sheet and forming method therefor, laminated sheet object, and inspection unit
US7663387B2 (en) * 2007-09-27 2010-02-16 Yokowo Co., Ltd. Test socket

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6392160B1 (en) * 1998-11-25 2002-05-21 Lucent Technologies Inc. Backplane for radio frequency signals
TW555993B (en) * 2002-01-15 2003-10-01 Via Tech Inc Chip test device to test the chip using BGA package
WO2011088308A1 (en) * 2010-01-18 2011-07-21 3M Innovative Properties Company Contact pin holder

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI735794B (en) * 2017-08-14 2021-08-11 英屬開曼群島商鴻騰精密科技股份有限公司 Electrical connector and manufacturing method thereof

Also Published As

Publication number Publication date
WO2012106221A1 (en) 2012-08-09
JP6116112B2 (en) 2017-04-19
TW201244299A (en) 2012-11-01
JP2012164469A (en) 2012-08-30

Similar Documents

Publication Publication Date Title
GB2508746B (en) Microelectronic device
TWI562156B (en) Semiconductor device
HK1192136A1 (en) Connector device
TWI560842B (en) Semiconductor device
SG11201504823YA (en) Semiconductor device
SG11201504507TA (en) Semiconductor device
EP2717300A4 (en) Semiconductor device
SG11201505088UA (en) Semiconductor device
SG11201505099TA (en) Semiconductor device
TWI562360B (en) Semiconductor device
EP2763160A4 (en) Semiconductor device
EP2675038A4 (en) Contactless electrical-power-supplying device
GB201404170D0 (en) Electronic device
EP2779225A4 (en) Semiconductor device
EP2725623A4 (en) Semiconductor device
EP2720263A4 (en) Semiconductor device
EP2752875A4 (en) Semiconductor device
SG11201504615UA (en) Semiconductor device
EP2783275A4 (en) Electronic device
EP2800360A4 (en) Connecting device
EP2672516A4 (en) Semiconductor device
TWI562143B (en) Semiconductor device
TWI563753B (en) Ic device socket
EP2765600A4 (en) Semiconductor device
EP2694620A4 (en) Electronic device

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees