JP4695447B2 - Probe assembly and electrical connection device using the same - Google Patents

Description

  The present invention relates to an electrical connection such as a probe card used for connection between an electrical circuit of an inspected object, for example, an integrated circuit, and an electrical circuit of a tester performing the electrical inspection for electrical inspection of the electrical circuit The present invention relates to an apparatus and a probe assembly used in the electrical connection apparatus.

One type of electrical connection device of this type includes a probe assembly having a so-called probe substrate made of ceramics and a plurality of probes arranged on one surface of the probe substrate (Patent Documents 1 and 2). ).
JP-A-6-140484 Japanese Patent Laid-Open No. 11-160356

  The ceramic plate constituting the probe substrate of such an electrical connection device has a number of fine probes corresponding to the number of connection pads provided on each of the number of integrated circuits formed on the semiconductor wafer. Arranged in line. In order to realize accurate electrical measurement, it is necessary to bring the tips of all these probes into contact with the corresponding connection pads with an equal pressing force within a predetermined error. Therefore, a high flatness is required for a ceramic plate provided with a large number of probes.

  However, a processing technique for forming a large-sized single-sheet ceramic plate that satisfies such a high flatness requirement is not easy. Therefore, the maximum diameter of ceramic plates that can be obtained in the market among the ceramic plates that satisfy this high flatness requirement is at most about 8 inches (about 200 mmφ). The ceramic plate to fill becomes very expensive.

  Therefore, conventionally, a ceramic plate having a diameter exceeding 8 inches cannot be obtained at low cost, and a large probe assembly including a ceramic substrate having a diameter exceeding 8 inches cannot be manufactured at low cost. Therefore, the maximum diameter semiconductor wafer that can be measured collectively has been substantially limited to 8 inches or less. Further, in the electrical measurement of a large number of integrated circuits formed on a large semiconductor wafer exceeding 8 inches, the semiconductor wafer is divided into a plurality of inspection areas, and the measurement of the integrated circuit is repeated for each inspection area. As a result, the inspection efficiency is reduced due to this repetition.

Accordingly, an object of the present invention is to provide a probe assembly that is less expensive than the conventional one and an electrical connection device using the probe assembly.
Another object of the present invention is to provide a large-sized probe assembly that is less expensive than the conventional one and an electrical connection device using the same.

  In order to solve the above-mentioned problems, the present invention divides and forms a ceramic substrate into a plurality of substrate portions, and uses a frame to arrange these ceramic substrate portions side by side and hold them together like a single plate. By doing so, it is based on the basic concept of realizing a probe substrate of a desired size.

That is, the probe assembly according to the present invention is a plurality of ceramic substrate portions, each of which has a plurality of probes disposed on one surface, and each of the plurality of probes disposed on the one surface. a plurality of arranged connection terminal electrically connected to the respective probe, e Bei a plurality of ceramic substrate portions which are arranged on a plane, and a frame that integrally holds the ceramic substrate portion of said plurality of, The frame has an annular outer frame portion as a whole, and an inner frame portion radially arranged in the inner region so as to partition the inner region surrounded by the outer frame portion, and the ceramic substrate The portions have a fan-like planar shape so as to form a circular outer edge along the outer frame portion in cooperation with each other, and each ceramic substrate portion is disposed on the outer frame portion and the inner frame portion. .

  According to the present invention, a ceramic substrate such as a single plate can be formed by a set of a plurality of ceramic substrate portions arranged side by side on the surface, and the area of each ceramic substrate portion can be reduced. Can be planned. By reducing the area of the individual ceramic substrate parts, it is easier to flatten each ceramic substrate part compared to the flattening process of a single ceramic substrate having the same area that can be realized by an aggregate of them. Therefore, a probe assembly including a ceramic substrate having a desired size, including a large size exceeding 8 inches, can be provided easily and inexpensively as compared with the related art.

  The plurality of ceramic substrate portions can be held such that the other surface is aligned on the same surface, whereby a large number of probes can be aligned with high density.

  A frame having a ring-shaped outer frame portion as a whole and an inner frame portion defining an inner region surrounded by the outer frame portion can be used. In this case, the plurality of ceramic substrate portions are divided into the sections. The inner regions can be arranged corresponding to the inner regions.

The outer frame portion may be formed in an annular shape, the inner frame portion may be formed in a cross shape, and the ceramic substrate portions may be formed in a quadrilateral planar shape.
In this case, for example, one ceramic substrate portion of a quarter circle having a diameter of 9 inches (about 304.8 mmφ) is obtained from a square ceramic plate having a planar shape having a smaller area than an 8-inch ceramic substrate and a side of about 150 mm. be able to. By holding these four quarter-circular ceramic substrate portions in a circular shape by the frame, a ceramic substrate of about 9 inches can be obtained substantially, so that a large number of semiconductor substrates formed on a semiconductor wafer exceeding 8 inches can be obtained. Integrated electrical testing of integrated circuits is possible.

  Positioning pins can be provided in the frame, and pin holes for receiving the positioning pins can be provided in the ceramic substrate portions. By fitting both the pins and the pin holes, the assembling work of the ceramic substrate portions to the frame can be facilitated.

  Each ceramic substrate portion can be fixed to the frame with an adhesive.

  By setting the difference in thermal expansion coefficient between the ceramic substrate portion and the frame to 1 ppm or less, even if the environmental temperature rises, the substantial influence of the distortion of the ceramic substrate due to the difference in thermal expansion between the two can be eliminated. it can. Therefore, for example, Novinite SI-5 (Super Invar, trade name, manufactured by Enomoto Casting Co., Ltd.), which is a kind of steel, can be used for the frame, and an alumina laminated substrate (HTCC substrate) can be used for the ceramic substrate portion.

  A wiring layer is formed on the one surface of the ceramic substrate portion, and probe lands on which the probes are fixed to the wiring layer are formed to project away from the one surface, and the projecting end surfaces of the probe lands Further, each of the probes can be fixed.

  For example, by fixing a cantilever type probe formed by photolithography to each probe land, the probe can be efficiently arranged on the ceramic substrate portion.

  Further, by positioning the end surfaces of the probe lands on substantially the same plane, the probes having the same height as the probe lands can be fixed, so that the tips of the probes can be aligned on the same plane.

An electrical connection device according to the present invention is an electrical connection device that connects a tester and an electrical connection terminal of an object to be inspected by the tester, and a wiring circuit connected to the tester is formed. A wiring board, a probe assembly having a plurality of probes whose tips are in contact with the electrical connection terminals of the device to be inspected, and the probe disposed between the wiring board and the probe assembly. An electrical connector for electrical connection to the corresponding site;
The probe assembly, possess a plurality of ceramic substrate portions arranged in a plurality of the probes is formed plane, respectively, and a frame that integrally holds the ceramic substrate of said plurality of said frames, the whole And an inner frame portion radially disposed in the inner region so as to partition the inner region surrounded by the outer frame portion, and the ceramic substrate portions cooperate with each other. In order to form a circular outer edge along the outer frame portion, it has a fan-like planar shape, and each ceramic substrate portion is disposed in contact with the outer frame portion and the inner frame portion .

  According to the electrical connection device of the present invention, the probe assembly includes a plurality of ceramic substrate portions and a frame that integrally holds the ceramic substrate. A ceramic substrate such as a single plate can be formed. Therefore, an electrical connection device incorporating a probe assembly having a ceramic substrate of a desired size can be provided at a lower cost than in the past. In addition, it is possible to provide an inexpensive electrical connection device capable of performing batch electrical inspection of a large number of integrated circuits formed on, for example, a semiconductor wafer exceeding 8 inches, thereby improving the work efficiency of electrical inspection. To do.

  According to the present invention, as described above, since a plurality of ceramic substrate portions are integrally held by the frame, a probe substrate having a desired size can be realized. In addition, an electrical connection device using this probe assembly can be provided at low cost.

A probe assembly 10 according to the present invention is shown in FIGS. 1 is a perspective view of the probe assembly 10 as viewed from below, FIG. 2 is a front view of the probe assembly 10, and FIG. 3 is a plan view of the probe assembly 10.
As shown in FIGS. 1 and 2, the probe assembly 10 includes a circular ring frame 12 as a whole, a ceramic plate 14 composed of four ceramic substrate portions 14a supported by the frame, and one of the ceramic plates. And a large number of probes 16 arranged on the surface.

The frame 12 is formed of a metal material having a small coefficient of thermal expansion (0 to 1 × 10 ⁻⁶ / K, where K is 293 to 323 K), such as Novinite SI-5. As clearly shown in FIGS. 3 and 4, the frame 12 includes a circular annular portion 12 a and a cross-shaped inner frame portion 12 b that divides the circular region defined inward by the annular portion into four parts. Is provided. Each end of the inner frame portion 12b continues to the annular portion 12a. As shown in FIG. 4, a positioning pin 18 for the ceramic substrate portion 14a is provided at each of the integrated portion of the annular portion 12a and the inner frame portion 12b on the lower surface of the frame 12 and the intersecting portion of the inner frame portion 12b. 12 is formed integrally.

  As shown in FIGS. 1 and 5, each ceramic substrate portion 14 a has a circular quadrilateral planar shape substantially equal to the outer diameter of the annular portion 12 a of the frame 12. Such a ceramic substrate portion 14a is formed with, for example, an arc having a corner of a square ceramic plate as a core of a fan and a straight line connecting two ends extending at an angle of 90 degrees from the core as a string. In this way, by processing a square ceramic plate, it is possible to obtain a quarter-circular flat-shaped ceramic substrate portion 14a having one side as a radius from one square ceramic plate.

  By processing the square ceramic plate as described above, for example, a quadrant of 9 inches (about 304.8 mmφ) in diameter from a 150 mm square ceramic plate having a planar shape smaller than an 8-inch ceramic substrate. Thus, one ceramic substrate portion 14a can be obtained. As such a ceramic plate, it is preferable to use an alumina laminated substrate (High Temperature Cofired Ceramic Substrate) having a thermal expansion coefficient substantially the same as that of the novinite.

  As shown in FIGS. 1 and 2, a multilayer wiring layer 20 that is well known in the art is formed on one surface of each ceramic substrate portion 14a, and a probe land 22 (see FIG. 7) is formed. The probe lands 22 are formed so as to protrude from one surface of the ceramic substrate portion 14a. Each probe land 22 has one end of the cantilever type probe 16 formed by using, for example, well-known photolithography. Is fixed. In FIG. 2, the probe land 22 is omitted for simplification of the drawing.

  As shown in FIG. 5, a connection terminal 26 is provided on the other surface of each ceramic substrate portion 14 a corresponding to each probe 16, that is, corresponding to each probe land 22. In the ceramic substrate portion 14a, as in the conventional ceramic substrate, a conductive path (not shown) including a through hole penetrating in the thickness direction is provided, and the probe land 22 passes through each conductive path. The connected probe 16 and the corresponding connection terminal 26 are electrically connected.

  In addition, on the upper surface of each ceramic substrate portion 14a, that is, on the other surface, a frame for facilitating proper positioning of each ceramic substrate portion 14a with respect to the frame 12 on the peripheral portion excluding the arrangement region of the connection terminals 26 is provided. Pin holes 28 for receiving the positioning pins 18 provided in 12 are respectively formed. Further, in the illustrated example, in the gap between the connection terminals 26 on the upper surface of the ceramic substrate portion 14a, as shown in FIGS. 2 and 3, a columnar shape arranged with the top surfaces aligned on the same surface. A plurality of anchor portions 30 are formed. Each anchor portion 30 is used for coupling the probe assembly 10 to a reinforcing frame 40 of an electrical connection device 32 described later. Each anchor portion 30 is formed with a female screw hole 30a as shown in FIG. Note that. In FIG. 3, the connection terminals 26 are omitted for simplification of the drawing.

  Each ceramic substrate portion 14 a is disposed on the lower surface of the frame 12 so that the upper surface faces the lower surface of the frame 12 and the positioning pins 18 of the frame 12 are received in the pin holes 28 provided in the respective ceramic substrate portions 14 a. By fitting the pin hole 28 and the positioning pin 18, the outer edge of each ceramic substrate portion 14a is in contact with the annular portion 12a and the inner frame portion 12b of the frame 12 as shown in FIG. The ceramic substrate portions 14a are arranged in alignment with the frame 12 so that the region is closed by each ceramic substrate portion 14a. In a state of being aligned with the frame 12, the outer edge of the ceramic substrate portion 14a is bonded to the annular portion 12a and the inner frame portion 12b which are in contact therewith, using an adhesive means such as resin adhesive, solder bonding or brazing. The

  Due to the adhesion of the ceramic substrate portion 14a to the frame 12, the ceramic substrate portion 14a is held so that the tips of the probes 16 are aligned on the same plane, like a single-plate ceramic substrate, and is entirely disk-shaped. A probe assembly 10 is configured. The mutually opposing edges of each ceramic substrate portion 14a can be spaced apart from each other in consideration of tolerances, but it is desirable to bond them together to increase strength, and for this reason, adhesives are mutually attached. Can be glued.

According to the probe assembly 10 of the present invention, as described above, the four annular ceramic substrate portions 14a are integrally held by the frame 12 to form the 300 mmφ ceramic substrate 14 exceeding 8 inches. Can do.
Moreover, since it is divided into a plurality of ceramic substrate portions 14a, the flatness of each ceramic substrate portion 14a can be controlled with high accuracy, and a large probe assembly can be provided relatively easily and inexpensively. it can.

  Further, by selecting the ceramic substrate portion 14a and the frame 12 from materials having substantially the same thermal expansion coefficient, for example, even in a high temperature environment of 200 ° C., the ceramic substrate portion 14a and the frame 12 can be applied to the ceramic substrate portion 14a due to the difference in thermal expansion between the both 12 and 14a. Generation | occurrence | production of a big distortion can be prevented and the big dispersion | variation in the front-end | tip position of the probe 16 provided in the ceramic board 14 can be prevented.

  As described above, the example in which each ceramic substrate portion 14a is fixed to the frame 12 after the probe 16 is fixed to each ceramic substrate portion 14a is shown. Instead, as shown in FIG. 6, prior to fixing the probe 16 to the ceramic substrate portion 14a, each ceramic substrate portion 14a is fixed to the frame 12, and then formed on the multilayer wiring layer 20 of the ceramic substrate portion 14a. The probe 16 can be fixed to the probe land 22 formed.

  The positioning pin 18 and the pin hole 28 can be dispensed with. However, it is desirable to provide the positioning pins 18 and the pin holes 28 in order to enable easy and accurate positioning of the ceramic substrate portion 14a on the frame 12.

FIG. 7 is a cross-sectional view showing a main part of an electrical connection device 32 incorporating the probe assembly 10 according to the present invention.
The electrical connection device 32 is provided between a connection pad (not shown) of the integrated circuit and a tester 36 for inspection in order to perform electrical connection inspection of a large number of integrated circuits formed on the semiconductor wafer 34. Are electrically connected.

  The electrical connection device 32 includes a reinforcing frame 40 that supports the upper surface of a circular wiring board 38 connected to the tester 36, a probe assembly 10 that is disposed below the wiring board 38 with a space therebetween, And an electrical connector 42 disposed between the probe assembly 10 and the wiring board 38.

  As is well known in the art, the wiring board 38 is formed by incorporating a wiring circuit connected to the tester 36 in a synthetic resin substrate, and a connection pad connected to the wiring circuit is formed on the lower surface thereof. (Not shown) is formed. The probe assembly 10 is assembled below the wiring board 38 with the connection terminals 26 facing the connection pads of the corresponding wiring board 38.

  In order to assemble the probe assembly 10, a base ring 44 and a fixing ring 46 that sandwich the edge of the probe substrate of the probe assembly 10 are connected to each other with bolts 48. The base ring 44 is screwed into a bolt 50 that penetrates the reinforcing frame body 40 and the wiring board 38, and is fastened to the reinforcing frame body 40 via a spacer 52 by tightening the bolt. The edge part of the probe board consisting of the ceramic plate 14 formed of an assembly of the ceramic substrate part 14a on which the multilayer wiring layer 20 is formed and the frame 12 that integrally holds the ceramic substrate part 14a is the inner edge part of both rings 44 and 46. It is pinched by.

  An electric connector 42 disposed between the wiring board 38 and the probe assembly 10 is accommodated inside the base ring 44. The electrical connector 42 electrically connects the connection terminal 26 of the probe assembly 10 and the corresponding connection pad of the wiring board 38 corresponding thereto. In the illustrated example, a pogo pin type electrical connector 42 is used as the electrical connector 42. A pogo pin block 42c that slidably accommodates each pair of pogo pins 42b sandwiching each compression coil spring 42a of the electrical connector 42 is fixed to the reinforcement frame body 40 with bolts 54 that are screwed into the reinforcement frame body 40. Yes.

  Further, the probe assembly 10 penetrates the wiring board 38 and the pogo pin block 42c from the reinforcing frame body 40, and the reinforcing frame is provided by a bolt 56 that is screwed into the female screw 30a of the anchor portion 30 provided at the tip of the ceramic board portion 14a. Coupled to the body 40. The bolt 56 is fitted with a spacer member 58 having one end in contact with the lower surface 40 a of the reinforcing frame 40 and the other end in contact with the top surface of the anchor portion 30.

  The top surfaces of the anchor portions 30 can be aligned so as to be positioned on the same surface in a state where the ceramic substrate portions 14 a are fixed to the frame 12. As a result, even if slight deflection occurs in the ceramic substrate portion 14a in a state of being fixed to the frame 12 as shown in FIG. 7, the probe assembly 10 is maintained in a state in which the deflection is maintained using the anchor member 58 having the same length. Can be incorporated. Therefore, the anchor part 30 functions as a spacer together with the spacer member 58.

  Similarly, the bottom surfaces of the probe lands 22 can be aligned so that the bottom ends of the probe lands 22 are located on the same plane in a state where the ceramic substrate portions 14 a are fixed to the frame 12. As described above, even if the probe assembly 22 is fixed to the probe land 22 by aligning the lower end surfaces of the probe lands 22 regardless of whether the ceramic substrate portion 14a is bent or not, the probe assembly 22 is fixed. Even if the 10 ceramic plates 14 are bent, the lower end, that is, the tip of the probe 16 can be aligned on the same plane without correcting the deflection, so that it corresponds to a large number of the connection pads on the semiconductor wafer 34. Reliable electrical contact between multiple probes 16 can be obtained.

  According to the electrical connection device 32 of the present invention, the above-described probe assembly 10 is incorporated as a probe assembly, and this probe assembly 10 is relatively easily and inexpensively mounted on a semiconductor wafer exceeding 8 inches, for example. Thus, the size of the integrated circuit formed on the integrated circuit can be adjusted to a size suitable for collective electrical inspection, so that the efficiency of electrical inspection of the integrated circuit on the semiconductor wafer 34 is improved.

  The present invention is not limited to the above embodiments, and various modifications can be made without departing from the spirit of the present invention. For example, the frame can be appropriately selected from various materials such as a metal or a non-metal material exhibiting a value of 1 ppm or less which is substantially equal to the thermal expansion coefficient of the ceramic substrate portion 14a of the probe assembly, in addition to the above-mentioned nobinai. In addition to the cantilever type described above, various types of probes such as a pin type can be applied.

It is the perspective view which looked at the probe assembly concerning the present invention from the lower part. It is a front view of the probe assembly shown in FIG. It is a top view of the probe assembly shown in FIG. It is the perspective view which looked at the flame | frame shown in FIG. 1 from the downward direction. It is the perspective view which looked at the ceramic substrate part shown in FIG. 1 from upper direction. FIG. 3 is a view similar to FIG. 2 showing a modified example of the manufacturing process of the probe assembly shown in FIG. It is a cross-sectional view which shows the principal part of an electrical connection apparatus provided with the probe assembly which concerns on this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Probe assembly 12 Frame 12a Frame annular part 12b Frame inner frame part 14 Ceramic plate 14a Ceramic substrate part 16 Probe 18 Positioning pin 20 Multilayer wiring layer 22 Probe land 26 Connection terminal 28 Pin hole

Claims (11)

A plurality of probes are arranged on one surface of each of a plurality of ceramic substrate portions, and are electrically connected to each of the plurality of probes arranged on the one surface on the other surface. A plurality of connecting terminals are arranged, and include a plurality of ceramic substrate portions arranged on the surface, and a frame that integrally holds the plurality of ceramic substrate portions,
The frame has an annular outer frame portion as a whole, and an inner frame portion radially arranged in the inner region so as to partition the inner region surrounded by the outer frame portion,
The ceramic substrate portions have a fan-like planar shape so as to form a circular outer edge along the outer frame portion in cooperation with each other, and each ceramic substrate portion is disposed on the outer frame portion and the inner frame portion. Assembly.   The probe assembly according to claim 1, wherein the plurality of ceramic substrate parts are held such that the other surface is aligned on the same surface.   The probe assembly according to claim 2, wherein the plurality of ceramic substrate portions are respectively arranged corresponding to the partitioned region portions of the frame.   The probe assembly according to claim 3, wherein the outer frame portion has an annular shape, the inner frame portion has a cross shape, and each ceramic substrate portion has a quadrangular planar shape.   The probe assembly according to claim 2, wherein a positioning pin is provided in the frame, and a pin hole for receiving each positioning pin is formed in each ceramic substrate portion.   The probe assembly according to claim 2, wherein each ceramic substrate portion is fixed to the frame with an adhesive.   The probe assembly according to claim 2, wherein a difference in thermal expansion coefficient between the ceramic substrate portion and the frame is 1 ppm or less.   A wiring layer is formed on the one surface of the ceramic substrate portion, and a probe land to which each probe is fixed is formed on the wiring layer so as to protrude away from the one surface. The probe assembly according to claim 2, wherein each of the probes is fixed to the projecting end surface of the probe.   The probe assembly according to claim 8, wherein the end faces of the probe lands are located on substantially the same plane. An electrical connection device for connecting a tester and an electrical connection terminal of an object to be inspected for electrical inspection by the tester,
A wiring board on which a wiring circuit connected to the tester is formed; a probe assembly having a plurality of probes whose tips are brought into contact with electrical connection terminals of the device to be inspected; and between the wiring board and the probe assembly. And an electrical connector for electrically connecting the probe to a corresponding part of the wiring circuit,
The probe assembly includes a plurality of ceramic substrate portions each having a plurality of the probes formed thereon and arranged on a surface, and a frame that integrally holds the plurality of ceramic substrates,
The frame has an annular outer frame portion as a whole, and an inner frame portion radially arranged in the inner region so as to partition the inner region surrounded by the outer frame portion,
The ceramic substrate portions have a fan-like planar shape so as to form a circular outer edge along the outer frame portion in cooperation with each other, and each ceramic substrate portion is disposed in contact with the outer frame portion and the inner frame portion. , Electrical connection device.   A plurality of the probes are formed on one surface of each of the plurality of ceramic substrate portions, and are electrically connected to each of the plurality of probes formed on the one surface on each other surface. The electrical connection device according to claim 10, wherein a plurality of connection terminals are formed.

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