JP2012164469A - Socket for ic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a socket for IC device which allows for efficient use of conductive contact pins and efficient replacement work.SOLUTION: The socket 100 for IC device comprises a pin holder 1 consisting of a first substrate 210, a second substrate 220, and a third substrate 230. The first substrate 210 has first pins 4 arranged to form a first arrangement pattern. The second substrate 220 has second pins 6 arranged to form a second arrangement pattern different from the first arrangement pattern. The third substrate 230 has a plurality of conducting paths arranged between the first and second substrate 210 and 220 and electrically connecting pins having the same function out of the first and second pins 4 and 6, and is separated from at least the first substrate 210 or the second substrate 220.

Description

  The present invention provides contact pins used for electrically connecting each terminal of an electronic device (hereinafter referred to as an IC device) such as a semiconductor integrated circuit (LSI) such as a processor and a memory to another circuit board. The present invention relates to an IC device socket to be held.

  In recent years, various IC devices have been used. An IC device generally supplies a plurality of signal terminals for receiving various signals from a circuit board that operates the IC device and transmitting signals output from the IC device to the circuit board, and supplies power to the IC device. And a ground terminal. Further, the interval (pitch) between various terminals varies depending on the IC device. Therefore, in order to operate a plurality of types of IC devices having different pitches between terminals using one circuit board for operating the IC device, for example, an IC device inspection board, each terminal of the IC device has And the corresponding terminal of the circuit board must be electrically connected. At that time, an IC device socket having a plurality of contact pins arranged in accordance with the pitch between the terminals is used.

  For example, Patent Document 1 discloses a terminal pitch conversion board. Patent Document 1 states that “the terminal pitch conversion board is provided with individual terminal pins 2a so as to conform to the positions of the individual terminal pins 2a of the burn-in socket 2 in which the BGA package is mounted at the center of the board body 1. A plurality of socket terminal insertion holes 3 to be connected to each other, and at the outer peripheral portion of the substrate body 1, the individual terminal connection holes 4 a are adapted so as to match the positions of the terminal connection holes 4 a provided in the printed wiring board 4. A plurality of connection pins 5 connected to each other are provided, and the inter-terminal connection between the burn-in socket 2 and the printed wiring board 4 having different inter-terminal pitches is realized.

  Japanese Patent Application Laid-Open No. H10-228561 describes that “the arrangement pitch of the back-side electrodes 23 may be increased with respect to the arrangement pitch of the front-side electrodes 22” regarding the IC device socket.

  Further, the IC device socket disclosed in Patent Document 3 is “the lower bracket 11, the upper bracket 20, the adjustment bracket 30, the cover 40, the lower anisotropic conductive sheet 50, and the pad pitch conversion board. 60 and the upper anisotropic conductive sheet 70 ”. Patent Document 3 states that “the pad pitch conversion substrate 60 has the semiconductor device side pads 81 and the like arranged in a lattice pattern on the upper surface, and the motherboard side pads on the lower surface are about twice the pitch between the semiconductor device side pads. It is converted into a pitch and arranged in a grid. Motherboard pads are arranged at a pitch of the pads on the mother board side of the pad pitch conversion board 60 ".

Japanese Patent Application Laid-Open No. 11-67396 JP 2000-82553 A JP 2007-80592 A

  As a result of examining the conventional socket for IC devices, the inventors have found the following problems. In other words, the terminal (or pad) pitch conversion in the conventional IC device socket is performed in correspondence with a contact portion where a plurality of connection pins (conductive contact pins) are arranged corresponding to the terminals of the IC device and a circuit board. This is performed by a conversion member integrated with the contact portion where the connection pin (conductive contact pin) is arranged. In addition, since these conductive contact pins are expensive, connection pins whose reliability has been reduced by repeated use are generally replaced as needed. Therefore, even when the conductive contact pin in one contact portion is replaced, it is necessary to replace the entire conversion member, and the efficiency of the replacement work is significantly reduced. In addition, when the entire conversion member is replaced, even the conductive contact pins that do not actually need to be replaced have to be replaced integrally, so that efficient use of the expensive conductive contact pins cannot be achieved.

  The present invention has been made to solve the above-described problems, and enables efficient use of conductive contact pins and efficient replacement work of the conductive contact pins. An object of the present invention is to provide an IC device socket having the following structure.

  In order to solve the above-described problems, an IC device socket according to the present invention includes a first substrate having a plurality of first conductive contact pins each extending in the interior, and a plurality of second conductors each extending in the interior. A second substrate having a conductive contact pin, a plurality of first conductive contact pins on the first substrate and a third substrate electrically connecting pins having the same function among the plurality of second conductive contact pins on the second substrate A substrate is provided. In the first substrate, the plurality of first conductive contact pins are arranged to form a first arrangement pattern. In the second substrate, the plurality of second conductive contact pins are arranged to form a second arrangement pattern different from the first arrangement pattern, and each second conductive contact pin has one first conductive pattern. Compatible with contact pins. The third substrate is disposed between the first and second substrates and has a plurality of conductive paths therein. Each conductive path electrically connects one first conductive contact pin to a corresponding second conductive contact pin.

  The third substrate has a structure in which a dielectric layer and a pair of conductive layers sandwiching the dielectric layer from both the first substrate side and the second substrate side are embedded (an ECM structure described later). May be provided. In recent years, signals handled by IC devices such as LSIs have become higher in frequency with an increase in processing speed, and stable supply of power to such high-frequency devices has become increasingly important. In order to stabilize the power supplied to the IC device, it is necessary to lower the impedance between the ground and the power supply. However, the impedance can be lowered by providing the capacitance between the ground and the power supply by the above structure. become.

  The third substrate preferably has a structure in which at least one of a strip line and a microstrip line is embedded therein. In this case, it becomes easy to control the signal impedance on the third substrate as a part of the pin holder for the high frequency device. The first and second substrates also employ a structure (coaxial structure described later) that is electrically insulated from the conductive material provided on the inner surface of the through-hole to be inserted for at least the conductive contact pins that can serve as signal paths. Can be done. Such a structure also makes it easy to control the signal impedance. Therefore, the IC device socket according to the present invention can sufficiently cope with the high frequency of signals handled by the IC device.

  In particular, in the IC device socket according to the present invention, the third substrate is separated from at least one of the first substrate and the second substrate. Therefore, the third substrate may be separate from the first and second substrates.

  According to the present invention, the first substrate in which the first conductive contact pins are arranged to form the first array pattern, and the second conductive contact pins form a second array pattern different from the first array pattern. A plurality of pins that are separated from at least one of the first and second substrates and that have the same function among the first and second conductive contact pins between the second substrate and the second substrate arranged to A third substrate having a conductive path is arranged. With this configuration, only necessary portions can be replaced, and the efficient use of the conductive contact pins and the efficiency of the replacement work are dramatically improved.

It is a perspective view which shows the structure of one Embodiment of the socket for IC devices which concerns on this invention. It is a figure which shows the cross-section of the socket for IC devices along the II line | wire of FIG. It is a top view which shows an example of the 1st arrangement pattern of the 1st conductive contact pin arranged on the 1st substrate. It is a top view showing an example of the 2nd arrangement pattern of the 2nd conductive contact pin arranged on the 2nd substrate. It is the figure which expanded the principal part cross section in 1st Embodiment of the pin holder shown by FIG. It is a top view for demonstrating the structure of the conductive path for signal transmission provided in the 3rd board | substrate. It is a figure for demonstrating a stripline. It is a figure for demonstrating a microstrip line. It is a figure for demonstrating the example of the three-dimensional structure of the conductive path for signal transmission provided in the 3rd board | substrate. It is sectional drawing which shows an example of the electroconductive contact pin applicable to each embodiment of this invention. It is sectional drawing which shows the other example of the conductive contact pin applicable to each embodiment of this invention. It is a top view which shows the other example of the 1st arrangement pattern of the 1st conductive contact pin arrange | positioned at the 1st board | substrate. It is a top view which shows the other example of the 2nd arrangement pattern of the 2nd conductive contact pin arrange | positioned on the 2nd board | substrate. It is the figure which expanded the principal part cross section in 2nd Embodiment of the pin holder shown by FIG. It is the figure which expanded the principal part cross section in 3rd Embodiment of the pin holder shown by FIG.

  Hereinafter, embodiments of the IC device socket according to the present invention will be described in detail with reference to FIGS. In the description of the drawings, the same elements are denoted by the same reference numerals, and redundant description is omitted.

  An IC device socket according to the present embodiment includes a first substrate having a plurality of first conductive contact pins that are positioned on a surface to which the IC device is attached and are arranged on a surface facing the IC device, and the IC device. And a second substrate having a plurality of second conductive contact pins disposed on a surface facing the circuit substrate and disposed between the first and second substrates. A third substrate having a plurality of conductive paths for electrically connecting pins having the same function among the first conductive contact pins and the plurality of second conductive contact pins. The third substrate is separated from at least one of the first and second substrates. An arrangement pattern of first conductive contact pins arranged on the side of the IC device on the first substrate and a circuit on the second substrate so that each terminal of the IC device can be electrically connected to a corresponding terminal on the circuit substrate. This is different from the arrangement pattern of the second conductive contact pins arranged on the side surface of the substrate.

  On the other hand, in recent years, with the increase in processing speed of IC devices, the frequency of signals handled by IC devices has been increasing. Depending on the IC device, a signal having a frequency of several hundred MHz or even higher than 1 GHz is used. Therefore, it is required that the IC device socket can transmit a high-frequency signal in response to an increase in the frequency of the signal. Therefore, in the present embodiment, the first and second substrates employ a coaxial structure as a holding structure for the conductive contact pins that form part of the signal path, and are disposed between the first and second substrates. For example, the third substrate may have a stripline structure or a microstripline structure to match impedance. Thereby, the IC device socket according to the present embodiment reduces the transmission loss of the high-frequency signal between the IC device attached to the IC device socket and the circuit board.

(First embodiment)
FIG. 1 is a perspective view showing a configuration of an embodiment of an IC device socket according to the present invention. FIG. 2 is a diagram showing a cross-sectional structure of the IC device socket 100 taken along the line II of FIG. The IC device socket 100 according to the present embodiment includes a pin holder 1 and a body 8 that is provided on the outer periphery of the pin holder 1 and supports the pin holder 1. The pin holder 1 is disposed between the first substrate 210 having the first conductive contact pins 4, the second substrate 220 having the second conductive contact pins 6, and the first and second substrates 210 and 220. Three substrates 230 are provided. A plurality of holes arranged to form a first arrangement pattern are provided in the upper surface 210a (IC device side surface) of the first substrate 210, and each of the plurality of first conductive contact pins 4 is inserted into the corresponding hole. As a result, the first conductive contact pins 4 form a first arrangement pattern. In addition, a plurality of holes arranged to form a second arrangement pattern different from the first arrangement pattern are provided on the lower surface 220b (a circuit board side surface of the inspection apparatus or the like) of the second substrate 220, and a plurality of second By inserting the conductive contact pins 6 into the corresponding holes, the second conductive contact pins 6 form a second array pattern. The third substrate 230 has a plurality of conductive paths, and each conductive path electrically connects pins having the same function among the plurality of first conductive contact pins 4 and the plurality of second conductive contact pins 6. is doing. That is, each of the conductive paths is composed of a plurality of first conductive contact pins 4 and a plurality of second conductive contact pins 6. The conductive contact pins functioning as power supply pins and the conductive functions functioning as ground pins. The contact pins and conductive contact pins that function as signal transmission pins are electrically connected to each other. The first to third substrates 210 to 230 are integrally fixed to the body 8 by a fixture 83, and the relative positions of the first to third substrates 210 to 230 with respect to the body 8 are fixed by the fixture 83. Fluctuations are suppressed.

  The body 8 has a guide portion or guide wall 81 for arranging an IC device (not shown) at a predetermined position on the upper surface 210a of the first substrate 210, and further, an apparatus for operating the pin holder 1 on the IC device, For example, it has a positioning part (positioning pin 82 shown in FIG. 2 in this embodiment) for arranging at a predetermined position of a circuit board included in an inspection device (not shown) for inspecting an IC device. The body 8 is attached to the pin holder 1 as necessary. Each of the first to third substrates 210 to 230 may have a hole or a notch for positioning in cooperation with the positioning unit.

  Further, a positioning device provided separately from the pin holder 1 may be used in order to attach the IC device to the pin holder 1 at an accurate position. In this case, the body 8 is omitted.

  FIG. 3 is a plan view showing an example of a first arrangement pattern of the first conductive contact pins 4 arranged on the upper surface 210 a of the first substrate 210. FIG. 4 is a plan view showing an example of a second arrangement pattern of the second conductive contact pins 6 arranged on the lower surface 220 b of the second substrate 220.

  As shown in FIG. 3, each of the plurality of first conductive contact pins 4 is electrically connected to each terminal of the IC device attached to the pin holder 1 on the upper surface 210 a of the first substrate 210. Are provided with a plurality of holes. Each of the plurality of first conductive contact pins 4 is inserted into the corresponding hole, and the first array pattern PA1a is formed by the plurality of first conductive contact pins 4. FIG. 3 shows an example in which the first array pattern PA1a of the first conductive contact pins 4 is configured as a 6 × 6 rectangular array pattern. Also, 821a to 821d shown in FIG. 3 are through holes for allowing the fixture 83 to pass therethrough.

  On the other hand, as shown in FIG. 4, on the lower surface 220 b of the second substrate 220, each of the plurality of second conductive contact pins 6 is electrically connected to each terminal of the circuit board to which the pin holder 1 is attached. As shown, a plurality of holes are provided. Each of the plurality of second conductive contact pins 6 is inserted into a corresponding hole, and a second array pattern PA1b different from the first array pattern PA1a is formed by the plurality of second conductive contact pins 6. FIG. 4 shows an example in which the second array pattern PA1b of the second conductive contact pins 6 is composed of two 6 × 3 rectangular array patterns. Further, 822a to 822d shown in FIG. 4 are through holes for allowing the fixture 83 to pass therethrough.

  In the example shown in FIGS. 3 and 4, the first and second array patterns PA1a and PA1b have the same pitch between the pins along the vertical direction and the horizontal direction, but have different pin arrangements. In addition, the pitch between pins may differ in the vertical direction and the horizontal direction. Further, the first and second arrangement patterns may have a similar relationship in which only the pitch between pins is different (FIGS. 8 and 9 described later). Furthermore, the number of pins constituting the pattern may be different between the first array pattern and the second array pattern.

  Thus, in the pin holder 1 in the present embodiment, the first arrangement pattern PA1a of the first conductive contact pins 4 and the second arrangement pattern PA1b of the second conductive contact pins 6 are different. As shown in FIG. 5, each first conductive contact pin 4 is connected to a corresponding first of the second conductive contact pins 6 through a plurality of conductive paths provided in the third substrate 230. 2 electrically connected to the conductive contact pins. Therefore, the pin holder 1 electrically connects each terminal of the IC device having a pitch, arrangement and number of pins between terminals different from the pitch, arrangement and number of pins between the terminals of the circuit board to corresponding terminals of the circuit board. be able to.

  FIG. 5 is an enlarged view of a cross-section of a main part in one embodiment of the pin holder shown in FIG. In the embodiment shown in FIG. 5, the third substrate 230 has a separate structure from the first substrate 210 and the second substrate 220.

  In FIG. 5, first, the first substrate 210 has a base material 2110 made of a dielectric material such as glass epoxy resin, and at least one dielectric layer 2111 embedded in the base material 2110 (further dielectric material). Conductive layers 2112 and 2113 such as copper are formed on the upper surface side and the lower surface side of the dielectric layer 2111. Therefore, the dielectric layer 2111 and the conductive layers 2112 and 2113 formed on both surfaces thereof cooperate to constitute a capacitor. That is, the first substrate 210 is configured by stacking the material (a part of the base material) constituting the base material 2110, the conductive layers 2112 and 2113, and the dielectric layer 2111. In order to increase the capacitance of the capacitor, the dielectric constant of the dielectric layer 2111 is preferably as high as possible. For example, the dielectric layer 2111 is made of a high dielectric having a dielectric constant higher than that of the base material 2110. Is preferred. For example, Embedded Capacitor Material (ECM) manufactured by 3M can be used as the high dielectric material. The ECM is a high dielectric material formed into a flexible sheet. Such a substrate can be produced by a method of producing a printed circuit board. Note that a capacitor realized by ECM or the like does not affect the high-frequency characteristics, and does not need to be provided in the substrate. However, the capacitor has an effective structure for stabilizing the power supply. Moreover, the material which comprises the 1st board | substrate 210, ie, the material of the base material 2110, may contain paper instead of glass fiber, and may contain phenol resin and polyamide resin instead of epoxy resin. In addition to copper, silver or gold may be used as a material constituting the conductive layers 2112 and 2113. The dielectric layer 2111 may include a polymer. Preferably, the dielectric layer 2111 includes a polymer and a plurality of particles, and is specifically manufactured by mixing a resin and particles. Suitable resins include epoxy resins, polyimide resins, polyvinylidene fluoride resins, cyanoethyl pullulan resins, benzocyclobutene resins, polynorbornene resins, polytetrafluoroethylene resins, acrylate resins, and mixtures thereof. The particles include dielectric (or insulating) particles having a dielectric constant higher than that of the polymer, representative examples of which are barium titanate, barium strontium titanate, titanium oxide, lead zirconium titanate, and A mixture thereof may be mentioned.

  The thickness of the dielectric layer 2111 can be, for example, 0.5 micrometers or more, and can be 100 micrometers or less. A thinner thickness is preferable because the capacitance of the capacitor can be increased. For example, the thickness can be 15 micrometers or less, or 10 micrometers or less. However, a thicker thickness is preferable from the viewpoint of adhesive strength, and can be, for example, 1 micrometer or more.

  Moreover, the relative dielectric constant of the dielectric is preferably as high as possible, for example, 10 or more, or 12 or more. Although there is no restriction | limiting in particular in the upper limit of a dielectric constant, For example, it can be 30 or less, 20 or less, or 16 or less.

  Of the conductive layers formed on both surfaces of the dielectric layer 2111, one conductive layer 2112 constitutes a power supply layer electrically connected to the power supply pin of the IC device socket 100, and the other conductive layer 2113 is A ground (GND) layer electrically connected to the grounding pin of the IC device socket 100 is formed. Note that the upper surface 210a of the first substrate 210 shown in FIG. 5 coincides with the upper surface of the base material 2110, and the lower surface 210b of the first substrate 210 coincides with the lower surface of the base material 2110. In addition, the dielectric layers and the conductive layers formed on both surfaces are disposed on the first substrate 210 over the entire surface. Therefore, a capacitor having an area substantially equal to the area of the first substrate 210 can be formed.

  The first substrate 210 further has a plurality of through-holes connecting the upper surface 210a and the lower surface 210b, and the inner surface of each of these through-holes is plated with a metal such as copper, gold, or silver to thereby form a conductive material 2151. ˜2156 are provided. Each of the first conductive contact pins 2141 to 2146 is at least partially inserted into the corresponding through hole. In the embodiment shown in FIG. 5, the first conductive contact pins 2142, 2143, 2145 are ground pins, the first conductive contact pins 2141, 2146 are signal transmission pins, and the first conductive contacts The pin 2144 is a power supply pin.

  Each of the first conductive contact pins 2141 to 2146 penetrates the first substrate 210 from the upper surface 210a toward the lower surface 210b. Specifically, the first conductive contact pins 2142, 2143, and 2145, which are grounding pins, are press-fitted into the corresponding through-holes in contact with the conductive materials 2152, 2153, and 2155, respectively. Are respectively held on the first substrate 210. In addition, each of the conductive materials 2152, 2153, and 2155 is in electrical contact with the conductive layer 2113 that is a ground layer. The first conductive contact pins 2144 that are power supply pins are press-fitted into the corresponding through-holes while being in contact with the conductive material 2154, whereby the power supply pins are held on the first substrate 210. The conductive material 2154 is in electrical contact with the conductive layer 2112 which is a power supply layer.

  On the other hand, the first conductive contact pins 2141 and 2146 which are signal transmission pins are inserted into the corresponding through-holes without contacting the conductive materials 2151 and 2156. That is, the opening diameter of the through hole corresponding to the diameter d of the pin body of the first conductive contact pins 2141 and 2146 is set to D (> d), and a coaxial line is formed in the first substrate 210. ing. Note that the conductive materials 2151 and 2156 spaced apart from the first conductive contact pins 2141 and 2146 are electrically connected to the conductive layer 2113 which is a ground layer. In addition, the “coaxial line” in the specification of the present application means that the pin bodies of the first conductive contact pins 2141 and 2146 and the conductive materials 2151 and 2156 are insulated from each other without being in contact with each other, and the pin bodies are covered with the electrically conductive material. This means a broken (electromagnetically shielded) form, and does not mean only the case where each of the conductive contact pin and the conductive material is a cylinder centered on the same axis as in the illustrated example. Therefore, for example, a cylindrical surface in which the outer surface of the conductive contact pin and the inner surface of the conductive material are eccentric from each other may be used.

  Plate-shaped holding members 2121 and 2122 are provided on or above the upper surface 210 a and the lower surface 210 b of the first substrate 210. Each of these plate-like holding members 2121 and 2122 has a through hole provided corresponding to each of the first conductive contact pins 2141 to 2146, and each of these through holes has a diameter smaller than the diameter d of the pin body. . The first conductive contact pins 2141 to 2146 are securely held on the first substrate 210 by inserting the respective plunger tips into the corresponding through holes of the respective plate-like holding members. The plate-like holding members 2121 and 2122 prevent the first conductive contact pins 2141 to 2146 from falling off and the first conductive contact pins at the tips of the plungers of the first conductive contact pins 2141 to 2146. A function of controlling the amount of displacement (swing) in a direction substantially perpendicular to the axial direction of each of 2141 to 2146 is provided.

  Further, the first base material 2110 is a first conductive contact pin that is a signal transmission pin on or above the surface (surfaces respectively corresponding to the upper surface 210a and the lower surface 210b of the first substrate 210). In the vicinity of the plungers 2141 and 2146, there are layered grounding conductors (grounding conductor layers) 2131 and 2132 to be grounded. Each grounding conductor layer has conductive materials 2152, 2153, and 2155 (grounding pins) electrically connected to the first conductive contact pins 2142, 2143, and 2145 as the grounding pins on the surface of the base material 2110. Is electrically connected to the first conductive contact pins 2141 and 2146 which are signal transmission pins. In this way, by arranging a conductor layer with the same potential as the ground layer near the plunger with a diameter smaller than that of the pin body, the inductance component of the plunger tip is compensated for, and insertion loss of the signal transmission pin and near-end crosstalk are reduced. Can be small. In addition, providing a grounding conductor layer on the surface layer of the base material 2110 can be realized by a normal multilayer substrate manufacturing process, and a larger capacity component can be obtained than when a grounding conductor layer is provided on the inner layer of the base material 2110. Can do. In FIG. 5, the grounding conductor layers 2131 and 2132 and the plate-like holding members 2121 and 2122 are illustrated apart from each other for the sake of clarity, but they may be in contact with each other.

  Next, the configuration of the signal transmission pins (first conductive contact pins 2141 and 2146) constituting the coaxial line on the first substrate 210 will be described in detail. That is, in the first substrate 210 shown in FIG. 5 as described above, the first conductive contact pins 2142, 2143, 2145 are ground pins, and the first conductive contact pins 2141, 2146 are signal transmission pins. The first conductive contact pin 2144 is a power supply pin.

  Each first conductive contact pin extends substantially perpendicularly from the upper surface 210a of the first substrate 210 toward the lower surface 210b and penetrates through the first substrate 210. In particular, the first conductive contact pins 2141 and 2146 that are signal transmission pins are inserted into the corresponding through holes and are not in contact with the corresponding conductive materials 2151 and 2156 and are insulated from each other. With this configuration, the first conductive contact pins 2141 and 2146 and the corresponding conductive materials 2151 and 2156 cooperate to form a coaxial line. A dielectric material such as resin or ceramic may be disposed or filled between the signal transmission pin and the corresponding conductive material. Alternatively, without filling a dielectric or the like between the outer surface of the pin body and the inner surface of the conductive material, a gas phase such as air, nitrogen or oxygen can be used, or a vacuum can be used.

The coaxial line is configured to have a predetermined characteristic impedance. For example, when the pin body of each of the first conductive contact pins 2141 and 2146 is a cylinder having a diameter d, and the corresponding conductive material 2151 and 2156 is a hollow cylinder having an inner diameter D, both cylinders are coaxial with each other. The characteristic impedance Z ₀ of the coaxial line is expressed by the following equation. Note that ε is a dielectric constant of a dielectric (dielectric or air in this embodiment) between the conductive contact pin and the conductive material. By appropriately selecting D, d, and ε, a desired characteristic impedance can be obtained for each signal transmission pin.

Zo = 60 / ε ^1/2 · ln (D / d)

  As shown in FIG. 5, in the first substrate 210, the conductive materials 2151 and 2156 are electrically connected to a conductive layer 2113 that is a ground layer disposed in the base material 2110. In the example of FIG. 5, the conductive layer 2113 is a layered conductor disposed in the base material 2110, and each of the conductive materials excluding the conductive material 2154 contacting the first conductive contact pin 2144 that is a power supply pin is a conductive layer. 2113 are electrically connected to each other. However, the structure of the connecting portion for grounding the conductive materials 2151 and 2156 is not limited to the example of FIG. 5 and may be constituted by, for example, wiring.

  The first substrate 210 may be formed as a substantially integrated body, but is manufactured by combining several members in consideration of the assembly of the first conductive contact pins and the arrangement of the ground layer (or wiring). You can also For example, in order to dispose a layered ground layer (conductive layer 2113) in the substrate 210, a plate-shaped base material 2110 is formed from a plurality of layers stacked in the thickness direction, and the conductive layer is sandwiched between the layers. You may be able to do it. Furthermore, considering the formation (for example, coating) of a conductive material on the inner surface of the through hole into which the first conductive contact pin is inserted, the thickness of the base material 2110 is set to the length of the pin body of each first conductive contact pin 4. The plate-shaped holding members 2121 and 2122 can be joined to the base material 2110 after the conductive material is formed on the inner surface of the through hole.

As in the embodiment shown in FIG. 5, in the case of a substrate in which the pin body of the signal transmission pin has a coaxial structure, the characteristic impedance Z ₀ of the pin body can be defined as the above equation by the coaxial structure, Since the plunger was not surrounded by the grounding conductor, it behaved as an inductance. Therefore, as in the embodiment of FIG. 5, when a grounding conductor layer is disposed in the vicinity of the plunger and a capacitance component with respect to the ground is added, the inductance component of the plunger is compensated and the characteristics are improved. More specifically, when the inductance value of the plunger is L ₀ , if there is a capacitance component having Co that satisfies Zo = (Lo / Co) ^1/2 between the plunger and the ground, the characteristics of the plunger portion The difference between the impedance and the characteristic impedance of the pin body is within a predetermined error, and the deterioration of the high frequency characteristics can be compensated. At the same time, the presence of electrical coupling between the signal transmission pin and the grounding pin can reduce crosstalk between adjacent signal transmission pins.

  Next, the structure of the second substrate 220 shown in FIG. 5 will be described. However, the second substrate 220 has the structure and configuration except that the second conductive contact pins 6 form a second array pattern PA1b (FIG. 4) different from the first array pattern PA1a (FIG. 3). Since the material is the same as that of the first substrate 210, overlapping description will be omitted.

  That is, the second substrate 220 has an upper surface 220a facing the lower surface 210b of the first substrate 210, a lower surface 220b facing the upper surface 220a, a base material 2210 made of a dielectric such as glass epoxy resin, and the base. At least one dielectric layer 2211 embedded in a material 2210 (may include another dielectric layer), and a conductive layer 2212 such as copper on the upper surface side and the lower surface side of the dielectric layer 2211; 2213 is formed. One conductive layer 2212 constitutes a power supply layer electrically connected to the power supply pin of the IC device socket 100, and the other conductive layer 2213 electrically connects to the ground pin of the IC device socket 100. Configure a connected ground (GND) layer. In addition, a plurality of through holes are formed in the base material 2210 so that the second conductive contact pins 6 to be inserted form the second array pattern PA1b, and copper, gold are formed on the inner surfaces of these through holes. Alternatively, conductive materials 2251 to 2256 such as silver are provided.

  Of the second conductive contact pins 6 inserted into the corresponding through holes in the second substrate 220, the second conductive contact pins 2242, 2243, 2245 are ground pins, and the second conductive contact pins 2241, Reference numeral 2244 denotes a signal transmission pin constituting the above-described coaxial structure, and the second conductive contact pin 2246 is a power supply pin.

  Plate-shaped holding members 2221 and 2222 are provided on or above the upper surface 220 a and the lower surface 220 b of the second substrate 220. Furthermore, the base material 2210 is on or above the surface (surfaces corresponding to the upper surface 220a and the lower surface 220b of the second substrate 220), and the second conductive contact pins 2241, which are signal transmission pins, In the vicinity of the 2244 plunger, there are layered grounding conductors (grounding conductor layers) 2231 and 2232 to be grounded. In FIG. 5, the grounding conductor layers 2231 and 2232 and the plate-like holding members 2221 and 2222 are illustrated apart from each other for the sake of clarity, but they may be in contact with each other.

  Next, the third substrate 230 shown in FIG. 5 is disposed between the first substrate 210 and the second substrate 220. That is, the third substrate 230 has an upper surface 230 a that faces the lower surface 210 b of the first substrate 210 and a lower surface 230 b that faces the upper surface 220 a of the second substrate 220. Further, the third substrate 230 includes a base material 2310 made of a dielectric such as glass epoxy resin, and two dielectric layers 2311 and 2314 embedded in the base material 2310, and the upper surface side of the dielectric layer 2311. In addition, conductive layers 2312 and 2313 such as copper are formed on the lower surface side. Conductive layers 2315 and 2316 such as copper are formed on the upper surface side and the lower surface side of the dielectric layer 2314.

  Of the conductive layers formed on both surfaces of the dielectric layer 2311, one conductive layer 2312 constitutes a power supply layer electrically connected to the power supply pin of the IC device socket 100, and the other conductive layer 2313 A ground (GND) layer electrically connected to the grounding pin of the IC device socket 100 is formed. Of the conductive layers formed on both surfaces of the dielectric layer 2314, one conductive layer 2315 constitutes a power supply layer electrically connected to the power supply pin of the IC device socket 100, and the other conductive layer. 2316 constitutes a ground (GND) layer electrically connected to the ground pin of the IC device socket 100. 5 is coincident with the upper surface of the base material 2310, and the lower surface 230b of the third substrate 230 is coincident with the lower surface of the base material 2310. The dielectric layers and the conductive layers formed on both surfaces are disposed on the third substrate 230 over the entire surface. Therefore, a capacitor having an area substantially equal to the area of the third substrate 230 can be formed. The material for realizing the structure of the third substrate 230 is the same as that of the first and second substrates 210 and 220 described above.

  The third substrate 230 further includes a plurality of conductive paths for electrically connecting the pins having the same function among the first conductive contact pins 4 and the second conductive contact pins 6. These conductive paths include at least a group arranged to match the first array pattern PA1a (FIG. 3) and a group arranged to match the second array pattern PA1b (FIG. 4). Specifically, the conductive path formed in the third substrate 230 includes a conductive path for electrically connecting the ground pins, a conductive path for electrically connecting the power pins, and a signal transmission path. There are conductive paths that electrically connect the pins.

  More specifically, the conductive path formed in the third substrate 230 includes vertical connection elements that connect the upper surface 230a and the lower surface 230b, and each vertical along a direction orthogonal to the direction from the upper surface 230a to the lower surface 230b. It consists of horizontal connection elements that communicate between the connection elements. Of the connection elements, the vertical connection elements 2361 to 2366 are connection elements for electrically connecting the ground pins, and are electrically connected to the conductive layers 2313 and 2316 (horizontal connection elements for grounding), which are ground layers. It is connected to the. The vertical connection elements 2371 and 2372 are connection elements for electrically connecting the power supply pins, and are electrically connected to the conductive layers 2312 and 2315 (horizontal connection elements for power supply) which are power supply layers, respectively. Yes. The vertical connection elements 2381 to 2384 are connection elements for electrically connecting the signal transmission pins, and are not in contact with any of the ground layers 2312 and 2316 and the power supply layers 2312 and 2315 and are insulated.

  In the example of FIG. 5, the vertical connection element 2361 has a contact pad 2361a located on the upper surface 230a and a contact pad 2361b located on the lower surface 230b, and the second conductive contact pin which is a grounding pin through the contact pad 2361b. 2242 in electrical contact. The vertical connection element 2362 has a contact pad 2362a located on the upper surface 230a and a contact pad 2362b located on the lower surface 230b, and is in electrical contact with the second conductive contact pin 2243, which is a ground pin, via the contact pad 2362b. is doing. The vertical connection element 2363 has a contact pad 2363a located on the upper surface 230a and a contact pad 2363b located on the lower surface 230b, and is in electrical contact with the first conductive contact pin 2142 which is a grounding pin through the contact pad 2363a. is doing. The vertical connection element 2364 has a contact pad 2364a located on the upper surface 230a and a contact pad 2364b located on the lower surface 230b, and is in electrical contact with the first conductive contact pin 2143, which is a ground pin, via the contact pad 2364a. is doing. The vertical connection element 2365 has a contact pad 2365a located on the upper surface 230a and a contact pad 2365b located on the lower surface 230b, and is in electrical contact with the first conductive contact pin 2145 which is a grounding pin through the contact pad 2365a. is doing. The vertical connection element 2366 has a contact pad 2366a located on the upper surface 230a and a contact pad 2366b located on the lower surface 230b, and is in electrical contact with the second conductive contact pin 2245 which is a grounding pin through the contact pad 2366b. is doing. Each of the vertical connection elements 2361 to 2366 is electrically connected via ground layers 2313 and 2316 that are horizontal connection elements, whereby the first conductive contact pins 2142 and 2143 that are grounding pins are connected. 2145 and the second conductive contact pins 2242, 2243, 2245 are electrically connected.

  The vertical connection element 2371 has a contact pad 2371a located on the upper surface 230a and a contact pad 2371b located on the lower surface 230b, and is in electrical contact with the first conductive contact pin 2144, which is a power supply pin, via the contact pad 2371a. is doing. The vertical connection element 2372 has a contact pad 2372a located on the upper surface 230a and a contact pad 2372b located on the lower surface 230b, and is in electrical contact with the second conductive contact pin 2246, which is a power supply pin, via the contact pad 2372b. is doing. These vertical connection elements 2371 and 2372 are electrically connected to power supply layers 2312 and 2315 which are horizontal connection elements, and a first conductive contact pin 2144 and a second conductive contact pin 2246 which are power supply pins are connected. Electrically connected.

  Further, the vertical connecting element 2381 is a conductor material provided on the inner surface of the through hole that connects the upper surface 230a and the lower surface 230b. On the upper surface 230a side, a drilling hole in which a part of the conductor material is scraped off by a drill. 2381a is formed. The vertical connection element 2381 has a contact pad 2381b located on the lower surface 230b, and is in electrical contact with the second conductive contact pin 2241 which is a signal transmission pin through the contact pad 2381b. The vertical connecting element 2382 is a conductor material provided on the inner surface of the through hole that connects the upper surface 230a and the lower surface 230b, and a drilling hole 2382b in which a part of the conductor material is scraped off by a drill is formed on the lower surface 230b side. Has been. The vertical connection element 2382 has a contact pad 2382a located on the upper surface 230a, and is in electrical contact with the first conductive contact pin 2141 that is a signal transmission pin via the contact pad 2382a. The vertical connection element 2383 is a conductor material provided on the inner surface of the through hole that connects the upper surface 230a and the lower surface 230b, and a drilling hole 2383b in which a part of the conductor material is scraped off by a drill is formed on the lower surface 230b side. Has been. The vertical connection element 2383 has a contact pad 2383a located on the upper surface 230a, and is in electrical contact with the first conductive contact pin 2146 that is a signal transmission pin via the contact pad 2383a. The vertical connection element 2384 is a conductor material provided on the inner surface of the through hole that connects the upper surface 230a and the lower surface 230b, and an excavation hole 2384a in which a part of the conductor material is scraped off by a drill is formed on the upper surface 230a side. Has been. The vertical connection element 2384 has a contact pad 2384b located on the lower surface 230b, and is in electrical contact with the second conductive contact pin 2244, which is a signal transmission pin, via the contact pad 2384b. The vertical connection element 2381 and the vertical connection element 2382 are electrically connected by a horizontal connection element 2391. Further, the vertical connection element 2383 and the vertical connection element 2384 are electrically connected by a horizontal connection element 2392. 6 is a diagram for explaining the planar structure of the horizontal connection elements 2391 and 2392, and the line L in FIG. 6 corresponds to the cross section of the example shown in FIG.

  In particular, the horizontal connection elements 2391 and 2392 are arranged in a space sandwiched between ground layers 2313 and 2316 via an insulating material (a part of the base material 2310), and this configuration realizes a stripline structure. ing. One of the dielectric layer provided in the third substrate 230 and the conductive layer formed on both surfaces thereof may not be provided. In this case, a microstrip line structure is realized by the horizontal connection elements 2391 and 2392 and one ground layer (2313 or 2316).

  The conductive layers 2313 and 2316 which are ground layers are the first conductive contact pins 2142, 2143 and 2145 which are grounding pins of the first conductive contact pins 4, and the grounding pin of the second conductive contact pins 6. Are electrically connected to the second conductive contact pins 2242, 2243, and 2245, respectively. Each of the conductive layers 2313 and 2316 preferably has an area sufficient to sandwich the horizontal connection elements 2391 and 2392 that constitute a conductive path for electrically connecting the signal transmission pins. In the present embodiment, each of the conductive layers 2313 and 2316 is disposed so as to cover the entire horizontal plane of the third substrate 230. However, each of the conductive layers 2313 and 2316 is disposed so as to be insulated from the conductive contact pins other than the grounding pins.

  As described above, the third substrate 230 includes a part of the conductive path for transmitting a signal (horizontal connection elements 2391 and 2392) and the grounded conductive layers 2313 and 2316 on both sides thereof. 2391 and 2392 function as strip lines. Then, by appropriately setting the line widths of these horizontal connection elements 2391 and 2392 and the distance between adjacent conductive layers in accordance with the conductivity of the conductive lines and the relative dielectric constant of the substrate 2, signals supplied to the IC device The signal reflection between the signal transmission pins and the conductive paths in the third substrate 230 that electrically connects the signal transmission pins is suppressed to the minimum with respect to the frequency of the signal. As a result, on the third substrate 230, the high frequency signal is transmitted between the signal transmission pins via the signal transmission conductive paths 2381, 2391, 2382 and the other signal transmission conductive paths 2383, 2392, 2384. The transmission loss due to this can be reduced.

FIG. 7 is a diagram for explaining the strip line. As shown in FIG. 7, the width (W) of the conductive path S1, the thickness t of the conductive path S1, and the base material (insulating material) I1 with respect to the conductive path S1 are shown. From the distance h between the adjacent conductive layers G1 and G2 and the dielectric constant ε _{r of the} substrate I1, the stripline characteristic impedance Z ₀ is expressed by the following equation (1). Therefore, by adjusting the value of each parameter in the formula (1), impedance matching may be achieved in the third substrate 230, and the impedance of the circuit board and the pin holder 1 may be matched.

Furthermore, the third substrate 230 may include a microstrip line in which the characteristic impedance is controlled by disposing a conductive path on the surface layer thereof. FIG. 8 is a view for explaining the microstrip line. As shown in FIG. 8, the width W of the conductive path S2, the thickness t of the conductive path S2, and the conductive path S2 and the conductive layer G3 are provided. From the thickness h of the obtained base material (insulating material) I2 and the dielectric constant ε _r of the base material I2, the characteristic impedance Z ₀ of the microstrip line is expressed by the following formula (2). Therefore, by adjusting the value of each parameter in the equation (2), impedance matching may be achieved in the third substrate 230, and the impedance of the circuit board and the pin holder 1 may be matched.

  In the pin holder 1, the signal transmission pins 2141, 2146, 2241, 2244 have the above-described coaxial structure in the first and second substrates 210, 220, and the third substrate 230 has a signal Since the signal impedance is controlled by the strip lines (or microstrip lines) 2391 and 2392 as the conductive paths for transmission, the output impedance of an IC device such as an LSI and the characteristic impedance of the circuit board are matched by the pin holder 1. It becomes possible. The impedance in the third substrate 230 only needs to be matched with the other impedance so that one of the IC device and the circuit board can receive a high-frequency signal transmitted from the other. The impedance of the third substrate 230, in particular, the conductive path is not limited to the one that completely matches the impedance of the IC device and the circuit board.

  Further, a conductive path for signal transmission formed in the third substrate 230 (in the example of FIG. 5, a signal path including connection elements 2382, 2391, 2382 and a signal path including connection elements 2382, 2392, 2384). Is configured as shown in FIG. FIG. 9 shows a conductive path in the third substrate 230 that electrically connects the signal transmission pin 2141 belonging to the first conductive contact pin 4 and the signal transmission pin 2241 belonging to the second conductive contact pin 6. It is a figure which shows the example of three-dimensional structure. As shown in FIG. 9, since the vertical connection elements 2381 and 2382 are conductive materials provided on the inner surface of the through hole that connects the upper surface 230a and the lower surface 230b of the third substrate 230, the horizontal connection elements ( A part on the upper surface side of the vertical connection element 2381 and a part on the lower surface side of the vertical connection element 2382 with respect to the strip line) 2391 are unnecessary conductive paths and function as stubs. Therefore, in the example of FIG. 5, excavation holes 2381a and 2382b are formed by removing these unnecessary portions with a drill.

  As described above, the IC device socket 100 according to the present embodiment corresponds to the circuit board corresponding to each terminal of the IC device having a pitch and arrangement between terminals different from the pitch and arrangement between terminals of the circuit board. The terminal can be electrically connected. In the IC device socket 100, the impedance of the conductive contact pin (signal transmission pin) connected to the signal terminal of the IC device with respect to the frequency of the signal supplied to the IC device, and the signal of the circuit board The signal transmission pins are electrically connected through a conductive path configured to match the impedance of the conductive contact pins (signal transmission pins) connected to the terminals. Therefore, the IC device socket 100 can reduce transmission loss of signals transmitted between the IC device and the circuit board.

(Conductive contact pin structure)
The conductive contact pin that can be used in the above-described embodiment may have a configuration like a so-called spring probe. For example, FIG. 10 is a cross-sectional view showing an example of the conductive contact pins 4 and 6 applicable to each embodiment of the present invention. As an example corresponding to the conductive contact pins 4 and 6, the conductive contact pin 400 is shown. A side cross-section is shown.

  The conductive contact pin 400 protrudes from one end (the lower end in the illustrated example) of the pin body 401 inserted into the substrate and the bottom of a hole formed in the substrate or a through formed in the substrate. A first contact portion 402 that can contact a terminal of another substrate such as a circuit board through the hole, and protrudes from the other end (upper end in the illustrated example) of the pin body 401, and is formed on the upper surface of the hole formed on the substrate or on the substrate And a second contact portion 403 that can be brought into contact with a terminal such as an IC device through the formed through hole. The pin body 401 and the contact portions 402 and 403 are made of a conductive material. The inner diameter of the opening at the upper end and the lower end of the pin body 401 is narrower than the inner diameter of the central portion of the pin body 401. Further, flanges are formed on the side surfaces of the contact portions 402 and 403 in order to contact the lower end or upper end of the pin body 401 from the inside and prevent the contact portions 402 and 403 from falling off the pin body 401. Has been.

  Inside the pin body 401, an elastic member having conductivity such as a metal spring 404 is provided. The spring 404 urges the contact portions 402 and 403 toward the lower end or the upper end of the pin body 401 so that the contact portions 402 and 403 can be changed with respect to the axial direction of the pin body 401. Therefore, when one end of the contact pin 400 is pressed along the axial direction of the pin body 401 by a terminal of the IC device or the like, a force opposite to the pressed direction acts on the contact portions 402 and 403. Contact between the contact portions 402 and 403 and their terminals is ensured. For this reason, the conductive contact pin 400 is securely connected to a terminal or the like in contact with the contact portion 402 or 403.

  FIG. 11 is a cross-sectional view showing another example of the conductive contact pins 4 and 6 applicable to each embodiment of the present invention. As an example corresponding to the conductive contact pins 4 and 6, the conductive contact pins are used. A side cross-section of pin 410 is shown.

  The conductive contact pin 410 includes a substantially cylindrical pin body 411 formed of a conductive metal, an elongated pin-shaped plunger 412 and a coil-shaped spring 413 inserted into a hole or a through-hole formed in the substrate. Have. Both the plunger 412 and the coil spring 413 are made of a conductive metal and are accommodated in the pin body 411.

  The pin body 411 includes a first portion 411a that opens downward, a second portion 411c that is arranged coaxially with the first portion, an inner diameter that gradually changes in the extending direction of the pin body 411, and the first portion 411a And an inclined portion 411b communicating with the second portion 411c. The inner diameter of the first portion 411a in the vicinity of the lower opening of the pin body 411 (for example, the opening facing the circuit board out of the bottom of the hole or the opening of the through hole) is the second portion 411c that is the central portion of the pin body 411. Is smaller than the inner diameter. The pin body 411 has a third portion 411d that is in communication with the second portion 411c and has a smaller inner diameter than the second portion 411c, and an upper surface opening is formed in the third portion 411d. Yes.

  The coiled spring 413 accommodated in the pin body 411 includes an upper part 413a accommodated in the second part 411c of the pin body 411 and a lower part 413b connected to the upper part 413a. The upper portion 413a has elasticity capable of being compressed in the axial direction, that is, in the extending direction of the pin body 411. The upper portion 413a has an outer diameter that is substantially the same as or smaller than the inner diameter of the second portion 411c of the pin body 411. The lower part 413b is formed continuously with the upper part 413a, and the spring is wound more densely in the lower part 413b than in the upper part 413a. Further, the outer diameter of the lower portion 413b is smaller than that of the upper portion 413a, and is substantially the same as or smaller than the inner diameter of the first portion 411a of the pin body 411. Therefore, the diameter of the upper portion 413a of the coiled spring 413 (that is, the portion located in the second portion 411c of the pin body 411) is larger than the inner diameter of the first portion 411a of the pin body 411. Therefore, the pin body 411 can prevent the coiled spring 413 from dropping from the pin body 411. Further, the length of the upper portion 413 a of the coiled spring 413 is substantially the same as the length of the second portion 411 c of the pin body 411. On the other hand, the length of the lower portion 413b of the coil spring 413 is longer than the first portion 411a of the pin body 411. Therefore, the lower part 413b of the coiled spring 413 inserted into the pin body 411 protrudes from the lower opening of the pin body 411, and the lower end of the coiled spring 413 contacts the terminal of the circuit board or the bottom of the hole, It is designed to be electrically connected. In addition, a plunger 412 described later is always biased upward by a coil spring 413.

  The lower portion 413b of the coiled spring 413 is configured such that adjacent windings of the spring come into contact with each other when the coiled spring 413 is in a free state (not receiving a compressive force). Therefore, in the lower portion 413b of the coil spring 413, the cross-sectional area of the conductive path formed by the coil spring 413 and the pin body 411 is widened, so that the conductive resistance of the conductive path can be reduced. Further, the conductive path is not coiled, but can be formed in a straight line substantially parallel to the extending direction of the coiled spring 413. Therefore, even when a high frequency signal is applied to the contact pin, it is possible to suppress the generation of inductance in this portion. In this embodiment, the upper part 413a and the lower part 413b are comprised by changing the outer diameter and winding pitch of one spring. Therefore, an elastic member can be produced at a low cost with a small number of parts.

  In addition, the lower part of the coil spring is configured so that adjacent windings of the spring do not contact each other in a free state, and when the IC device or the circuit board is attached to the pin holder and the coil spring is compressed, The conductive contact pin 410 may be configured such that adjacent turns of the lower portion springs are in contact. When the coiled spring is configured so that adjacent windings of the spring in the lower part of the coiled spring are in contact with each other in advance, the coiled spring is substantially parallel to the extending direction regardless of the degree of compression of the coiled spring. Therefore, the conductive path can be shortened more reliably.

  On the other hand, in the second portion 411 c of the pin body 411, the coiled spring 413 is wound sparsely, so that the coiled spring 413 has elasticity along the longitudinal direction of the pin body 411.

  In the present embodiment, the elastic member is constituted by one coil spring, but the elastic member may be constituted in other forms. For example, two coil springs having different outer diameters or spring constants may be inserted into the pin body 411 in series. Moreover, those coiled springs may be integrated.

  Alternatively, the lower part of the coil spring may be composed of a metal sleeve or a metal rod. These metal sleeves or metal rods may be connected to the upper part of the coil spring in a known manner near the upper end of the metal sleeve or metal rod. As the connection method, for example, a method of mechanically engaging them or a method of bonding with a conductive adhesive can be employed. Further, the upper part of the coil spring may be an elastic member having conductivity, and the upper part is, for example, an air spring made of a conductive elastomer, a conductive material, or the extending direction of the pin body 411. It can be configured by a leaf spring or the like that can be compressed.

  The plunger 412 accommodated in the pin body 411 electrically connects the conductor provided on the terminal of the IC device or the upper surface of the hole formed in the substrate, the coiled spring 413 and the pin body 411.

  The upper end of the plunger 412 protrudes from the opening in the upper part of the pin body 411 so as to be surely in contact with the conductor provided on the upper surface of the hole formed in the terminal of the IC device or the substrate. On the other hand, the lower end of the plunger 412 is inserted into the coiled spring 413. A flange 412 a having a larger diameter than other portions of the plunger 412 is formed at a substantially central portion in the longitudinal direction of the plunger 412. The lower end of the flange 412 a is abutted with the upper end of the coiled spring 413. Therefore, when the plunger 412 is pressed by the terminal of the IC device or the like, the plunger 412 moves downward, and the plunger 412 compresses the coiled spring 413 along the longitudinal direction of the pin body 411. Thereby, the plunger 412 and the coiled spring 413 can be reliably brought into contact with each other, and the plunger 412 and the coiled spring 413 can be prevented from being poorly connected. Further, since the contact area between the plunger 412 and the coiled spring 413 and the pin body 411 increases, the resistance of the conductive path from the plunger 412 and the coiled spring 413 through the pin body 411 can be reduced.

  Note that the length of the plunger 412 is designed so that the lower end of the plunger 412 fits into the portion with the larger inner diameter of the pin body 411 (that is, the second portion 411c) even when located at the lower end of the movement range of the plunger 412. It is preferable. By setting the length of the plunger 412 in this way, when the IC device or the circuit board is removed from the pin holder, the lower end of the plunger 412 is caught between the thin portions of the coiled spring 413 and cannot be removed. Can be prevented.

  In addition, in a state where the coiled spring 413 is compressed, the lower end portion of the plunger 412 is preferably in contact with the sparsely wound portion of the coiled spring 413. When the plunger 412 comes into contact with the inner peripheral surface of the coiled spring 413, the coiled spring 413 is bent, and the plunger 412 is pushed back by the coiled spring 413 by its elastic repulsive force. When this elastic repulsive force is large, the friction between the coiled spring 413 and the plunger 412 increases, and the vertical movement of the plunger 412 may be hindered. The rigidity of the sparsely wound portion of the coiled spring 413 is lower than the rigidity of the densely wound portion. Therefore, when the lower end portion of the plunger 412 comes into contact with the coiled spring 413, the elastic repulsive force acting on the plunger 412 can be reduced when the portion of the contacted coiled spring 413 is loosely wound. Thus, the vertical movement of the plunger 412 can be smoothed.

  Further, it is preferable that the densely wound portion of the coiled spring 413 is short, and the upper portion 413a of the coiled spring 413 is preferably composed only of a portion that is substantially sparsely wound.

  The shorter the portion of the coiled spring 413 that is wound tightly, the longer the dimension of the coiled spring 413 that is the portion that exhibits elasticity in the longitudinal direction. Therefore, the movement amount of the plunger 412 can be increased as the densely wound portion of the coil spring 413 is shorter. Furthermore, if the amount of movement of the plunger 412 can be increased, the spring coefficient of the sparsely wound portion can be reduced. Therefore, for example, even if the positions of the IC device terminals in contact with the upper ends of the plurality of conductive contact pins 410 held by the pin holder in the height direction (long axis direction of the conductive contact pins 410) are different, each conductive contact A change in contact pressure between the plunger 412 and the terminal of the IC device between the pins is reduced, and a stable contact state can be obtained.

  The pin body 411 has a small inner diameter in the vicinity of the upper opening. The thinned portion locks the upper end of the flange 412a of the plunger 412 to define the upper end of the movement range of the plunger 412.

  In addition, according to other embodiment, you may form the inner shape of each hole formed in the board | substrate of a pin holder similarly to the inner shape of the pin body 411 of the electroconductive contact pin 410 shown by FIG. . And while forming a conductor in each hole, the plunger 412 and the coiled spring 413 of the conductive contact pin 410 shown in FIG. 11 may be arranged as shown in FIG. In this case, the plunger 412 and the coiled spring 413 constitute a conductive contact pin.

  As described above, those skilled in the art can make various modifications in accordance with the embodiment to be implemented within the scope of the present invention.

(Modification of array pattern)
FIG. 12 is a plan view showing another example of the first arrangement pattern of the first conductive contact pins 4. FIG. 13 is a plan view showing another example of the second arrangement pattern of the second conductive contact pins 6.

  As shown in FIG. 12, on the upper surface 310a of the first substrate 310, each of the plurality of first conductive contact pins 4 is electrically connected to each terminal of the IC device attached to the pin holder. Are provided with a plurality of holes. Each of the plurality of first conductive contact pins 4 is inserted into the corresponding hole, and the first array pattern PA2a is formed by the plurality of first conductive contact pins 4. FIG. 12 shows an example in which the first array pattern PA2a of the first conductive contact pins 4 is configured as a 6 × 6 rectangular array pattern with a pitch P1. Moreover, 823a-823d shown by FIG. 12 is a through-hole for penetrating the fixing tool 83 (FIG. 2).

  On the other hand, as shown in FIG. 13, on the lower surface 320b of the second substrate 320, each of the plurality of second conductive contact pins 6 is electrically connected to each terminal of the circuit board to which the pin holder is attached. Thus, a plurality of holes are provided. Each of the plurality of second conductive contact pins 6 is inserted into a corresponding hole, and a second array pattern PA2b different from the first array pattern PA2a is formed by the plurality of second conductive contact pins 6. FIG. 13 shows an example in which the second array pattern PA2b of the second conductive contact pins 6 is also configured by a 6 × 6 rectangular array pattern, but the first array pattern PA2a is between the conductive contact pins. The pitch P2 (> P1) is different. Further, 824a to 824d shown in FIG. 13 are through holes for allowing the fixture 83 (FIG. 2) to pass therethrough.

  In the example shown in FIGS. 12 and 13, the first and second array patterns PA2a and PA2b have similar shapes in which the pitch between pins along both the vertical direction and the horizontal direction is different. The first arrangement pattern and the second arrangement pattern may differ not only in pitch and arrangement but also in the number of pins.

(Second Embodiment)
FIG. 14 is an enlarged view of a cross-section of the main part of the pin holder 1A according to the second embodiment of the IC device socket 100 according to the present invention. The pin holder 1A according to the embodiment shown in FIG. 14 also constitutes a part of the IC device socket 100 shown in FIGS. 1 and 2, similarly to the embodiment of FIG. However, the pin holder 1A according to the present embodiment includes the first substrate 410, the second substrate 420, and the third substrate 430. The first substrate 410 and the third substrate 430 are integrated with each other, It differs from the embodiment of FIG. 5 in that the third substrate 430 has a separate configuration. Except for the above differences, the configurations and materials of the substrates 410 to 430 are the same as those of the above-described embodiment of FIG.

  First, the structure of the first substrate 410 shown in FIG. 14 will be described in detail. The first substrate 410 has a structure integrated with the third substrate 430 by being laminated or bonded to the third substrate 430. The first substrate 410 is substantially the same as the first substrate 210 in the embodiment of FIG. It is the same in structure and constituent materials.

  That is, the first substrate 410 has an upper surface 410a facing an IC device (not shown), a lower surface 410b facing the upper surface 410a, a base material 4110 made of a dielectric such as glass epoxy resin, and the base. At least one dielectric layer 4111 embedded in the material 4110 (which may further include another dielectric layer), and a conductive layer 4112 such as copper on the upper surface side and the lower surface side of the dielectric layer 4111; 4113 is formed. The base material 4110 is formed with a plurality of through holes so that the first conductive contact pins 4 to be inserted form the first array pattern PA1b (or the pattern PA2a in FIG. 12). Conductive materials 4151 to 4156 such as copper, gold, or silver are provided on the inner surface of the hole.

  Of the conductive layers formed on both surfaces of the dielectric layer 4111, one conductive layer 4112 constitutes a power supply layer electrically connected to the power supply pin of the IC device socket 100, and the other conductive layer 4113 is A ground (GND) layer electrically connected to the grounding pin of the IC device socket 100 is formed. Note that the upper surface 410 a of the first substrate 410 shown in FIG. 14 is coincident with the upper surface of the base material 4110, and the lower surface 410 b of the first substrate 410 is coincident with the lower surface of the base material 4110. The lower surface 410b is in direct contact with the upper surface 430a of the third substrate 430. The dielectric layers and the conductive layers formed on both surfaces are disposed on the first substrate 410 over the entire surface. Therefore, a capacitor having an area substantially equal to the area of the first substrate 410 can be formed.

  Of the first conductive contact pins 4 inserted into the corresponding through holes in the first substrate 410, the first conductive contact pins 4142, 4143, 4145 are grounding pins, and the first conductive contact pins 4141, 4146 is a signal transmission pin, and the first conductive contact pin 4144 is a power supply pin.

  Each of the first conductive contact pins 4141 to 4146 penetrates the first substrate 410 from the upper surface 410a toward the lower surface 410b. Specifically, the first conductive contact pins 4142, 4143, 4145, which are ground pins, are press-fitted into the corresponding through holes in contact with the conductive materials 4152, 4153, 4155, respectively. Are respectively held on the first substrate 410. In addition, each of the conductive materials 4152, 4153, and 4155 is in electrical contact with the conductive layer 4113 that is a ground layer. The first conductive contact pins 4144 that are power supply pins are press-fitted into the corresponding through-holes while being in contact with the conductive material 4154, whereby the power supply pins are held on the first substrate 410. The conductive material 4154 is in electrical contact with the conductive layer 4112 which is a power supply layer.

  On the other hand, the first conductive contact pins 4141 and 4146 which are signal transmission pins are inserted into the corresponding through holes without contacting the conductive materials 4151 and 4156. That is, the opening diameter of the through hole corresponding to the diameter d of the pin body of the first conductive contact pins 4141 and 4146 is set to D (> d), and a coaxial line is formed in the first substrate 410. ing. Note that the conductive materials 4151 and 4156 that are spaced apart from the first conductive contact pins 4141 and 4146 are electrically connected to the conductive layer 4113 that is a ground layer.

  A plate-like holding member 4121 is provided on or above the upper surface 410 a of the first substrate 410. The plate-shaped holding member 4121 has through holes provided corresponding to the first conductive contact pins 4141 to 4146, respectively, and each of these through holes has a diameter smaller than the diameter d of the pin body. The first conductive contact pins 4141 to 4146 are securely held on the first substrate 410 by inserting the respective plunger tips into the corresponding through holes of the plate-like holding member 4121.

  Further, the base material 4110 is on or above the surface (the surface coincident with the upper surface 410a of the first substrate 410) and in the vicinity of the plunger of the first conductive contact pins 4141 and 4146 which are signal transmission pins. And a layered grounding conductor (grounding conductor layer) 4131 to be grounded. The grounding conductor layer 4131 has conductive materials 4152, 4153, 4155 (grounding pins) electrically connected to the first conductive contact pins 4142, 4143, 4145 as the grounding pins on the surface of the base material 4110. Are electrically connected to the first conductive contact pins 4141 and 4146 which are signal transmission pins. In this way, by arranging a conductor layer with the same potential as the ground layer near the plunger with a diameter smaller than that of the pin body, the inductance component of the plunger tip is compensated for, and insertion loss of the signal transmission pin and near-end crosstalk are reduced. Can be small. Further, providing the grounding conductor layer on the surface layer of the base material 4110 can be realized by a normal multilayer substrate manufacturing process, and a larger capacitance component can be obtained than when the grounding conductor layer is provided on the inner layer of the base material 4110. Can do. In FIG. 14, the grounding conductor layer 4131 and the plate-like holding member 4121 are illustrated apart from each other for the sake of clarity, but they may be in contact with each other.

  Next, the structure of the second substrate 420 shown in FIG. 14 will be described. Note that the second substrate 420 is substantially the same in structure and constituent material as the second substrate 220 shown in FIG.

  That is, the second substrate 420 has an upper surface 420a facing the lower surface 430b of the third substrate 430 integrated with the first substrate 410 and a lower surface 420b facing the upper surface 420a, and a dielectric such as glass epoxy resin. A base material 4210 made of the above and at least one dielectric layer 4211 embedded in the base material 4210 (another dielectric layer may be provided), and an upper surface side and a lower surface side of the dielectric layer 4211 Are formed with conductive layers 4212 and 4213 such as copper. One conductive layer 4212 constitutes a power supply layer electrically connected to the power supply pin of the IC device socket 100, and the other conductive layer 4213 is electrically connected to the ground pin of the IC device socket 100. Configure a connected ground (GND) layer. The base material 4210 has a plurality of through holes so that the second conductive contact pins 6 to be inserted form a second arrangement pattern (FIG. 4 or FIG. 13). Are provided with conductive materials 4251 to 4256 such as copper, gold or silver.

  Of the second conductive contact pins 6 inserted into the corresponding through holes in the second substrate 420, the second conductive contact pins 4242, 4243, 4245 are grounding pins, and the second conductive contact pins 4241, Reference numeral 4244 denotes a signal transmission pin constituting the above-described coaxial structure, and the second conductive contact pin 4246 is a power supply pin.

    Plate-shaped holding members 4221 and 4222 are provided on or above the upper surface 420 a and the lower surface 420 b of the second substrate 420. Further, the second substrate 420 is a second conductive contact that is a signal transmission pin on or above the surface (surfaces respectively matching the upper surface 420a and the lower surface 420b of the second substrate 420). In the vicinity of the plungers of the pins 4241 and 4244, there are layered grounding conductors (grounding conductor layers) 4231 and 4232 to be grounded. In FIG. 14, the grounding conductor layers 4231 and 4232 and the plate-like holding members 4221 and 4222 are illustrated apart from each other for the sake of clarity, but they may be in contact with each other.

  Next, the third substrate 430 shown in FIG. 14 is substantially the same in structure and constituent materials except that the upper surface 430a and the lower surface 410b of the first substrate 410 are in direct contact. 5 is the same as the third substrate 230 of the embodiment shown in FIG.

  That is, the third substrate 430 has an upper surface 430 a that faces the lower surface 410 b of the first substrate 410 and a lower surface 430 b that faces the upper surface 420 a of the second substrate 420. Further, the third substrate 430 includes a base material 4310 made of a dielectric such as glass epoxy resin, and two dielectric layers 4311 and 4314 embedded in the base material 4310, and the upper surface side of the dielectric layer 4311. In addition, conductive layers 4312 and 4313 such as copper are formed on the lower surface side. Conductive layers 4315 and 4316 such as copper are formed on the upper surface side and the lower surface side of the dielectric layer 4314. Each of the conductive layers 4312 and 4315 constitutes a power supply layer electrically connected to the power supply pin of the IC device socket 100, and each of the conductive layers 4313 and 4316 is used for grounding the IC device socket 100. A ground (GND) layer electrically connected to the pins is formed.

  In the third substrate 430, vertical connection elements 4381 to 4384 that constitute a part of a conductive path for signal transmission, vertical connection elements 4361 to 4366 that constitute a part of a conductive path for grounding, and a conductive path for power supply Vertical connection elements 4371 and 4372 constituting a part of are provided. The vertical connection elements 4381 and 4382 are electrically connected by the horizontal connection element 4391, and the horizontal connection element 4391 is a strip sandwiched between the conductive layers 4313 and 4316 constituting the ground layer via the base material 4310, respectively. Act as a line. Similarly, the vertical connection elements 4383 and 4384 are electrically connected by the horizontal connection element 4392, and the horizontal connection element 4392 is sandwiched between the conductive layers 4313 and 4316 constituting the ground layer via the base material 4310, respectively. Functions as a stripline.

  In the third substrate 430, the vertical connection elements 4381 and 4384 have contact pads 4381b and 4384b that are electrically connected to the conductive contact pins 4241 and 4244, which are signal transmission pins, on the lower surface 430b, respectively. . Further, on the upper surface side of the vertical connection elements 4381 and 4384, excavation holes 4381a and 4384a for removing a part of each of the vertical connection elements 4381 and 4384 are provided in order to avoid a stub in the signal path. On the other hand, the vertical connection elements 4382 and 4383 have contact pads 4382a and 4383a that are electrically connected to the conductive contact pins 4141 and 4146, which are signal transmission pins, on the upper surface 430a, respectively. Further, on the lower surface side of the vertical connection elements 4382 and 4383, excavation holes 4382b and 4383b for removing parts of the vertical connection elements 4382 and 4383 are provided in order to avoid stubs in the signal path. The vertical connection elements 4361 to 4366 for grounding have contact pads 4361a to 4366a located on the upper surface 430, respectively, and contact pads 4361b to 4366b located on the lower surface 430b. Furthermore, the vertical connection elements 4371 and 4372 for power supply have contact pads 4371a and 4372a located on the upper surface 430, respectively, and contact pads 4371b to 4372b located on the lower surface 430b.

  In the embodiment shown in FIG. 14 described above, the third substrate is integrated with the first substrate and separated from the second substrate, but the third substrate is integrated with the second substrate, Needless to say, it may be configured to be separated from one substrate.

(Third embodiment)
FIG. 15 is an enlarged view of a cross-section of the main part of the pin holder 1B according to the third embodiment of the IC device socket 100 according to the present invention. The pin holder 1B according to the embodiment shown in FIG. 15 also constitutes a part of the IC device socket 100 shown in FIGS. 1 and 2 as in the embodiment shown in FIGS. To do. However, the pin holder 1B according to the present embodiment includes the composite substrate 510 in which the structures of the first substrates 210 and 410 and the third substrates 230 and 430 in the above-described embodiments are integrated, and the second substrate 520. That is, in FIG. 15, the upper half of the composite substrate 510 is a first substrate portion corresponding to the first substrates 210 and 410 in the first and second embodiments, and the half of the composite substrate 510 is the first and second portions. This is a third substrate portion corresponding to the third substrates 230 and 430 in the second embodiment. Therefore, in this specification, the first substrate refers to the upper half of the composite substrate 510 in the case of the composite substrate 510 in the third embodiment. In this specification, the third substrate refers to the lower half of the composite substrate 510 in the case of the composite substrate 510 in the third embodiment.

  First, the composite substrate 510 has an upper surface 510a facing an IC device (not shown), a lower surface 510b facing the second substrate 520, a base material 5110 made of a dielectric material such as glass epoxy resin, and the base. Dielectric layers 5111 and 5114 are embedded in the material 5110. Conductive layers 5112 and 5113 such as copper are formed on the upper surface side and the lower surface side of the dielectric layer 5111, and conductive layers 5115 and 5116 such as copper are formed on the upper surface side and the lower surface side of the dielectric layer 5114. In addition, in the base material 5110, a plurality of through holes or bottom surfaces are covered with a conductive material so that the first conductive contact pins 4 to be inserted form a first array pattern PA1b (or the pattern PA2a in FIG. 12). Holes are formed, and conductive materials 5151 to 5156 such as copper, gold or silver are provided on the inner surfaces of these holes. Further, the base material 5110 is provided with through holes or holes so as to form an array pattern of the second conductive contact pins 6 inserted into the second substrate 520, and the first conductive material is also formed on the inner surface of these holes. Vertical connection elements 5381, 5361, 5362, 5384, 5363, and 5371 are provided as conductive paths that electrically connect pins having the same function among the conductive contact pins 4 and the second conductive contact pins 6.

  Of the conductive layers formed on both surfaces of the dielectric layer 5111, one conductive layer 5112 constitutes a power supply layer electrically connected to the power supply pin of the IC device socket 100, and the other conductive layer 5113 is A ground (GND) layer electrically connected to the grounding pin of the IC device socket 100 is formed. Of the conductive layers formed on both surfaces of the dielectric layer 5114, one conductive layer 5115 constitutes a power supply layer electrically connected to the power supply pin of the IC device socket 100, and the other conductive layer. 5116 constitutes a ground layer electrically connected to the grounding pin of the IC device socket 100. Note that the upper surface 510 a of the composite substrate 510 shown in FIG. 15 matches the upper surface of the base material 5110, and the lower surface 510 b of the composite substrate 510 matches the lower surface of the base material 5110. In addition, each dielectric layer and the conductive layers formed on both surfaces thereof are disposed on the entire surface of the composite substrate 510. Therefore, a capacitor having an area substantially equal to the area of the composite substrate 510 can be formed.

  In the composite substrate 510, among the first conductive contact pins 4 inserted into the corresponding holes, the first conductive contact pins 5142, 5143, 5145 are grounding pins, and the first conductive contact pins 5141, 5146 are It is a signal transmission pin, and the first conductive contact pin 5144 is a power supply pin.

  The first conductive contact pins 5142, 5143, and 5145, which are grounding pins, are press-fitted into the corresponding through-holes while being in contact with the conductive materials 5152, 5153, and 5155, respectively. Are held respectively. In addition, each of the conductive materials 5152, 5153, and 5155 is in electrical contact with both of the conductive layers 5113 and 5116 that are ground layers. The first conductive contact pin 5144, which is a power supply pin, is press-fitted into the corresponding through hole in contact with the conductive material 5154, whereby the power supply pin is held on the composite substrate 510. The conductive material 5154 is electrically connected to both of the conductive layers 5112 and 5115 which are power supply layers.

  On the other hand, the first conductive contact pins 5141 and 5146 which are signal transmission pins are inserted into the corresponding holes without contacting the conductive materials 5151 and 5156. Note that contact pads 5382 and 5383 that constitute a part of the signal path are provided at the bottoms of these holes while being electrically insulated from the conductive materials 5151 and 5156. That is, the opening diameter of the hole corresponding to the pin body diameter d of the first conductive contact pins 5141 and 5146 is set to D (> d), and a coaxial line is formed in the composite substrate 510. . Note that the conductive materials 5151 and 5156 that are spaced apart from the first conductive contact pins 5141 and 5146 are electrically connected to both of the conductive layers 5113 and 5116 that are ground layers.

  Here, the contact pad 5382 provided at the bottom of the hole into which the first conductive contact pin 5141 is inserted is electrically connected via the vertical connection element 5381 and the horizontal connection element 5391. The horizontal connection element 5391 is located between the ground layers 5411 and 5412 provided in the base material 5110 of the composite substrate 510. With this structure, the horizontal connection element 5391 functions as a strip line. On the other hand, the contact pad 5383 provided at the bottom of the hole into which the first conductive contact pin 5146 is inserted is electrically connected through the vertical connection element 5384 and the horizontal connection element 5392. Similarly to the horizontal connection element 5391, the horizontal connection element 5392 is located between the ground layers 5411 and 5412 provided in the base material 5110 of the composite substrate 510. With this structure, the horizontal connection element 5392 is also Functions as a stripline. The ground layers 5411 and 5412 sandwiching the horizontal connection elements 5391 and 5392 are electrically connected to the conductive materials 5152, 5153 and 5155 which are in contact with the conductive contact pins 5142, 5143 and 5145 which are ground pins. Has been. Further, an excavation hole 5381a, an upper portion of the vertical connection element 5181 (upper surface side of the composite substrate 510) and an upper portion of the vertical connection element 5184 (upper surface side of the composite substrate 510), which are part of the conductive path for signal transmission, are respectively provided. 5384a is provided. These excavation holes 5381a and 5384a are holes formed so that a part of the vertical connection element 5381 and a part of the vertical connection element 5382 are removed by a drill in order to prevent stubs.

  A plate-like holding member 5121 is provided on or above the upper surface 510 a of the composite substrate 510. The plate-shaped holding member 5121 has through holes provided corresponding to the first conductive contact pins 5141 to 5146, respectively, and each of these through holes has a diameter smaller than the diameter d of the pin body. The first conductive contact pins 5141 to 5146 are securely held on the composite substrate 510 by inserting the respective plunger tips into the corresponding through holes of the plate-like holding member 5121.

  Further, the base material 5110 is on or above the surface (the surface corresponding to the upper surface 510a and the lower surface 510b of the composite substrate 510), and the first conductive contact pins 5141 and 5146 which are signal transmission pins. In the vicinity of the plunger, there are layered grounding conductors (grounding conductor layers) 5131 and 5132 to be grounded. The grounding conductor layers 5131 and 5132 are electrically conductive materials 5152, 5153 and 5155 (on the surface of the base material 5110, which are electrically connected to the first conductive contact pins 5142, 5143 and 5145, respectively). The first conductive contact pins 5141 and 5146 which are signal transmission pins are electrically connected to a plating layer provided on the inner surface of the through hole in which the ground pin is inserted. Not. In this way, by arranging a conductor layer with the same potential as the ground layer near the plunger with a diameter smaller than that of the pin body, the inductance component of the plunger tip is compensated for, and insertion loss of the signal transmission pin and near-end crosstalk are reduced. Can be small. In addition, providing a grounding conductor layer on the surface layer of the base material 5110 can be realized by a normal multilayer substrate manufacturing process, and a larger capacitance component can be obtained than when a grounding conductor layer is provided on the inner layer of the base material 5110. Can do.

  In FIG. 15, the grounding conductor layer 5131 and the plate-like holding member 5121 are illustrated apart from each other for the sake of clarity, but they may be in contact with each other. In the example shown in FIG. 15, the grounding conductor layer 5132 provided on the lower surface of the base material 5110 (the surface corresponding to the lower surface 510 b of the composite substrate 510) is held by the second substrate 520. After the two conductive contact pins 6, the conductive contact pins 5242, 5243, and 5245 that function as grounding pins also function as pads that are in direct contact. On the other hand, the vertical connection elements 5381 and 5384 functioning as part of the conductor path for signal transmission are signal transmission pins among the conductive contact pins 6 held by the second substrate 520 on the lower surface of the base material 5110. Contact pads 5381b and 5384b that are electrically connected to the conductive contact pins 5241 and 5244, respectively.

  Next, the structure of the second substrate 520 shown in FIG. 15 will be described. The second substrate 520 includes the second substrates 220 and 420 in the first and second embodiments described above, and the structure and constituent materials thereof. Since this is the same, redundant description will be omitted.

  That is, the second substrate 520 has an upper surface 520a facing the lower surface 510b of the composite substrate 510, a lower surface 520b facing the upper surface 520a, and a base material 5210 made of a dielectric such as glass epoxy resin, and the base material. The dielectric layer 5211 includes at least one dielectric layer 5211 embedded in 5210 (may include another dielectric layer), and conductive layers 5212 and 5213 such as copper are provided on the upper surface side and the lower surface side of the dielectric layer 5211. Is formed. One conductive layer 5212 constitutes a power supply layer electrically connected to the power supply pin of the IC device socket 100, and the other conductive layer 5213 is electrically connected to the ground pin of the IC device socket 100. Configure a connected ground (GND) layer. In addition, a plurality of through holes are formed in the base material 5210 so that the second conductive contact pins 6 to be inserted form the second array pattern PA1b, and copper, gold are formed on the inner surfaces of these through holes. Alternatively, conductive materials 5251 to 5256 such as silver are provided.

  Of the second conductive contact pins 6 inserted into the corresponding through holes in the second substrate 520, the second conductive contact pins 5242, 5243, 5245 are ground pins, and the second conductive contact pins 5241, Reference numeral 5244 denotes a signal transmission pin constituting the above-described coaxial structure, and the second conductive contact pin 5246 is a power supply pin.

  Plate-shaped holding members 5221 and 5222 are provided on or above the upper surface 520 a and the lower surface 520 b of the second substrate 520. Further, the base material 5210 is on or above the surface (surfaces corresponding to the upper surface 520a and the lower surface 520b of the second substrate 520), and the second conductive contact pins 5241 which are signal transmission pins. In the vicinity of the plunger 5244, there are layered grounding conductors (grounding conductor layers) 5231 and 5232 to be grounded. In FIG. 15, the grounding conductor layers 5231 and 5232 and the plate-like holding members 5221 and 5222 are illustrated apart from each other for the sake of clarity, but they may be in contact with each other.

  DESCRIPTION OF SYMBOLS 1, 1A, 1B ... Pin holder, 100 ... IC device socket, 210, 410 ... First substrate, 220, 420, 520 ... Second substrate, 230, 430 ... Third substrate, 510 ... Composite substrate (first substrate + 3rd substrate), 4, 2141 to 2146, 4141 to 4146, 5141 to 5146 ... first conductive contact pins, 6, 2241 to 2246, 4241 to 4246, 5241 to 5246 ... second conductive contact pins, 2361 to 2366 2371 to 2372, 2381 to 2384, 2391 to 2392, 4361 to 4366, 4371 to 4372, 4381 to 4384, 4391 to 4392, 5381 to 5384, 5391 to 5392, conductive paths, 2121, 2122, 2221, 2222, 4121, 4122, 4221, 4222, 5121, 5 21,5222 ... holding member.

Claims (8)

A first substrate having a plurality of first conductive contact pins extending therein and forming a first array pattern;
A second substrate having a plurality of second conductive contact pins extending therein and forming a second array pattern different from the first array pattern, wherein each second conductive contact pin is one first A second substrate corresponding to the conductive contact pins;
A third substrate disposed between the first and second substrates and having a plurality of conductive paths therein, wherein each conductive path has one first conductive contact pin corresponding to the second conductive contact. A third substrate electrically connected to the pins;
A socket for an IC device comprising:
The IC device socket, wherein the third substrate is separated from at least one of the first substrate and the second substrate. 2. The IC device inspection socket according to claim 1, wherein the third substrate is separated from the first and second substrates. A body that supports the first to third substrates, a guide part for arranging an IC device to be inspected at a predetermined position on the surface of the first substrate, and a relative position of the first to third substrates The IC device socket according to claim 1, further comprising a body having a structure that suppresses fluctuations of the IC device. The first substrate includes a lower surface facing the second substrate, an upper surface facing the lower surface, and a plurality of holes extending from the upper surface toward the lower surface, and one corresponding first conductive contact pin A plurality of holes into which at least a part of each is inserted, and a holding member provided above or above at least one of the upper surface and the lower surface,
The holding member is a plurality of through holes into which a part of one corresponding first conductive contact pin is inserted, and a longitudinal axis of each of the plurality of first conductive contact pins is set to the first axis. Having a plurality of through-holes substantially matching the central axis of the corresponding hole in the substrate;
Conductive material is provided on the inner surface of each hole in the first substrate,
At least one of the plurality of first conductive contact pins is inserted into the corresponding hole so as to be electrically insulated from the conductor material provided on the inner surface of the corresponding hole in the first substrate. The IC device socket according to claim 1, wherein the socket is for IC devices. The dielectric material is arrange | positioned in the gap | interval of the said conductor material provided on the inner surface of the said corresponding hole, and the 1st electroconductive contact pin inserted in this corresponding hole. IC device socket. The second substrate has an upper surface facing the first substrate, a lower surface facing the upper surface, and a plurality of holes extending from the lower surface toward the upper surface, and one corresponding second conductive contact pin A plurality of holes into which at least a part of each is inserted, and a holding member provided above or above at least one of the lower surface and the upper surface,
The holding member is a plurality of through holes into which a part of one corresponding second conductive contact pin is respectively inserted, and the longitudinal axis of each of the plurality of second conductive contact pins is set to the second axis. Having a plurality of through-holes substantially matching the central axis of the corresponding hole in the substrate;
Conductive material is provided on the inner surface of each hole in the second substrate,
At least one of the plurality of second conductive contact pins is inserted into the corresponding hole so as to be electrically insulated from the conductor material provided on the inner surface of the corresponding hole in the second substrate. The IC device socket according to claim 1, wherein the socket is for IC devices. The third substrate has a structure in which a dielectric layer and a pair of conductive layers sandwiching the dielectric layer from both the first substrate side and the second substrate side are embedded therein. The IC device socket according to claim 1. 2. The IC device socket according to claim 1, wherein the third substrate has a structure in which at least one of a stripline and a microstripline is embedded therein.

Images