JP6114861B2 - インプリント装置、インプリント方法および物品製造方法 - Google Patents

インプリント装置、インプリント方法および物品製造方法 Download PDF

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Publication number
JP6114861B2
JP6114861B2 JP2016119151A JP2016119151A JP6114861B2 JP 6114861 B2 JP6114861 B2 JP 6114861B2 JP 2016119151 A JP2016119151 A JP 2016119151A JP 2016119151 A JP2016119151 A JP 2016119151A JP 6114861 B2 JP6114861 B2 JP 6114861B2
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JP
Japan
Prior art keywords
substrate
mold
rotation
imprint
rotation error
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2016119151A
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English (en)
Japanese (ja)
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JP2017011268A5 (https=
JP2017011268A (ja
Inventor
広明 古川
広明 古川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to KR1020187000951A priority Critical patent/KR101991640B1/ko
Priority to PCT/JP2016/002908 priority patent/WO2016208160A1/en
Publication of JP2017011268A publication Critical patent/JP2017011268A/ja
Publication of JP2017011268A5 publication Critical patent/JP2017011268A5/ja
Application granted granted Critical
Publication of JP6114861B2 publication Critical patent/JP6114861B2/ja
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70591—Testing optical components
    • G03F7/706—Aberration measurement
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7618—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
JP2016119151A 2015-06-22 2016-06-15 インプリント装置、インプリント方法および物品製造方法 Active JP6114861B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020187000951A KR101991640B1 (ko) 2015-06-22 2016-06-16 임프린트 장치, 임프린트 방법 및 물품 제조 방법
PCT/JP2016/002908 WO2016208160A1 (en) 2015-06-22 2016-06-16 Imprint apparatus, imprint method, and method of manufacturing article

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015125116 2015-06-22
JP2015125116 2015-06-22

Publications (3)

Publication Number Publication Date
JP2017011268A JP2017011268A (ja) 2017-01-12
JP2017011268A5 JP2017011268A5 (https=) 2017-02-16
JP6114861B2 true JP6114861B2 (ja) 2017-04-12

Family

ID=57764444

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016119151A Active JP6114861B2 (ja) 2015-06-22 2016-06-15 インプリント装置、インプリント方法および物品製造方法

Country Status (2)

Country Link
JP (1) JP6114861B2 (https=)
KR (1) KR101991640B1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7421278B2 (ja) * 2019-07-22 2024-01-24 キヤノン株式会社 インプリント装置、および物品製造方法
JP2024087500A (ja) 2022-12-19 2024-07-01 キオクシア株式会社 インプリント装置、パターン形成方法、及び半導体装置の製造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US618467A (en) * 1899-01-31 Fifth-wheel
JPH0488624A (ja) * 1990-07-31 1992-03-23 Nec Corp 半導体露光装置
JPH10177942A (ja) * 1996-12-17 1998-06-30 Nikon Corp 露光装置および露光装置における感光基板の受け渡し方法
JPH11307425A (ja) * 1998-04-22 1999-11-05 Nikon Corp マスクの受け渡し方法、及び該方法を使用する露光装置
JP4290177B2 (ja) * 2005-06-08 2009-07-01 キヤノン株式会社 モールド、アライメント方法、パターン形成装置、パターン転写装置、及びチップの製造方法
KR100740995B1 (ko) 2006-07-26 2007-07-20 한국기계연구원 나노 임프린트 공정에서 원형 모아레를 이용한 기판정렬장치
JP5150309B2 (ja) * 2008-03-03 2013-02-20 東芝機械株式会社 転写装置および転写方法
JP5173944B2 (ja) 2009-06-16 2013-04-03 キヤノン株式会社 インプリント装置及び物品の製造方法
JP5809409B2 (ja) 2009-12-17 2015-11-10 キヤノン株式会社 インプリント装置及びパターン転写方法
JP2011258605A (ja) * 2010-06-04 2011-12-22 Toshiba Corp パターン形成方法および半導体デバイスの製造方法
JP2012084732A (ja) * 2010-10-13 2012-04-26 Canon Inc インプリント方法及び装置
JP6053266B2 (ja) * 2011-09-01 2016-12-27 キヤノン株式会社 インプリント装置、物品の製造方法及びインプリント方法

Also Published As

Publication number Publication date
KR101991640B1 (ko) 2019-06-20
JP2017011268A (ja) 2017-01-12
KR20180016581A (ko) 2018-02-14

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