KR101991640B1 - 임프린트 장치, 임프린트 방법 및 물품 제조 방법 - Google Patents

임프린트 장치, 임프린트 방법 및 물품 제조 방법 Download PDF

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KR101991640B1
KR101991640B1 KR1020187000951A KR20187000951A KR101991640B1 KR 101991640 B1 KR101991640 B1 KR 101991640B1 KR 1020187000951 A KR1020187000951 A KR 1020187000951A KR 20187000951 A KR20187000951 A KR 20187000951A KR 101991640 B1 KR101991640 B1 KR 101991640B1
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South Korea
Prior art keywords
substrate
mold
rotation error
rotation
pattern area
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KR1020187000951A
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English (en)
Korean (ko)
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KR20180016581A (ko
Inventor
히로아키 후루카와
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캐논 가부시끼가이샤
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Priority claimed from PCT/JP2016/002908 external-priority patent/WO2016208160A1/en
Publication of KR20180016581A publication Critical patent/KR20180016581A/ko
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70591—Testing optical components
    • G03F7/706—Aberration measurement
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • H01L21/027—
    • H01L21/67242—
    • H01L21/67742—
    • H01L21/68764—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7618—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
KR1020187000951A 2015-06-22 2016-06-16 임프린트 장치, 임프린트 방법 및 물품 제조 방법 Active KR101991640B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JPJP-P-2015-125116 2015-06-22
JP2015125116 2015-06-22
JPJP-P-2016-119151 2016-06-15
JP2016119151A JP6114861B2 (ja) 2015-06-22 2016-06-15 インプリント装置、インプリント方法および物品製造方法
PCT/JP2016/002908 WO2016208160A1 (en) 2015-06-22 2016-06-16 Imprint apparatus, imprint method, and method of manufacturing article

Publications (2)

Publication Number Publication Date
KR20180016581A KR20180016581A (ko) 2018-02-14
KR101991640B1 true KR101991640B1 (ko) 2019-06-20

Family

ID=57764444

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020187000951A Active KR101991640B1 (ko) 2015-06-22 2016-06-16 임프린트 장치, 임프린트 방법 및 물품 제조 방법

Country Status (2)

Country Link
JP (1) JP6114861B2 (https=)
KR (1) KR101991640B1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021019126A (ja) * 2019-07-22 2021-02-15 キヤノン株式会社 インプリント装置、および物品製造方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024087500A (ja) 2022-12-19 2024-07-01 キオクシア株式会社 インプリント装置、パターン形成方法、及び半導体装置の製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100740995B1 (ko) 2006-07-26 2007-07-20 한국기계연구원 나노 임프린트 공정에서 원형 모아레를 이용한 기판정렬장치
US20100314798A1 (en) 2009-06-16 2010-12-16 Canon Kabushiki Kaisha Imprint apparatus and method of manufacturing article
US20110147970A1 (en) 2009-12-17 2011-06-23 Canon Kabushiki Kaisha Imprint apparatus and pattern transfer method
US20120091611A1 (en) 2010-10-13 2012-04-19 Canon Kabushiki Kaisha Imprint method and apparatus

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US618467A (en) * 1899-01-31 Fifth-wheel
JPH0488624A (ja) * 1990-07-31 1992-03-23 Nec Corp 半導体露光装置
JPH10177942A (ja) * 1996-12-17 1998-06-30 Nikon Corp 露光装置および露光装置における感光基板の受け渡し方法
JPH11307425A (ja) * 1998-04-22 1999-11-05 Nikon Corp マスクの受け渡し方法、及び該方法を使用する露光装置
JP4290177B2 (ja) * 2005-06-08 2009-07-01 キヤノン株式会社 モールド、アライメント方法、パターン形成装置、パターン転写装置、及びチップの製造方法
JP5150309B2 (ja) * 2008-03-03 2013-02-20 東芝機械株式会社 転写装置および転写方法
JP2011258605A (ja) * 2010-06-04 2011-12-22 Toshiba Corp パターン形成方法および半導体デバイスの製造方法
JP6053266B2 (ja) * 2011-09-01 2016-12-27 キヤノン株式会社 インプリント装置、物品の製造方法及びインプリント方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100740995B1 (ko) 2006-07-26 2007-07-20 한국기계연구원 나노 임프린트 공정에서 원형 모아레를 이용한 기판정렬장치
US20100314798A1 (en) 2009-06-16 2010-12-16 Canon Kabushiki Kaisha Imprint apparatus and method of manufacturing article
US20110147970A1 (en) 2009-12-17 2011-06-23 Canon Kabushiki Kaisha Imprint apparatus and pattern transfer method
US20120091611A1 (en) 2010-10-13 2012-04-19 Canon Kabushiki Kaisha Imprint method and apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021019126A (ja) * 2019-07-22 2021-02-15 キヤノン株式会社 インプリント装置、および物品製造方法
JP7421278B2 (ja) 2019-07-22 2024-01-24 キヤノン株式会社 インプリント装置、および物品製造方法

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JP6114861B2 (ja) 2017-04-12
JP2017011268A (ja) 2017-01-12
KR20180016581A (ko) 2018-02-14

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