JP6096776B2 - ウェハー搬送器 - Google Patents

ウェハー搬送器 Download PDF

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Publication number
JP6096776B2
JP6096776B2 JP2014526117A JP2014526117A JP6096776B2 JP 6096776 B2 JP6096776 B2 JP 6096776B2 JP 2014526117 A JP2014526117 A JP 2014526117A JP 2014526117 A JP2014526117 A JP 2014526117A JP 6096776 B2 JP6096776 B2 JP 6096776B2
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JP
Japan
Prior art keywords
wafer
door
cantilever
finger
tip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2014526117A
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English (en)
Japanese (ja)
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JP2014527721A5 (enExample
JP2014527721A (ja
Inventor
マイケル・エス・アダムズ
バリー・グレガーソン
マシュー・エイ・フラー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Entegris Inc
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Entegris Inc
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Filing date
Publication date
Application filed by Entegris Inc filed Critical Entegris Inc
Publication of JP2014527721A publication Critical patent/JP2014527721A/ja
Publication of JP2014527721A5 publication Critical patent/JP2014527721A5/ja
Application granted granted Critical
Publication of JP6096776B2 publication Critical patent/JP6096776B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67369—Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67373—Closed carriers characterised by locking systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67376—Closed carriers characterised by sealing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67383—Closed carriers characterised by substrate supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67386—Closed carriers characterised by the construction of the closed carrier

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2014526117A 2011-08-12 2012-08-13 ウェハー搬送器 Active JP6096776B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161523254P 2011-08-12 2011-08-12
US61/523,254 2011-08-12
PCT/US2012/050624 WO2013025629A2 (en) 2011-08-12 2012-08-13 Wafer carrier

Publications (3)

Publication Number Publication Date
JP2014527721A JP2014527721A (ja) 2014-10-16
JP2014527721A5 JP2014527721A5 (enExample) 2015-09-24
JP6096776B2 true JP6096776B2 (ja) 2017-03-15

Family

ID=47715660

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014526117A Active JP6096776B2 (ja) 2011-08-12 2012-08-13 ウェハー搬送器

Country Status (7)

Country Link
US (2) US9312157B2 (enExample)
EP (1) EP2742526A4 (enExample)
JP (1) JP6096776B2 (enExample)
KR (1) KR102011159B1 (enExample)
CN (2) CN106941087B (enExample)
TW (1) TWI587444B (enExample)
WO (1) WO2013025629A2 (enExample)

Families Citing this family (42)

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US9859141B2 (en) 2010-04-15 2018-01-02 Suss Microtec Lithography Gmbh Apparatus and method for aligning and centering wafers
US9837295B2 (en) 2010-04-15 2017-12-05 Suss Microtec Lithography Gmbh Apparatus and method for semiconductor wafer leveling, force balancing and contact sensing
WO2012054627A2 (en) * 2010-10-19 2012-04-26 Entegris, Inc. Front opening wafer container with wafer cushion
KR102091426B1 (ko) 2013-06-03 2020-03-20 미라이얼 가부시키가이샤 기판 수납 용기
WO2014205121A1 (en) * 2013-06-18 2014-12-24 Entegris, Inc. Front opening wafer container with weight ballast
US9960064B2 (en) 2013-06-19 2018-05-01 Miraial Co., Ltd. Substrate storing container
WO2015025410A1 (ja) 2013-08-22 2015-02-26 ミライアル株式会社 基板収納容器
JP6498758B2 (ja) * 2015-05-22 2019-04-10 ミライアル株式会社 基板収納容器
KR20180016543A (ko) * 2015-06-15 2018-02-14 엔테그리스, 아이엔씨. 일체형 본체를 갖는 도어를 갖는 웨이퍼 캐리어
KR102363033B1 (ko) 2015-07-03 2022-02-15 미라이얼 가부시키가이샤 기판 수납 용기
WO2017035256A1 (en) * 2015-08-25 2017-03-02 Entegris, Inc. Interlocking modular substrate support columns
TWI715623B (zh) * 2015-08-31 2021-01-11 美商恩特葛瑞斯股份有限公司 具有壓縮閂鎖之前開基板容器
US9881820B2 (en) * 2015-10-22 2018-01-30 Lam Research Corporation Front opening ring pod
US10388554B2 (en) 2016-04-06 2019-08-20 Entegris, Inc. Wafer shipper with purge capability
KR200492425Y1 (ko) * 2016-04-08 2020-10-13 엔테그리스, 아이엔씨. 퍼지 성능을 갖는 웨이퍼 운반기 미세 환경
JP2017188609A (ja) * 2016-04-08 2017-10-12 インテグリス・インコーポレーテッド パージ性能を備えたウエハシッパー微環境
CN106428923A (zh) * 2016-10-08 2017-02-22 无锡宏纳科技有限公司 晶圆储存箱
WO2018185906A1 (ja) * 2017-04-06 2018-10-11 ミライアル株式会社 基板収納容器
US10764270B2 (en) 2017-11-20 2020-09-01 Allstate Insurance Company Cryptographically transmitting and storing identity tokens and/or activity data among spatially distributed computing devices
TWI720881B (zh) * 2018-01-11 2021-03-01 家登精密工業股份有限公司 快拆式氣閥及應用其之基板容器
US10978326B2 (en) * 2018-10-29 2021-04-13 Taiwan Semiconductor Manufacturing Co, , Ltd. Semiconductor wafer storage device
NL2022185B1 (nl) * 2018-12-12 2020-07-02 Suss Microtec Lithography Gmbh Substratkassette
JP7334264B2 (ja) 2019-04-26 2023-08-28 インテグリス・インコーポレーテッド 基板容器
US10964584B2 (en) 2019-05-20 2021-03-30 Applied Materials, Inc. Process kit ring adaptor
US11104496B2 (en) * 2019-08-16 2021-08-31 Gudeng Precision Industrial Co., Ltd. Non-sealed reticle storage device
US12486120B2 (en) 2020-03-23 2025-12-02 Applied Materials, Inc. Substrate processing system carrier
US12027397B2 (en) 2020-03-23 2024-07-02 Applied Materials, Inc Enclosure system shelf including alignment features
USD980176S1 (en) * 2020-06-02 2023-03-07 Applied Materials, Inc. Substrate processing system carrier
USD954769S1 (en) * 2020-06-02 2022-06-14 Applied Materials, Inc. Enclosure system shelf
TWI746014B (zh) * 2020-06-16 2021-11-11 大立鈺科技有限公司 晶圓存取總成及其晶圓存取裝置與晶圓載具
TWI746045B (zh) * 2020-07-07 2021-11-11 家登精密工業股份有限公司 基板載具鎖扣結構
WO2022192335A1 (en) * 2021-03-10 2022-09-15 Entegris, Inc. Semiconductor substrate carrying container with front and rear openings
TWI782689B (zh) * 2021-09-02 2022-11-01 家登精密工業股份有限公司 快拆式氣閥、具有快拆式氣閥的基板容器及快拆式氣閥的安裝和拆卸方法
KR20240068690A (ko) * 2021-09-22 2024-05-17 엔테그리스, 아이엔씨. 프로세스 캐리어
CN113562309B (zh) * 2021-09-27 2021-12-14 徐州和润电子材料有限公司 一种通讯电子产品制造用硅晶片无损存储装置
KR102733145B1 (ko) 2022-04-05 2024-11-25 주식회사 삼에스코리아 웨이퍼 수납용기 및 그에 사용되는 캡 조립체
TWI848670B (zh) * 2022-06-30 2024-07-11 家登精密工業股份有限公司 保護包裝組件
TWD232262S (zh) * 2023-01-18 2024-07-11 日商信越聚合物股份有限公司 (日本) 儲存及運送晶圓之容器
US20250029857A1 (en) * 2023-07-21 2025-01-23 Entegris, Inc. Module retainer
CN116805608A (zh) * 2023-08-29 2023-09-26 芯岛新材料(浙江)有限公司 一种晶圆盒
WO2025074498A1 (ja) * 2023-10-03 2025-04-10 ミライアル株式会社 基板収納容器
WO2025163816A1 (ja) * 2024-01-31 2025-08-07 ミライアル株式会社 基板収納容器

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JP2011510491A (ja) * 2008-01-13 2011-03-31 インテグリス・インコーポレーテッド 大口径のウエハ容器とウエハ取扱方法
KR101554375B1 (ko) * 2008-04-25 2015-09-18 신에츠 폴리머 가부시키가이샤 리테이너, 및 리테이너를 구비한 기판 수납 용기
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JP2011060994A (ja) 2009-09-10 2011-03-24 Shin Etsu Polymer Co Ltd 基板収納容器及び基板の取り扱い方法

Also Published As

Publication number Publication date
CN106941087A (zh) 2017-07-11
US9312157B2 (en) 2016-04-12
CN103828033A (zh) 2014-05-28
KR102011159B1 (ko) 2019-08-14
TWI587444B (zh) 2017-06-11
WO2013025629A2 (en) 2013-02-21
EP2742526A4 (en) 2015-01-14
WO2013025629A3 (en) 2013-04-18
EP2742526A2 (en) 2014-06-18
TW201324678A (zh) 2013-06-16
US20150041353A1 (en) 2015-02-12
KR20140054205A (ko) 2014-05-08
CN103828033B (zh) 2016-11-16
CN106941087B (zh) 2020-03-10
US10147624B2 (en) 2018-12-04
JP2014527721A (ja) 2014-10-16
US20160254172A1 (en) 2016-09-01

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