KR102011159B1 - 웨이퍼 캐리어 - Google Patents

웨이퍼 캐리어 Download PDF

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Publication number
KR102011159B1
KR102011159B1 KR1020147006119A KR20147006119A KR102011159B1 KR 102011159 B1 KR102011159 B1 KR 102011159B1 KR 1020147006119 A KR1020147006119 A KR 1020147006119A KR 20147006119 A KR20147006119 A KR 20147006119A KR 102011159 B1 KR102011159 B1 KR 102011159B1
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KR
South Korea
Prior art keywords
wafer
delete delete
door
wafers
centrifugal
Prior art date
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KR1020147006119A
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English (en)
Korean (ko)
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KR20140054205A (ko
Inventor
마이클 에스. 아담스
배리 그레거슨
매튜 에이. 풀러
Original Assignee
엔테그리스, 아이엔씨.
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Application filed by 엔테그리스, 아이엔씨. filed Critical 엔테그리스, 아이엔씨.
Publication of KR20140054205A publication Critical patent/KR20140054205A/ko
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Publication of KR102011159B1 publication Critical patent/KR102011159B1/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67369—Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67373—Closed carriers characterised by locking systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67376—Closed carriers characterised by sealing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67383—Closed carriers characterised by substrate supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67386—Closed carriers characterised by the construction of the closed carrier

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020147006119A 2011-08-12 2012-08-13 웨이퍼 캐리어 Active KR102011159B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161523254P 2011-08-12 2011-08-12
US61/523,254 2011-08-12
PCT/US2012/050624 WO2013025629A2 (en) 2011-08-12 2012-08-13 Wafer carrier

Publications (2)

Publication Number Publication Date
KR20140054205A KR20140054205A (ko) 2014-05-08
KR102011159B1 true KR102011159B1 (ko) 2019-08-14

Family

ID=47715660

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020147006119A Active KR102011159B1 (ko) 2011-08-12 2012-08-13 웨이퍼 캐리어

Country Status (7)

Country Link
US (2) US9312157B2 (enExample)
EP (1) EP2742526A4 (enExample)
JP (1) JP6096776B2 (enExample)
KR (1) KR102011159B1 (enExample)
CN (2) CN106941087B (enExample)
TW (1) TWI587444B (enExample)
WO (1) WO2013025629A2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
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KR20240002949A (ko) * 2022-06-30 2024-01-08 구뎅 프리시젼 인더스트리얼 코포레이션 리미티드 안정화 지지대와 부드러운 트레이 연결부가 장착된기판 용기

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US9859141B2 (en) 2010-04-15 2018-01-02 Suss Microtec Lithography Gmbh Apparatus and method for aligning and centering wafers
US9837295B2 (en) 2010-04-15 2017-12-05 Suss Microtec Lithography Gmbh Apparatus and method for semiconductor wafer leveling, force balancing and contact sensing
WO2012054627A2 (en) * 2010-10-19 2012-04-26 Entegris, Inc. Front opening wafer container with wafer cushion
KR102091426B1 (ko) 2013-06-03 2020-03-20 미라이얼 가부시키가이샤 기판 수납 용기
WO2014205121A1 (en) * 2013-06-18 2014-12-24 Entegris, Inc. Front opening wafer container with weight ballast
US9960064B2 (en) 2013-06-19 2018-05-01 Miraial Co., Ltd. Substrate storing container
WO2015025410A1 (ja) 2013-08-22 2015-02-26 ミライアル株式会社 基板収納容器
JP6498758B2 (ja) * 2015-05-22 2019-04-10 ミライアル株式会社 基板収納容器
KR20180016543A (ko) * 2015-06-15 2018-02-14 엔테그리스, 아이엔씨. 일체형 본체를 갖는 도어를 갖는 웨이퍼 캐리어
KR102363033B1 (ko) 2015-07-03 2022-02-15 미라이얼 가부시키가이샤 기판 수납 용기
WO2017035256A1 (en) * 2015-08-25 2017-03-02 Entegris, Inc. Interlocking modular substrate support columns
TWI715623B (zh) * 2015-08-31 2021-01-11 美商恩特葛瑞斯股份有限公司 具有壓縮閂鎖之前開基板容器
US9881820B2 (en) * 2015-10-22 2018-01-30 Lam Research Corporation Front opening ring pod
US10388554B2 (en) 2016-04-06 2019-08-20 Entegris, Inc. Wafer shipper with purge capability
KR200492425Y1 (ko) * 2016-04-08 2020-10-13 엔테그리스, 아이엔씨. 퍼지 성능을 갖는 웨이퍼 운반기 미세 환경
JP2017188609A (ja) * 2016-04-08 2017-10-12 インテグリス・インコーポレーテッド パージ性能を備えたウエハシッパー微環境
CN106428923A (zh) * 2016-10-08 2017-02-22 无锡宏纳科技有限公司 晶圆储存箱
WO2018185906A1 (ja) * 2017-04-06 2018-10-11 ミライアル株式会社 基板収納容器
US10764270B2 (en) 2017-11-20 2020-09-01 Allstate Insurance Company Cryptographically transmitting and storing identity tokens and/or activity data among spatially distributed computing devices
TWI720881B (zh) * 2018-01-11 2021-03-01 家登精密工業股份有限公司 快拆式氣閥及應用其之基板容器
US10978326B2 (en) * 2018-10-29 2021-04-13 Taiwan Semiconductor Manufacturing Co, , Ltd. Semiconductor wafer storage device
NL2022185B1 (nl) * 2018-12-12 2020-07-02 Suss Microtec Lithography Gmbh Substratkassette
JP7334264B2 (ja) 2019-04-26 2023-08-28 インテグリス・インコーポレーテッド 基板容器
US10964584B2 (en) 2019-05-20 2021-03-30 Applied Materials, Inc. Process kit ring adaptor
US11104496B2 (en) * 2019-08-16 2021-08-31 Gudeng Precision Industrial Co., Ltd. Non-sealed reticle storage device
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TWI746014B (zh) * 2020-06-16 2021-11-11 大立鈺科技有限公司 晶圓存取總成及其晶圓存取裝置與晶圓載具
TWI746045B (zh) * 2020-07-07 2021-11-11 家登精密工業股份有限公司 基板載具鎖扣結構
WO2022192335A1 (en) * 2021-03-10 2022-09-15 Entegris, Inc. Semiconductor substrate carrying container with front and rear openings
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KR20240068690A (ko) * 2021-09-22 2024-05-17 엔테그리스, 아이엔씨. 프로세스 캐리어
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KR102733145B1 (ko) 2022-04-05 2024-11-25 주식회사 삼에스코리아 웨이퍼 수납용기 및 그에 사용되는 캡 조립체
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240002949A (ko) * 2022-06-30 2024-01-08 구뎅 프리시젼 인더스트리얼 코포레이션 리미티드 안정화 지지대와 부드러운 트레이 연결부가 장착된기판 용기
KR102802317B1 (ko) 2022-06-30 2025-05-02 구뎅 프리시젼 인더스트리얼 코포레이션 리미티드 안정화 지지대와 부드러운 트레이 연결부가 장착된 기판 용기

Also Published As

Publication number Publication date
CN106941087A (zh) 2017-07-11
US9312157B2 (en) 2016-04-12
CN103828033A (zh) 2014-05-28
TWI587444B (zh) 2017-06-11
WO2013025629A2 (en) 2013-02-21
EP2742526A4 (en) 2015-01-14
JP6096776B2 (ja) 2017-03-15
WO2013025629A3 (en) 2013-04-18
EP2742526A2 (en) 2014-06-18
TW201324678A (zh) 2013-06-16
US20150041353A1 (en) 2015-02-12
KR20140054205A (ko) 2014-05-08
CN103828033B (zh) 2016-11-16
CN106941087B (zh) 2020-03-10
US10147624B2 (en) 2018-12-04
JP2014527721A (ja) 2014-10-16
US20160254172A1 (en) 2016-09-01

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