JP6091060B2 - スピン処理装置 - Google Patents
スピン処理装置 Download PDFInfo
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- JP6091060B2 JP6091060B2 JP2011264950A JP2011264950A JP6091060B2 JP 6091060 B2 JP6091060 B2 JP 6091060B2 JP 2011264950 A JP2011264950 A JP 2011264950A JP 2011264950 A JP2011264950 A JP 2011264950A JP 6091060 B2 JP6091060 B2 JP 6091060B2
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- substrate
- clamp
- ring
- elevating
- rotating body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning By Liquid Or Steam (AREA)
Description
理装置を提供することである。
4a 回転体
4d スライドアーム
4f 基板支持部材
4g 支持リング
5a 判断部
21 クランプピン
22 ピンプレート
42 同期移動ピン
43 第1の同期移動リング
43a ピン接触部
43b 円筒部
43b1 溝
44 第2の同期移動リング
44a ピン接触部
44b 円筒部
44b1 溝
45A 昇降ピン
45B 昇降ピン
47A 第1の昇降リング
47B 第2の昇降リング
71 第1の昇降シリンダ
72 第2の昇降シリンダ
73 クランプ高さシリンダ
74 移載高さシリンダ
75 第1のリング隙間測定センサ
76 第2のリング隙間測定センサ
Claims (9)
- 基板を回転させて処理するスピン処理装置であって、
回転可能に設けられた回転体と、
前記回転体の回転方向に所定間隔で昇降可能に設けられ、前記基板の周縁部を支持する少なくとも三つの基板支持部材と、
前記回転体の回転方向に所定間隔で偏心回転可能に設けられ、偏心回転により前記基板の外周面に各々当接して前記基板を把持する少なくとも三つのクランプピンと、
前記三つの基板支持部材を同期させて昇降させる昇降機構と、
前記三つのクランプピンを同期させて偏心回転させる回転機構と、
を備え、
前記昇降機構は、前記基板支持部材を前記クランプピンによる前記基板のクランプ高さよりも下方の退避位置まで下降させることを可能とし、
前記回転機構は、
前記回転体の回転軸に直交する方向に移動可能に設けられ、前記三つのクランプピンを偏心回転させるための複数のスライドアームと、
前記回転体の回転軸を中心として回転可能に設けられ、前記複数のスライドアームを同期させて前記回転体の回転軸に直交する方向に移動させる同期移動リングと、
を具備していることを特徴とするスピン処理装置。 - 前記昇降機構は、
前記三つの基板支持部材を支持する支持リングと、
前記支持リングを昇降させる昇降部と、
を具備していることを特徴とする請求項1記載のスピン処理装置。 - 前記複数のスライドアームは各々同期移動ピンを有しており、
前記同期移動リングは、前記回転体の回転軸を中心とした回転により前記同期移動ピンに接触する複数のピン接触部を有していることを特徴とする請求項1記載のスピン処理装置。 - 前記同期移動リングは、前記回転体の回転軸の軸方向に延びるスパイラル状の溝が形成された円筒部を有しており、
前記回転機構は、
前記溝に挿入されてその溝に沿って移動可能な昇降ピンと、
前記回転体の回転軸を中心としてその回転軸の軸方向に移動可能に設けられ、前記昇降ピンに連結された昇降リングと、
前記昇降リングを昇降させる昇降部と、
を具備していることを特徴とする請求項1記載のスピン処理装置。 - 前記昇降リングの高さを検出するセンサと、
前記センサにより検出された前記昇降リングの高さに応じて前記複数のクランプピンによる前記基板の把持が正常であるか否かを判断する判断部と、
を備えることを特徴とする請求項4記載のスピン処理装置。 - 偏心回転可能に設けられ、前記クランプピンを保持する偏心回転部材を備え、
前記クランプピンは前記偏心回転部材に二本設けられており、それら二本のクランプピンは前記基板を把持するときに前記二本のクランプピンの間隔が前記基板の外周面の切り欠き部の幅以上で前記基板の外周面に接触するように設けられていることを特徴とする請求項1に記載のスピン処理装置。 - 前記基板支持部材は六つ設けられており、
前記クランプピンは三つを一組として六つ設けられており、
前記回転機構は前記六つのクランプピンを組ごとに同期させて回転させ、
前記昇降機構は前記六つの基板支持部材を同期させて昇降させることを特徴とする請求項1に記載のスピン処理装置。 - 前記六つのクランプピンは、前記基板を処理する処理中に組ごとに交互に前記基板を把持することを特徴とする請求項7記載のスピン処理装置。
- 前記基板は矩形板状の基板であることを特徴とする請求項1に記載のスピン処理装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011264950A JP6091060B2 (ja) | 2011-12-02 | 2011-12-02 | スピン処理装置 |
TW101144478A TWI476053B (zh) | 2011-12-02 | 2012-11-28 | Rotation processing device |
KR1020120137125A KR101344143B1 (ko) | 2011-12-02 | 2012-11-29 | 스핀 처리 장치 및 스핀 처리 방법 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011264950A JP6091060B2 (ja) | 2011-12-02 | 2011-12-02 | スピン処理装置 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017020286A Division JP6386113B2 (ja) | 2017-02-07 | 2017-02-07 | スピン処理装置 |
Publications (3)
Publication Number | Publication Date |
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JP2013118279A JP2013118279A (ja) | 2013-06-13 |
JP2013118279A5 JP2013118279A5 (ja) | 2015-02-26 |
JP6091060B2 true JP6091060B2 (ja) | 2017-03-08 |
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Application Number | Title | Priority Date | Filing Date |
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JP2011264950A Active JP6091060B2 (ja) | 2011-12-02 | 2011-12-02 | スピン処理装置 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6091060B2 (ja) |
KR (1) | KR101344143B1 (ja) |
TW (1) | TWI476053B (ja) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6068975B2 (ja) | 2012-12-27 | 2017-01-25 | 株式会社ディスコ | 洗浄装置 |
KR20160071107A (ko) | 2014-12-11 | 2016-06-21 | 에이플러스미디어(주) | 쌍방향 통신이 가능한 학교어플 운영방법 |
JP6734666B2 (ja) * | 2015-03-30 | 2020-08-05 | 芝浦メカトロニクス株式会社 | スピン処理装置 |
KR101841342B1 (ko) * | 2015-03-30 | 2018-03-22 | 시바우라 메카트로닉스 가부시끼가이샤 | 스핀 처리 장치 |
USD937292S1 (en) | 2017-04-19 | 2021-11-30 | Samsung Electronics Co., Ltd. | Display screen or portion thereof with graphical user interface |
CN109571782A (zh) * | 2018-10-26 | 2019-04-05 | 广州市昊志机电股份有限公司 | 一种高精度可转动的快速装夹模块 |
KR102649391B1 (ko) * | 2019-05-20 | 2024-03-22 | 주식회사 제우스 | 기판처리장치 |
WO2021034968A1 (en) * | 2019-08-19 | 2021-02-25 | Oem Group, Llc | Systems and methods for a lift and rotate wafer handling process |
CN111468983B (zh) * | 2020-06-22 | 2020-10-02 | 山东银河动力股份有限公司 | 机床机件润滑油回收装置 |
JP7471170B2 (ja) | 2020-08-03 | 2024-04-19 | 東京エレクトロン株式会社 | 基板処理方法、及び基板処理装置 |
CN111964363B (zh) * | 2020-08-10 | 2022-12-13 | 江苏星辰星汽车附件有限公司 | 一种车载雨伞收纳装置 |
CN113797396B (zh) * | 2021-10-08 | 2023-03-03 | 温州医科大学附属口腔医院 | 用于可降解骨支架的多孔锌生物复合涂层的制备方法 |
CN114289404B (zh) * | 2022-01-07 | 2022-12-27 | 深圳市益家益电子科技有限公司 | 一种高精度超声清洗装置 |
KR102676578B1 (ko) * | 2023-08-08 | 2024-06-19 | (주)디바이스이엔지 | 기판 처리장치용 기판 지지 조립체 |
Family Cites Families (13)
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US5566466A (en) * | 1994-07-01 | 1996-10-22 | Ontrak Systems, Inc. | Spindle assembly with improved wafer holder |
US6003185A (en) * | 1994-07-15 | 1999-12-21 | Ontrak Systems, Inc. | Hesitation free roller |
JPH09107023A (ja) * | 1995-10-13 | 1997-04-22 | Toshiba Microelectron Corp | 被処理物の回転保持装置 |
JPH09232410A (ja) * | 1996-02-26 | 1997-09-05 | Dainippon Screen Mfg Co Ltd | 基板回転保持装置および回転式基板処理装置 |
DE69737240T2 (de) * | 1996-11-15 | 2007-06-21 | Shibaura Mechatronics Corp., Yokohama | Rotiergerät und rotierverfahren |
JP3822996B2 (ja) * | 1999-03-04 | 2006-09-20 | エム・セテック株式会社 | 半導体製造装置の基板保持構造 |
JP4681148B2 (ja) | 2001-04-27 | 2011-05-11 | 芝浦メカトロニクス株式会社 | スピン処理装置 |
JP4532014B2 (ja) * | 2001-04-27 | 2010-08-25 | 芝浦メカトロニクス株式会社 | スピン処理装置 |
JP3762275B2 (ja) * | 2001-09-20 | 2006-04-05 | 大日本スクリーン製造株式会社 | 基板処理装置および基板処理方法 |
JP2004079637A (ja) * | 2002-08-12 | 2004-03-11 | Toshiba Corp | 板状部材の把持装置、把持方法、及びスピン処理装置 |
JP4080319B2 (ja) * | 2002-12-18 | 2008-04-23 | 大日本スクリーン製造株式会社 | 基板処理装置および基板処理方法 |
JP2005011934A (ja) * | 2003-06-18 | 2005-01-13 | Toshiba Corp | 半導体基板洗浄装置 |
JP4467367B2 (ja) * | 2004-06-22 | 2010-05-26 | 大日本スクリーン製造株式会社 | 基板反転装置、基板搬送装置、基板処理装置、基板反転方法、基板搬送方法および基板処理方法 |
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2011
- 2011-12-02 JP JP2011264950A patent/JP6091060B2/ja active Active
-
2012
- 2012-11-28 TW TW101144478A patent/TWI476053B/zh active
- 2012-11-29 KR KR1020120137125A patent/KR101344143B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
TWI476053B (zh) | 2015-03-11 |
KR20130062233A (ko) | 2013-06-12 |
KR101344143B1 (ko) | 2013-12-20 |
TW201343274A (zh) | 2013-11-01 |
JP2013118279A (ja) | 2013-06-13 |
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