JP6090144B2 - 切替弁、液処理装置 - Google Patents

切替弁、液処理装置 Download PDF

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Publication number
JP6090144B2
JP6090144B2 JP2013258684A JP2013258684A JP6090144B2 JP 6090144 B2 JP6090144 B2 JP 6090144B2 JP 2013258684 A JP2013258684 A JP 2013258684A JP 2013258684 A JP2013258684 A JP 2013258684A JP 6090144 B2 JP6090144 B2 JP 6090144B2
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Japan
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liquid
valve
flow path
port
chemical
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JP2013258684A
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English (en)
Japanese (ja)
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JP2015115555A (ja
Inventor
幹雄 中島
幹雄 中島
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Priority to JP2013258684A priority Critical patent/JP6090144B2/ja
Priority to KR1020140174014A priority patent/KR102269161B1/ko
Publication of JP2015115555A publication Critical patent/JP2015115555A/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2013258684A 2013-12-13 2013-12-13 切替弁、液処理装置 Active JP6090144B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2013258684A JP6090144B2 (ja) 2013-12-13 2013-12-13 切替弁、液処理装置
KR1020140174014A KR102269161B1 (ko) 2013-12-13 2014-12-05 전환 밸브, 액 처리 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013258684A JP6090144B2 (ja) 2013-12-13 2013-12-13 切替弁、液処理装置

Publications (2)

Publication Number Publication Date
JP2015115555A JP2015115555A (ja) 2015-06-22
JP6090144B2 true JP6090144B2 (ja) 2017-03-08

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ID=53516627

Family Applications (1)

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JP2013258684A Active JP6090144B2 (ja) 2013-12-13 2013-12-13 切替弁、液処理装置

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JP (1) JP6090144B2 (ko)
KR (1) KR102269161B1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117571897B (zh) * 2023-11-15 2024-04-30 青岛惠安康生物工程有限公司 一种液相色谱-质谱联用仪及切换装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3117811B2 (ja) * 1992-09-10 2000-12-18 シンエイテック株式会社 二方切替弁
JP4066004B2 (ja) * 1997-10-13 2008-03-26 忠弘 大見 上段部材取付けの基準となる孔を有する複数の下段部材の固定方法および固定用治具
JP3841945B2 (ja) * 1997-10-29 2006-11-08 大日本スクリーン製造株式会社 基板処理装置
JP4172769B2 (ja) * 2003-03-10 2008-10-29 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JP5202101B2 (ja) * 2008-05-21 2013-06-05 旭有機材工業株式会社 ミキシングバルブ及びそれを用いたミキシング装置
JP5148465B2 (ja) * 2008-12-08 2013-02-20 東京エレクトロン株式会社 液処理方法、液処理装置および記憶媒体
JP2010232521A (ja) * 2009-03-27 2010-10-14 Dainippon Screen Mfg Co Ltd 処理液供給装置および処理液供給方法
JP5474666B2 (ja) 2009-07-31 2014-04-16 東京エレクトロン株式会社 液処理装置、液処理方法、プログラムおよびプログラム記録媒体
JP5220707B2 (ja) 2009-07-31 2013-06-26 東京エレクトロン株式会社 液処理装置、液処理方法、プログラムおよびプログラム記録媒体
KR101478859B1 (ko) * 2009-12-09 2015-01-02 도쿄엘렉트론가부시키가이샤 기판 처리 장치, 기판 처리 방법, 및 이 기판 처리 방법을 실행시키기 위한 프로그램을 기록한 기록 매체

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Publication number Publication date
JP2015115555A (ja) 2015-06-22
KR102269161B1 (ko) 2021-06-23
KR20150069524A (ko) 2015-06-23

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