JP6090144B2 - Switching valve, liquid processing device - Google Patents

Description

  The present invention relates to a technique for switching flow paths through which a plurality of types of processing liquid supplied to a substrate flows.

  In a processing unit (liquid processing apparatus) that supplies various processing liquids to a semiconductor wafer (hereinafter referred to as a wafer) that is a substrate and performs liquid processing, an alkaline or acidic chemical is supplied to the surface of the rotating wafer, It removes dust and natural oxides on the wafer surface. Thereafter, a rinse solution is supplied to the surface of the wafer, and the chemical solution remaining on the wafer surface is washed away. Then, the chemical solution remaining on the wafer surface is removed by the rinse liquid, and when the supply of the rinse liquid is stopped while the wafer is rotated, the remaining rinse liquid is shaken off to obtain a dried wafer.

  As described above, a liquid processing apparatus that performs liquid processing using a plurality of types of processing liquids changes the processing liquid type on the supply path to the nozzle (discharge unit) that discharges the processing liquid while processing the liquid on the wafer. A switching valve is provided to perform discharge and stop.

However, the switching valve described above has a relatively large heat capacity, and when its temperature decreases (or increases) during a long standby period, the temperature of the processing liquid that has passed through the switching valve during subsequent restarts decreases (or increases). ).
For this reason, when the processing liquid that has been in the standby state is restarted, a dummy dispense that discharges the processing liquid from the nozzle is performed without processing the wafer, and the temperature of the switching valve is brought close to the temperature of the processing liquid. There is. However, since the wafer processing cannot be started until this operation is completed, the productivity is reduced and the chemical solution consumed by the dummy dispense is increased.

Here, the cited document 1 includes a processing between a branch pipe for supplying a mixed liquid used for wafer processing, a rinsing liquid supply pipe for supplying a rinsing liquid, and a waste liquid pipe for discarding liquid in the pipe. A liquid processing apparatus including a multiple on-off valve (multiple valve) that switches a pipe connected to a unit is described.
Further, in the cited document 2, from the middle of a supply line connected between a liquid supply mechanism for supplying a temperature-controlled liquid and a discharge opening for discharging the liquid to the wafer, the liquid supply mechanism is directed to. A liquid processing apparatus is described in which a return line for returning the liquid is branched and a three-way valve is provided at this branching portion. In this liquid processing apparatus, when the liquid is not discharged to the wafer, the temperature-controlled liquid is continuously supplied from the supply line to the return line via the three-way valve, and the three-way valve having a large heat capacity is connected to the liquid processing apparatus. By preheating in step 1, the temperature fluctuation of the liquid during wafer processing is prevented.

JP 2011-049526 A: Paragraphs 0015, 0022, 0027 to 0028, FIG. JP 2011-035128 A: Paragraphs 0063-0065, 0074, FIG.

  However, the multiple on-off valve described in the cited document 1 does not show a countermeasure against the above-described problem of temperature change. On the other hand, the cited document 2 does not mention a technique for adjusting the temperature of the multiple on-off valve.

  The present invention has been made under such circumstances, and the object thereof is a switching valve capable of supplying at least a temperature-adjusted treatment liquid in a stable temperature state among a plurality of kinds of treatment liquids, It is to provide a liquid processing apparatus.

The switching valve of the present invention is a switching valve that switches a plurality of treatment liquids and pays out from a discharge outlet.
A main body of the switching valve;
A first receiving port provided in the main body for receiving a first processing liquid; a second receiving port for receiving a second processing liquid;
A first flow path provided in the main body and connecting the first receiving port and the payout port;
A second flow path provided in the main body, joined to the first flow path, and having an upstream end connected to the second receiving port;
A first valve seat provided in the main body, and provided in the first flow path upstream of a merging section where the first flow path and the second flow path merge; and the first valve seat A first valve body that is separate from the main body that opens and closes;
A second valve body provided in the main body, provided in the second flow path, and a second valve body separate from the main body for opening and closing the second valve seat;
A first portion provided in the main body portion, branched from the upstream side of the first valve seat in the first flow passage, or formed in the first flow passage for accommodating the first valve body portion. A branch flow path connected to the valve chamber;
Provided in the main body portion, formed at the downstream end of the branch flow path, and a discharge port for discharging the first treatment liquid ,
The branch flow path extends along the first flow path downstream from the position where the branch flow path branches, and the first valve seat and the second valve seat extend along the first flow path. It is characterized by being arranged .

Moreover, the liquid processing apparatus of the present invention includes any one of the switching valves described above,
A first processing liquid supply path connected to a first receiving port of the switching valve;
A second processing liquid supply path connected to the second receiving port of the switching valve;
A discharge unit that discharges the processing liquid discharged from the discharge port of the switching valve to the substrate and performs processing;
A temperature adjusting unit for adjusting the temperature of the first processing liquid flowing in the first processing liquid supply path;
A controller that outputs a control signal for opening one of the first valve seat and the second valve seat of the switching valve and closing the other in a state in which the first processing liquid flows from the branch flow path to the discharge port; , Provided.
Further, a first processing liquid supply unit that supplies the first processing liquid to the first processing liquid supply path and a first processing liquid that is connected to the discharge port and discharged from the discharge port are supplied to the first processing liquid supply unit. You may provide the recycling path which returns to a part.

In addition, the switching valve may have the following characteristics.
Provided in the main body, and in the first flow path, a waste liquid flow path branched from between the merging section and the outlet, and provided in the main body section, opposite to the first flow path side in the waste liquid flow path A waste liquid port formed at the end of the main body, a third valve seat provided in the main body and provided in the waste liquid flow path, and a third main body separate from the main body that opens and closes the third valve seat. And a valve body part. At this time, the waste liquid flow path is branched so as to discharge the processing liquid downward from the first flow path.
Here, the switching valve provided in the liquid processing apparatus includes the waste liquid flow path, a waste liquid port, and a third valve body portion, and the control unit is any of the first valve seat and the second valve seat. When opening one of them, the third valve seat may be closed, and when opening the third valve seat, a control signal may be output so as to close the first valve seat and the second valve seat.
The liquid processing apparatus includes a substrate holding unit for holding the substrate horizontally and a rotation mechanism for rotating the substrate holding unit around a vertical axis, and the discharge unit is attached to the rotating substrate. Discharge the processing liquid.

  The present invention can supply at least a temperature-adjusted processing solution among a plurality of types of processing solutions in a stable state.

It is a top view which shows the outline | summary of the substrate processing system provided with the processing unit which concerns on embodiment of this invention. It is a vertical side view which shows the outline | summary of the said processing unit. It is explanatory drawing of the process liquid supply system for supplying a process liquid to the said process unit. It is an external appearance perspective view of the multiple valve | bulb which concerns on 1st Embodiment provided in the said process liquid supply system. It is a vertical side view of the multiple valve | bulb which concerns on the said 1st Embodiment. FIG. 3 is a first operation diagram of the multiple valve according to the first embodiment. It is a 2nd operation | movement figure of the multiple valve | bulb which concerns on the said 1st Embodiment. FIG. 6 is a third operation diagram of the multiple valve according to the first embodiment. It is an external appearance perspective view of the multiple valve | bulb which concerns on the modification of the said 1st Embodiment. It is a vertical side view of the multiple valve | bulb which concerns on the said modification. It is an external appearance perspective view of the multiple valve | bulb which concerns on 2nd Embodiment. It is a vertical side view of the multiple valve | bulb which concerns on the said 2nd Embodiment. It is a 1st operation | movement figure of the multiple valve | bulb which concerns on the said 2nd Embodiment. It is a 2nd operation | movement figure of the multiple valve | bulb which concerns on the said 2nd Embodiment. It is a 3rd operation | movement figure of the multiple valve | bulb which concerns on the said 2nd Embodiment. It is an external appearance perspective view of the multiple valve | bulb which concerns on 3rd Embodiment. It is the external appearance perspective view which looked at the multiple valve | bulb which concerns on the said 3rd Embodiment from the other direction. It is a perspective view which shows the inside of the main-body part of the multiple valve | bulb which concerns on the said 3rd Embodiment. It is a 1st operation | movement figure of the multiple valve | bulb which concerns on the said 3rd Embodiment. It is a 2nd operation | movement figure of the multiple valve | bulb which concerns on the said 3rd Embodiment. It is a 3rd operation | movement figure of the multiple valve | bulb which concerns on the said 3rd Embodiment. It is an external appearance perspective view of the multiple valve | bulb which concerns on 4th Embodiment. It is a vertical side view of the multiple valve | bulb which concerns on the said 4th Embodiment. It is a 1st operation | movement figure of the multiple valve | bulb which concerns on the said 4th Embodiment. It is a 2nd operation | movement figure of the multiple valve | bulb which concerns on the said 4th Embodiment. It is a 3rd operation | movement figure of the multiple valve | bulb which concerns on the said 4th Embodiment. It is the schematic diagram which showed the basic composition of the multiple valve | bulb of this example.

  FIG. 1 is a diagram showing a schematic configuration of a substrate processing system according to the present embodiment. In the following, in order to clarify the positional relationship, the X axis, the Y axis, and the Z axis that are orthogonal to each other are defined, and the positive direction of the Z axis is the vertically upward direction.

  As shown in FIG. 1, the substrate processing system 1 includes a carry-in / out station 2 and a processing station 3. The carry-in / out station 2 and the processing station 3 are provided adjacent to each other.

  The carry-in / out station 2 includes a carrier placement unit 11 and a transport unit 12. A plurality of carriers C that accommodate a plurality of substrates, in this embodiment a semiconductor wafer (hereinafter referred to as a wafer W) in a horizontal state, are placed on the carrier placement unit 11.

  The transport unit 12 is provided adjacent to the carrier placement unit 11 and includes a substrate transport device 13 and a delivery unit 14 inside. The substrate transfer device 13 includes a wafer holding mechanism that holds the wafer W. Further, the substrate transfer device 13 can move in the horizontal direction and the vertical direction and can turn around the vertical axis, and transfers the wafer W between the carrier C and the delivery unit 14 using the wafer holding mechanism. Do.

  The processing station 3 is provided adjacent to the transfer unit 12. The processing station 3 includes a transport unit 15 and a plurality of processing units 16. The plurality of processing units 16 are provided side by side on the transport unit 15.

  The transport unit 15 includes a substrate transport device 17 inside. The substrate transfer device 17 includes a wafer holding mechanism that holds the wafer W. Further, the substrate transfer device 17 can move in the horizontal direction and the vertical direction and can turn around the vertical axis, and transfers the wafer W between the delivery unit 14 and the processing unit 16 using a wafer holding mechanism. I do.

  The processing unit 16 performs predetermined substrate processing on the wafer W transferred by the substrate transfer device 17.

  Further, the substrate processing system 1 includes a control device 4. The control device 4 is a computer, for example, and includes a control unit 18 and a storage unit 19. The storage unit 19 stores a program for controlling various processes executed in the substrate processing system 1. The control unit 18 controls the operation of the substrate processing system 1 by reading and executing the program stored in the storage unit 19.

  Such a program may be recorded on a computer-readable storage medium, and may be installed in the storage unit 19 of the control device 4 from the storage medium. Examples of the computer-readable storage medium include a hard disk (HD), a flexible disk (FD), a compact disk (CD), a magnetic optical disk (MO), and a memory card.

  In the substrate processing system 1 configured as described above, first, the substrate transfer device 13 of the loading / unloading station 2 takes out the wafer W from the carrier C placed on the carrier placement unit 11 and receives the taken-out wafer W. Place on the transfer section 14. The wafer W placed on the delivery unit 14 is taken out from the delivery unit 14 by the substrate transfer device 17 of the processing station 3 and carried into the processing unit 16.

  The wafer W loaded into the processing unit 16 is processed by the processing unit 16, then unloaded from the processing unit 16 by the substrate transfer device 17, and placed on the delivery unit 14. Then, the processed wafer W placed on the delivery unit 14 is returned to the carrier C of the carrier platform 11 by the substrate transfer device 13.

  As shown in FIG. 2, the processing unit 16 includes a chamber 20, a substrate holding mechanism 30, a processing fluid supply unit 40, and a recovery cup 50.

  The chamber 20 accommodates the substrate holding mechanism 30, the processing fluid supply unit 40, and the recovery cup 50. An FFU (Fan Filter Unit) 21 is provided on the ceiling of the chamber 20. The FFU 21 forms a down flow in the chamber 20.

  The substrate holding mechanism 30 includes a holding unit 31, a support unit 32, and a driving unit 33. The holding unit 31 holds the wafer W horizontally. The support | pillar part 32 is a member extended in a perpendicular direction, a base end part is rotatably supported by the drive part 33, and supports the holding | maintenance part 31 horizontally in a front-end | tip part. The drive unit 33 rotates the column unit 32 around the vertical axis. The substrate holding mechanism 30 rotates the support unit 32 by rotating the support unit 32 using the drive unit 33, thereby rotating the wafer W held by the support unit 31. .

  The processing fluid supply unit 40 supplies a processing fluid to the wafer W. The processing fluid supply unit 40 is connected to a processing fluid supply source 70.

  The collection cup 50 is disposed so as to surround the holding unit 31, and collects the processing liquid scattered from the wafer W by the rotation of the holding unit 31. A drain port 51 is formed at the bottom of the recovery cup 50, and the processing liquid collected by the recovery cup 50 is discharged from the drain port 51 to the outside of the processing unit 16. Further, an exhaust port 52 for discharging the gas supplied from the FFU 21 to the outside of the processing unit 16 is formed at the bottom of the recovery cup 50.

FIG. 3 shows a detailed configuration of the processing fluid supply source 70 that supplies the processing fluid to the processing fluid supply unit 40 of the processing unit (liquid processing apparatus) 16 described above.
The processing fluid supply unit 40 provided in the processing unit 16 of the present embodiment includes a nozzle unit (discharge unit) 41 that discharges a processing liquid that is a processing fluid to the rotating wafer W. The processing fluid supply unit 40 is connected to a multiple valve 8 that is a switching valve via a discharge line 42, and the multiple valve 8 supplies a chemical liquid tank 701 that supplies a chemical liquid that is a first processing liquid, and a second processing liquid. Is connected to a rinsing liquid supply unit 702 for supplying DIW (DeIonized Water).

The chemical tank 701 stores an alkaline or acidic chemical solution that is supplied to the surface of the wafer W and removes dust and natural oxides on the wafer surface. The chemical solution tank 701 is connected to a chemical solution circulation line 731 provided with a chemical solution pump 71 for feeding the chemical solution in the chemical solution tank 701 and a temperature adjusting unit 72 for adjusting the temperature of the chemical solution to a preset temperature. Has been. The temperature adjusting unit 72 may be a heater that heats the chemical solution or a cooler that cools the chemical solution.
From this chemical solution circulation line 731, a chemical solution supply line (first processing solution supply path) 732 branches, and the processing fluid supply unit of each processing unit 16 is connected via the multiple valve 8 connected to the end of the chemical solution supply line 732. A chemical solution is supplied to 40.

The end of the chemical solution circulation line 731 is connected again to the chemical solution tank 701, extracted from the chemical solution tank 701, adjusted in temperature, and supplied to each processing unit 16, the remaining chemical solution is returned to the chemical solution tank 701. It is.
The chemical liquid tank 701, the chemical liquid circulation line 731 and the chemical liquid pump 71 constitute a first processing liquid supply unit.

  Further, as will be described later, the chemical solution used for temperature adjustment of the multiple valve 8 is discharged from the multiple valve 8 of each processing unit 16. This chemical solution flows out from each of the multiple valves 8 via the return line 742, joins the recycle line 741, and then returns to the chemical solution tank 701. The return line 742 and the recycling line 741 correspond to the recycling path of this example. It is not essential to return the temperature-adjusting chemical liquid discharged from the multiple valve 8 to the chemical liquid tank 701, and it may be discharged outside the processing liquid supply source 70.

  The rinsing liquid supply unit 702 includes a DIW tank (not shown) that stores DIW used as a rinsing liquid after treatment with a chemical solution and a rinsing liquid feed pump (not shown), and rinses the rinsing liquid transfer line 751. Pump the liquid. A rinsing liquid supply line (second processing liquid supply path) 752 for supplying a rinsing liquid to the processing fluid supply unit 40 of each processing unit 16 branches from the rinsing liquid transfer line 751, and each rinsing liquid supply line 752 has multiple connections. Connected to the valve 8.

In the processing liquid supply source 70 having the above-described configuration, the multiple valve 8 provided between the nozzle part 41 and the chemical liquid supply line 732 and the rinse liquid supply line 752 is discharged from the nozzle part 41 to the wafer W. The type of the processing liquid to be performed is switched between the chemical liquid and the rinse liquid, and the temperature of the multiple valve 8 itself is adjusted using the chemical liquid whose temperature has been adjusted by the temperature adjustment unit 72. Hereinafter, a detailed configuration of the multiple valve 8a (8) according to one embodiment will be described with reference to an external perspective view of FIG. 4 and a longitudinal side view of FIGS.
Unless otherwise specified, in the multiple valve 8 shown in each external perspective view and vertical side view used in the following description, the left side (the origin side of the X axis shown in each figure) is based on the left side in each figure. The end side, the right side (X-axis arrow side) is the tip side.

  As shown in FIG. 4, the multiple valve 8 a includes a main body portion 81 made of, for example, metal or resin that is formed in a rectangular parallelepiped shape that is flat on the left and right when viewed from the base end side. A chemical liquid port 801 serving as a first receiving port connected to the chemical liquid supply line 732 is provided on the side wall surface on the base end side of the main body 81. Further, a discharge port 802 which is a discharge outlet connected to the discharge line 42 is provided on the side wall surface on the front end side.

  On the other hand, on the side wall surface of the right-side main body portion 81 as viewed from the base end side, the rinsing liquid port 803 that is the second receiving port connected to the rinsing liquid supply line 752 and the liquid dripping from the nozzle section 41 are prevented. Therefore, a drain port 805 that is a waste liquid outlet for discharging the processing liquid returned from the discharge line 42 side when the weight of the processing liquid in the nozzle portion 41 is caused to recede by the weight of the processing liquid. And are provided. The drain port 805 is connected to a waste liquid line 76 that discharges the processing liquid discharged from the multiple valve 8a to the outside (FIGS. 3 and 4).

  Further, a recycle port 804 that is a discharge port connected to the return line 742 is provided on the bottom surface of the main body 81. As shown in FIG. 4, an open / close valve 743 for stopping the flow of the chemical used for temperature adjustment is provided on the return line 742 connected to the recycle port 804.

  As shown in FIG. 5, a chemical solution supply path 83 a that is connected to the chemical solution port 801 and extends in the front-rear direction from the proximal end side to the distal end side is formed inside the main body portion 81. The chemical solution supply path 83a branches into a chemical solution supply path 83b and a recycle flow path 85a at the center of the main body 81. The chemical solution supply path 83b extends upward in the main body 81 and merges with the chemical valve chamber 83c. The chemical liquid valve chamber 83c is a cylindrical space in which a chemical liquid valve body portion 821 described later is accommodated, and the chemical liquid supply path 83b opens toward the bottom surface of the chemical liquid valve chamber 83c. Further, a treatment liquid supply path 83d is connected to the inner surface on the tip side in the chemical valve chamber 83c.

  After the treatment liquid supply path 83d extends obliquely downward toward the distal end side of the main body 81, the extending direction at the height position where the dispensing port 802 is disposed is changed to the horizontal direction, The payout port 802 is connected.

  A drain flow path 86a branches upward from the central position of the processing liquid supply path 83d extending in the lateral direction, and the drain flow path 86a accommodates a drain valve body portion 823 (see FIG. 6) described later. It opens toward the bottom of the drain valve chamber 86b, which is a cylindrical space. The drain valve chamber 86b is connected to the drain port 805 described above, and an opening is formed on the inner surface of the drain valve chamber 86b toward the drain port 805.

  The other-side recycle channel 85a branched from the chemical solution supply path 83a extends to the tip side along the direction in which the chemical solution supply channel 83a extends, and then turns downward at the position below the drain valve chamber 86b described above. Instead, the recycling port 804 is connected to the bottom surface of the main body 81.

  Further, a rinse liquid supply path 84c is connected to the inner side surface of the chemical liquid valve chamber 83c on the base end side, and the rinse liquid supply path 84c extends obliquely downward toward the base end side of the main body 81, The direction is changed obliquely upward on the base end side and connected to the inner side surface of a rinse liquid valve chamber 84b disposed at a side position on the base end side of the chemical liquid valve chamber 83c. The rinse liquid valve chamber 84b is a cylindrical space in which a rinse liquid valve body portion 822 (see FIG. 6), which will be described later, is accommodated, and a rinse liquid supply path 84a extends downward from the bottom surface. . The rinsing liquid supply path 84a is connected to the rinsing liquid port 803 described above by changing the extending direction to the side wall surface side of the main body 81 at a height position before joining the chemical liquid supply path 83a.

  When the structure inside the main body part 81 of the multiple valve 8a described above is summarized, the rinse liquid valve chamber 84b, the chemical solution are sequentially arranged from the base end side in the upper stage of the main body part 81 whose longitudinal section is formed in a horizontally long rectangle. A valve chamber 83c and a drain valve chamber 86b are arranged in a straight line. The rinse liquid port 803 and the discharge port 802 are connected by a rinse liquid supply path 84a, a rinse liquid supply path 84c, and a treatment liquid supply path 83d via a rinse liquid valve chamber 84b and a chemical liquid valve chamber 83c. The discharge port 802 and the drain port 805 are connected by a processing liquid supply path 83d and a drain flow path 86a.

  Further, on the lower side of the region where the valve chambers 84b, 83c, 86b are arranged in a straight line, the chemical solution supply path 83a and the recycle flow path 85a that connect between the chemical solution port 801 and the recycle port 804 are described above. It extends along the arrangement direction of the valve chambers 84b, 83c, 86b. The lower flow paths 83a and 85a are connected to the upper chemical valve chamber 83c via the chemical supply path 83b.

  Here, the chemical liquid supply path 83a, the chemical liquid supply path 83b, the chemical liquid valve chamber 83c, and the treatment liquid supply path 83d connecting the chemical liquid port 801 and the dispensing port 802 constitute a first flow path. Further, the rinse liquid supply path 84a-the rinse liquid valve chamber 84b-the rinse liquid supply path 84c connected to the rinse liquid port 803 constitute a second flow path and join the chemical liquid valve chamber 83c (merging portion). Yes. Furthermore, the recycle flow path 85a branched from the chemical solution supply path 83a and connected to the recycle port 804 constitutes a branch flow path, and a first flow path (the first flow path between the chemical liquid valve chamber 83c (merging portion) and the discharge port 802 ( The drain flow path 86a-drain valve chamber 86b branched from the processing liquid supply path 83d) and connected to the drain port 805 constitutes a waste liquid flow path.

Here, in FIG. 5, the valve body portions 822, 821, and 823 arranged in the valve chambers 84 b, 83 c, and 86 b are omitted in order to clearly show the configuration of the flow path in the main body portion 81. (The same applies to FIGS. 10, 12, 18, and 23).
That is, as shown in FIGS. 6 to 8, the chemical liquid valve chamber 83c includes a chemical liquid valve body portion (first valve opening / closing portion) that opens and closes the chemical liquid supply passage 83b that opens to the bottom surface (first valve seat) of the chemical liquid valve chamber 83c. 1 valve body part) 821 is arranged. The rinse liquid valve chamber 84b includes a rinse liquid valve body portion (second valve body portion) 822 that opens and closes the rinse liquid supply passage 84a that opens to the bottom surface (second valve seat) of the rinse liquid valve chamber 84b. Is arranged. The drain valve chamber 86b is provided with a drain valve body portion (third valve body portion) 823 that opens and closes the drain flow path 86a that opens to the bottom surface (third valve seat) of the drain valve chamber 86b. Yes.

  Each valve body part 821-823 is connected to the drive part 82 arrange | positioned at the upper surface side of the main-body part 81, and lowers the valve body parts 821-823, and the lower surface of these valve body parts 821-823 is set to the valve chamber 83c. , 84b, 86b are brought into contact with the bottom surfaces of the flow paths 83b, 84a, 86a to close (closed state). Further, the valve body portions 821 to 823 are raised to open the openings of the flow paths 83b, 84a, 86a (open state).

Among these valve body parts 821 to 823, for example, the chemical liquid valve body part 821 has a truncated cone shape in which the area of the circle on the lower surface side is smaller than that of the upper surface side, and the chemical liquid supply is performed on the lower surface of the chemical liquid valve body part 821. When the opening of the passage 83b is closed, a gap is formed between the inner surface of the chemical valve chamber 83c and the outer surface of the chemical valve body portion 821. As a result, in the state where the chemical liquid valve body portion 821 closes the opening of the chemical liquid supply path 83b, the rinse liquid is received from the opening of the rinse liquid supply path 84c connected to the inner surface of the chemical liquid valve chamber 83c. The rinsing liquid can be supplied to the processing liquid supply path 83d through the opening of the processing liquid supply path 83d connected to the inner surface of the 83c (see FIG. 8).
In this example, the other rinsing liquid valve body portion 822, the drain valve body portion 823, and the recycling valve body portion 824 described in the embodiments described later are also formed in the same shape as the chemical liquid valve body portion 821. However, unlike the chemical valve body portion 821, the shape of the valve body portions 822, 823, and 824 is not limited to the truncated cone shape when the treatment liquid in the closed state is not passed. For example, a cylindrical shape may be used.

The processing liquid supply source 70 and the multiple valve 8a having the above-described configuration are connected to the control device (control unit) 4 as shown in FIGS. Based on the control signal output from the control device 4, the chemical liquid pump 71 is started, the temperature of the chemical liquid is adjusted by the temperature adjustment unit 72, the rinse liquid is supplied from the rinse liquid supply unit 702, and the valve body in the multiple valve 8 a. Ascent and descent operations 821 to 823 are executed.
Hereinafter, the operations of the processing liquid supply source 70 and the multiple valve 8a will be described with reference to FIGS. 3 and 6 to 8.

When the liquid processing of the wafer W is started in each processing unit 16, the chemical liquid pump 71 is activated in the processing liquid supply source 70 to circulate the chemical liquid in the chemical circulation line 731, and the temperature adjustment unit 72 causes the chemical liquid circulation line 731 to be circulated. The temperature of the chemical solution in the chemical solution tank 701 is adjusted to a preset temperature. Further, the rinse liquid can be supplied also from the rinse liquid supply unit 702.
Then, after the wafer W is transferred to one processing unit 16 and held by the holding unit (substrate holding unit) 31, when the wafer W is rotated by the rotation of the driving unit (rotating mechanism) 33, the wafer W is moved upward. The nozzle part 41 is moved.

  On the other hand, in the multiple valve 8a, as shown in FIG. 6, the chemical valve body 821 is opened, and the rinse liquid valve body 822 and the drain valve body 823 are closed. As a result, the chemical liquid flowing in from the chemical liquid port 801 flows through the chemical liquid supply path 83a → the chemical liquid supply path 83b → the chemical liquid valve chamber 83c → the processing liquid supply path 83d, which is the first flow path, and is discharged from the discharge port 802. As a result, the chemical liquid is discharged from the nozzle portion 41 onto the wafer W, and liquid processing using the chemical liquid is executed.

  At this time, the on-off valve 743 of the return line 742 shown in FIG. 4 is closed to stop the flow of the chemical solution in the recycle channel 85a (in FIG. 6, the closed state of the on-off valve 743 is indicated by the symbol “S”). is there). As a result, the temperature of the main body part 81, the chemical liquid valve body part 821, and the like due to heat transfer from the chemical liquid flowing through the first flow path (chemical liquid supply path 83a-chemical liquid supply path 83b-chemical liquid valve chamber 83c-treatment liquid supply path 83d). However, it is maintained in a temperature state close to the temperature of the chemical liquid whose temperature has been adjusted in advance. Note that the chemical liquid common to the chemical liquid supplied to the wafer W may also flow through the recycling flow path 85a branched from the chemical liquid supply path 83a while the open / close valve 743 of the return line 742 is left open. In this case, in addition to the first flow path described above, the above-described temperature adjustment is performed also by heat transfer from the chemical liquid flowing through the recycle flow path 85a.

Next, when the supply of the chemical liquid is stopped, as shown in FIG. 7, a self-weight drain operation is performed in which the chemical liquid valve body portion 821 and the rinse liquid valve body portion 822 are closed while the drain valve body portion 823 is opened. Is called. Further, the on-off valve 743 of the return line 742 is opened. In this self-weight drain operation, a part of the chemical liquid in the nozzle portion 41 flows into the discharge port 802 from the nozzle portion 41 side by its own weight, and the chemical liquid passes through the drain flow path 86a → the drain valve chamber 86b which is a waste liquid flow path. The liquid is discharged to the waste liquid line 76 via the drain port 805. As a result, the chemical solution on the tip side of the nozzle portion 41 can be drawn.
Even if the chemical valve body 821 is closed, the chemical liquid continues to flow in the chemical supply path 83a and the recycling flow path 85a upstream from the branch position with respect to the chemical supply path 83b. Therefore, the temperature adjustment of the multiple valve 8a by the chemical is performed. Will continue.

  After execution of the self-weight drain operation, as shown in FIG. 8, the rinse liquid valve body portion 822 is opened, and the chemical liquid valve body portion 821 and the drain valve body portion 823 are closed. Further, the on-off valve 743 of the return line 742 is in an open state. By this operation, the rinsing liquid flows from the rinsing liquid port 803, and the rinsing liquid supply path 84a → the rinsing liquid valve chamber 84b → the rinsing liquid supply path 84c from the second flow path toward the first flow path downstream of the joining portion. → Chemical solution valve chamber 83c → Rinse solution flows through the treatment liquid supply path 83d and is discharged from the discharge port 802. As a result, the rinse liquid is discharged from the nozzle portion 41 to the wafer W, and the wafer is rinsed.

  Even during the period in which the rinsing liquid is supplied to the wafer W, the chemical liquid continues to flow through the chemical liquid supply path 83a and the recycling flow path 85a, so that the range of temperature fluctuation caused by the rinsing liquid flowing through the main body 81 is suppressed. It is done.

Then, the open / close state of each valve body portion 821 to 823 is set to the state of FIG. 7 again, and after the self-drain drain operation of the rinsing liquid is executed, all the valve body portions 821 to 823 are closed. The supply of the treatment liquid (chemical liquid and rinse liquid) is finished.
Even after the supply of the processing liquid is stopped, the wafer W is continuously rotated and shaken and dried. Then, the processed wafer W is unloaded from the processing unit 16 and waits for the next wafer W to be loaded.

  During the period until the next wafer W is carried in, the chemical liquid whose temperature is adjusted by the temperature adjustment unit 72 is also supplied to the chemical liquid supply path 83a and the recycling flow path 85a even when the processing liquid is not discharged from the nozzle portion 41. Therefore, the temperature of the multiple valve 8a is maintained close to the temperature of the chemical solution discharged from the nozzle portion 41. In addition, even when the standby period until the next wafer W is loaded into the processing unit 16 becomes long, by continuously supplying the temperature-adjusted chemical liquid to the flow paths 83a and 85a, the multiple valve It is possible to keep the temperature of 8a close to the set temperature of the chemical solution.

  In particular, in the multiple valve 8a configured as shown in FIGS. 5 to 8, the recycle flow path 85a, which is a branch flow path, is the first flow path downstream from the position where the recycle flow path 85a branches. It extends along the processing liquid supply path 83d. The bottom surface of the chemical liquid valve chamber 83c that constitutes the first valve seat and the bottom surface of the rinse liquid valve chamber 84b that constitutes the second valve seat are disposed along the chemical liquid supply path 83a that is the first flow path. The bottom surface of the drain valve chamber 86b, which is the third valve seat, is disposed above the recycle channel 85a, which is a branch channel. As a result, the temperature adjustment by the chemical solution can be performed evenly with respect to the body portion 81 having a horizontally long shape in the direction in which the valve body portions 821 to 823 are arranged.

  Further, as shown in FIG. 4, the multiple valve 8 a is provided on the side face that opposes each other with respect to the rectangular parallelepiped main body 81, the chemical solution port (first receiving port) 801 and the dispensing port (dispensing port) 802. It has been. In the main body 81, the rinse liquid port (second receiving port) 803 is provided on a side surface different from the side surface on which the chemical liquid port 801 and the dispensing port 802 are provided. A recycle port (discharge port) 804 is provided on the bottom surface of the main body 81.

  The multiple valve 8a according to this embodiment has the following effects. First flow path (chemical liquid supply path 83a-chemical liquid supply path 83b-chemical liquid valve chamber 83c-process liquid supply path 83d) for receiving chemical liquid (first processing liquid) and second flow path for receiving rinsing liquid (second processing liquid) A chemical liquid valve body part (first) for opening and closing these flow paths upstream of the merging part (in the chemical liquid valve chamber 83c) with (the rinse liquid supply path 84a-the rinse liquid valve chamber 84b-the rinse liquid supply path 84c). A valve body part) 821 and a rinse liquid valve body part (second valve body part) 822 are provided, and are located upstream of the opening (first valve seat) of the chemical liquid supply passage 83b opened and closed by the chemical liquid valve body part 821. The recycle flow path (branch flow path) 85a is branched.

  For this reason, the chemical liquid supply path 83a, the recycling flow are switched while the processing liquid discharged from the discharge outlet of the processing liquid supply path 83d is switched between the chemical liquid and the rinse liquid by the opening / closing operation of the chemical liquid valve body part 821 and the rinse liquid valve body part 822. The temperature adjustment of the multiple valve 8a can be performed by continuing to flow the chemical solution whose temperature is adjusted to the path 85a. Further, the chemical liquid valve body portions 821 and the rinse liquid valve body portions 822 are closed, and the chemical liquid is allowed to flow through the chemical liquid supply path 83a and the recycling flow path 85a even when the processing liquid is not discharged from the nozzle section 41, so that the standby period is maintained. The temperature change of the multiple valve 8a can be suppressed.

  In particular, the temperature of the multiple valve 8a is adjusted by using the chemical solution itself adjusted to the temperature at the time of liquid processing of the wafer W, so that the accuracy is higher than when using other temperature adjusting means such as a heater or a Peltier element. High temperature adjustment is possible.

A multiple valve 8b shown in FIGS. 9 and 10 is a modification of the multiple valve 8a shown in FIGS. In addition, in each embodiment described below with reference to FIGS. 9 to 27, the same reference numerals as those used in these drawings are attached to the components common to the multiple valve 8a illustrated in FIGS. Have
As shown in FIG. 9, the recycle port 804 of the multiple valve 8 b is provided on the side wall surface of the main body 81 and below the drain port 805. For this reason, as shown in FIG. 10, the recycle flow path 85 a changes its direction toward the side wall surface of the main body 81 at a position below the drain valve chamber 86 b and is connected to the recycle port 804.

  By providing the openings 801 to 805 of the flow paths 83 a, 83 d, 85 a, 84 a, 86 b on the side surface of the main body 81, the bottom surface of the main body 81 becomes flat, so that the multiple valve 8 b is connected to the processing liquid supply source 70. The degree of freedom when installing and fixing is increased.

  The multiple valve 8b also has a flat side wall surface opposite to the side wall surface of the main body 81 where the rinse liquid port 803, the drain port 805 and the recycle port 804 are provided. Therefore, when the multiple valve 8b is rotated about the X axis by 90 ° clockwise as viewed from the front end side, the chemical liquid port 801 and the dispensing port 802 open on the side surface of the main body 81, and the rinse liquid port 803, the drain port 805 and the recycle port 804 are opened on the upper surface of the main body 81. Also in this case, since the bottom surface of the main body 81 is flat, the degree of freedom in installing and fixing the multiple valve 8b to the processing liquid supply source 70 is high.

Next, the configuration of the multiple valve 8c according to the second embodiment will be described with reference to FIGS.
As shown in FIG. 11, the multiple valve 8 c is arranged on the side wall surface of the left main body portion 81 as viewed from the distal end side, with the recycle port 804, the chemical solution port 801, and the drain port 805 arranged in this order from the proximal end side by side. Has been. Further, a rinsing liquid port 803 is provided on the side wall surface of the right body part 81 as viewed from the front end side. Further, a payout port 802 is provided on the side wall surface on the distal end side of the main body 81.

  As shown in FIG. 12, the vertical cross-sectional shape of the main body portion 81 is formed in a T shape that is flat in the vertical direction, and a chemical liquid valve body portion (first valve body portion) 821 is provided at the center position of the T-shaped horizontal bar. An accommodated chemical valve chamber 83c is provided. An opening is formed on the inner side surface of the chemical liquid valve chamber 83c toward the chemical liquid port 801. On the bottom surface (first valve seat) of the chemical liquid valve chamber 83c, a connected flow that is opened and closed by the chemical liquid valve body portion 821. A path 87 is connected. The connection flow path 87 extends downward from the bottom surface of the chemical liquid valve chamber 83 c, is disposed on the lower side of the chemical liquid valve chamber 83 c, and contains a rinse liquid valve body portion (second valve body portion) 822. It is connected to the upper surface of the chamber 84b.

A processing liquid supply path 83d branches off from the side surface on the front end side at the central height position of the connection flow path 87, and this processing liquid supply path 83d extends in the lateral direction toward the front end side of the main body 81. The end portion is connected to the payout port 802.
A drain flow path 86a branches off from the treatment liquid supply path 83d, and this drain flow path 86a is formed on the bottom surface (third valve seat) of the drain valve chamber 86b that houses the drain valve body portion (third valve body portion) 823. The opening of the drain valve chamber 86b and the inner wall surface of the drain valve chamber 86b open toward the drain port 805 are the same as the multiple valve 8a described above shown in FIG.

  Further, an opening is formed on the inner side surface of the rinsing liquid valve chamber 84 b toward the rinsing liquid port 803. And the above-mentioned connection flow path 87 opened to the upper surface (2nd valve seat) of the rinse liquid valve chamber 84b is opened and closed by the rinse liquid valve body part 822 accommodated in the rinse liquid valve chamber 84b.

  Furthermore, a recycling flow path 85a is connected to the inner side surface of the chemical liquid valve chamber 83c. The recycling flow path 85a extends obliquely upward and is adjacent to the position on the base end side of the chemical liquid valve chamber 83c. It is connected to the inner wall surface of the disposed recycle valve chamber 85b. The recycle valve chamber 85b accommodates a recycle valve body portion 824, and a recycle channel 85c extends downward from the bottom surface thereof. The recycle flow path 85 c changes its direction on the way to the side wall surface of the main body 81 and is connected to the recycle port 804.

  The recycle valve body portion 824 (see FIGS. 13 to 15) accommodated in the recycle valve chamber 85b opens and closes the recycle flow path 85c opened at the bottom surface (valve seat) of the recycle valve chamber 85b. The recycle valve body 824 is provided with the opening / closing valve 743 of the return line 742 shown in FIG. 4 in the main body 81, and is closed when the flow of the temperature adjusting chemical liquid in the multiple valve 8c is stopped. .

  When the structure inside the main body 81 of the multiple valve 8c described above is summarized, the recycle valve chamber 85b, the chemical valve chamber 83c, and the drain valve chamber 86b are arranged on the upper stage of the T-shaped main body 81 in order from the base end side. They are arranged in a straight line. A rinse liquid valve chamber 84b is disposed below the central chemical liquid valve chamber 83c.

  In this example, the chemical liquid valve chamber 83c, the connecting flow path 87, and the processing liquid supply path 83d that connect the chemical liquid port 801 and the dispensing port 802 constitute a first flow path. The rinse liquid valve chamber 84b connected to the rinse liquid port 803 and joining the connecting flow path 87 (merging portion) constitutes a second flow path. Furthermore, the recycle channel 85a-recycle valve chamber 85b-recycle channel 85c branched from the chemical valve chamber 83c and connected to the recycle port 804 constitutes a branch channel. A drain flow path 86a-drain valve chamber 86b branched from the first flow path (process liquid supply path 83d) between the connection flow path 87 (merging portion) and the discharge port 802 and connected to the drain port 805 is a waste liquid flow. The point which comprises the path | route is the same as that of the multiple valve | bulb 8a of FIG.

Next, the operation of the multiple valve 8c will be described with reference to FIGS.
As shown in FIG. 13, when supplying the chemical liquid, the chemical valve body 821 is opened, and the rinse liquid valve body 822, the drain valve body 823, and the recycle valve body 824 are closed. As a result, the chemical liquid flowing in from the chemical liquid port 801 flows out from the discharge port 802 through the chemical liquid valve chamber 83c → the connection flow path 87 → the processing liquid supply path 83d, which is the first flow path, and passes through the nozzle portion 41 to the wafer. Discharged to W.

  At this time, the temperature-adjusted chemical liquid flows through the first flow path (chemical liquid valve chamber 83c-connecting flow path 87-treatment liquid supply path 83d), and heat transfer from the chemical liquid causes the main body 81, the chemical liquid valve body section 821, and the like. The temperature of is adjusted. Note that the recycle valve body portion 824 may be opened, and the chemical solution may also flow through the branch flow path (recycle flow path 85a-recycle valve chamber 85b-recycle flow path 85c) branched from the chemical valve chamber 83c. In this case, in addition to the first flow path described above, the above temperature adjustment is also performed by heat transfer from the chemical liquid flowing through the branch flow path.

  In addition, as shown in FIG. 14, the chemical valve body 821 is closed while the drain valve body 823 is opened and the processing liquid on the nozzle portion 41 side is drawn as shown in FIG. The same as the valve 8a. In addition, the recycle valve body 824 is also opened. Accordingly, since the chemical liquid continues to flow from the chemical liquid valve chamber 83c toward the recycle port 804 even when the chemical liquid valve body 821 is closed, the temperature adjustment of the multiple valve 8c by the chemical liquid is continued.

  At the time of supplying the rinsing liquid, as shown in FIG. 15, the rinsing liquid valve body part 822 is opened, and the chemical liquid valve body part 821 and the drain valve body part 823 are closed. As a result, the rinsing liquid flows from the rinsing liquid port 803, and rinses with the rinsing liquid valve chamber 84b → the connection flow path 87 → the treatment liquid supply path 83d from the second flow path to the first flow path on the downstream side of the joining portion. The liquid flows, is discharged from the discharge port 802, and the rinse liquid is supplied to the wafer W from the nozzle portion 41.

Even during the period in which the rinsing liquid is supplied to the wafer W, the recycling valve body 824 is kept open so that the chemical liquid continues to flow from the chemical liquid supply path 83a toward the recycling port 804. The range of temperature fluctuation due to the flow of the liquid is suppressed.
Even if the chemical valve body 821, the rinse liquid valve body 822, and the drain valve body 823 are closed, if the recycle valve body 824 is kept open, the multiple valve 8c that uses the chemical even during the standby period can be used. Temperature adjustment can be continued.

The multiple valve 8c according to the second embodiment includes each chemical valve body 821, rinse liquid valve body 822, drain valve body 823 on the side of each flow channel (chemical flow port 801 of the first flow channel, Since the rinse liquid port 803 of the second flow path and the drain port 805 of the waste liquid flow path are opened, the configuration of each flow path 87, 83d, 86a, 85a, 85c is simplified. As a result, the processing of the main body 81 is relatively easy.
Further, since the flow path of the connecting flow path 87 and the processing liquid supply path 83d through which both the chemical liquid and the rinsing liquid flow is relatively short, the replaceability of the processing liquid after switching the chemical liquid to the rinsing liquid is good.

  Next, the configuration of the multiple valve 8d according to the third embodiment will be described with reference to FIGS. 16 is an external perspective view of the multiple valve 8d viewed from the same direction as the multiple valve 8a shown in FIG. 4, and FIG. 17 is a clock around the X axis when the multiple valve 8d shown in FIG. It is the external appearance perspective view rotated only 90 degrees in the rotation direction. FIG. 18 is a perspective view showing the internal structure of the main body 81.

  As shown in FIGS. 16 and 18, the main body 81 of the multiple valve 8 d is formed in a substantially cubic shape, and a discharge port 802 and a recycle port 804 are arranged side by side on the side wall surface on the tip side. . On the other hand, a rinse liquid port 803 and a chemical liquid port 801 are arranged side by side on the side wall surface on the proximal end side of the main body 81. As shown in FIG. 17, a drain port 805 is provided at the right-hand front position on the lower surface of the main body 81 as viewed from the front end side.

  As shown in FIG. 18, a chemical valve chamber 83 c that stores a chemical valve body (first valve body) 821 is provided at a position where the opening of the chemical liquid port 801 is formed. A connecting flow path 87 that is opened and closed by a chemical valve body 821 is connected to the bottom surface (first valve seat) of the chemical valve chamber 83c. The connection flow path 87 extends downward from the bottom surface of the chemical liquid valve chamber 83 c, is disposed on the lower side of the chemical liquid valve chamber 83 c, and contains a rinse liquid valve body portion (second valve body portion) 822. It is connected to the upper surface of the chamber 84b.

A processing liquid supply path 83d branches off from the side surface on the front end side at the central height position of the connection flow path 87, and this processing liquid supply path 83d extends laterally toward the front end side of the main body 81. , Its end is connected to the payout port 802.
A drain flow path 86a branches downward from the processing liquid supply path 83d, and the drain flow path 86a is an upper surface (third third) of the drain valve chamber 86b that houses the drain valve body portion (third valve body portion) 823. The valve seat is open. Further, the base end portion of the drain flow path 86c connected to the drain port 805 that opens to the bottom surface of the main body portion 81 is opened on the inner side surface of the drain valve chamber 86b.

Furthermore, a rinsing liquid supply path 84a connected to a rinsing liquid port 803 that opens to the side wall surface on the base end side of the main body 81 is connected to the inner side surface of the rinsing liquid valve chamber 84b.
On the other hand, the connection flow path 87 connected to the upper surface (second valve seat) of the rinse liquid valve chamber 84b is opened and closed by a rinse liquid valve body portion 822 accommodated in the rinse liquid valve chamber 84b.

  Next, a recycling flow path 85a is connected to the inner side surface of the chemical valve chamber 83c, and this recycling flow path 85a is an inner wall surface of the recycling valve chamber 85b disposed at the upper front side and the right hand position of the main body 81. It is connected to the. The recycle valve chamber 85b accommodates a recycle valve body portion 824, and a recycle flow path 85c extends from the bottom surface toward a recycle port 804 that opens to the side wall surface on the front end side of the main body portion 81.

  To summarize the structure in the main body 81 of the multiple valve 8d described above, the upper part of the cubic main body 81 has a left hand position on the base end side and a right hand position on the front end side when viewed from the front end side. Each of the chemical valve chamber 83c and the recycle valve chamber 85b is arranged side by side on a diagonal line. In the lower stage of the main body 81, a rinse liquid valve chamber 84b and a drain valve chamber 86b are arranged side by side in the left-hand position on the proximal end side and the distal end side.

  In this example, the chemical liquid valve chamber 83c, the connecting flow path 87, and the processing liquid supply path 83d that connect the chemical liquid port 801 and the dispensing port 802 constitute a first flow path. In addition, the rinse liquid supply path 84a and the rinse liquid valve chamber 84b that connect the rinse liquid port 803 and the connecting flow path 87 (merging portion) constitute a second flow path. Furthermore, the recycle channel 85a-recycle valve chamber 85b-recycle channel 85c branched from the chemical valve chamber 83c and connected to the recycle port 804 constitutes a branch channel. Then, a drain channel 86 a-a drain valve chamber 86 b-a drain branched from the first channel (processing liquid supply channel 83 d) between the connecting channel 87 (merging portion) and the discharge port 802 and connected to the drain port 805. The flow path 86c constitutes a waste liquid flow path.

Next, the operation of the multiple valve 8d will be described with reference to FIGS.
As shown in FIG. 19, when supplying the chemical liquid, the chemical valve body 821 is opened, and the rinse liquid valve body 822, the drain valve body 823, and the recycle valve body 824 are closed. As a result, the chemical liquid flowing in from the chemical liquid port 801 flows out from the discharge port 802 through the chemical liquid valve chamber 83c → the connection flow path 87 → the processing liquid supply path 83d, which is the first flow path, and passes through the nozzle portion 41 to the wafer. Discharged to W.

  At this time, the temperature-adjusted chemical liquid flows through the first flow path (chemical liquid valve chamber 83c-connecting flow path 87-treatment liquid supply path 83d), and heat transfer from the chemical liquid causes the main body 81, the chemical liquid valve body section 821, and the like. The temperature of is adjusted. At this time, the recycle valve body 824 may be opened, and the chemical solution may also flow through the branch flow path (recycle flow path 85a-recycle valve chamber 85b-recycle flow path 85c) branched from the chemical valve chamber 83c. In this case, in addition to the first flow path described above, the above temperature adjustment is also performed by heat transfer from the chemical liquid flowing through the branch flow path.

  Further, during the self-weight drain operation, as shown in FIG. 20, the chemical valve body 821 and the rinse liquid valve body 822 are closed, while the drain valve body 823 is opened, and the processing liquid on the nozzle 41 side is processed. The liquid is drawn into the liquid supply path 83d, and the processing liquid is discharged from the drain port 805 via the drain flow path 86a → the drain valve chamber 86b → the drain flow path 86c. In addition, the recycle valve body 824 is also opened. Accordingly, since the chemical liquid continues to flow from the chemical liquid valve chamber 83c toward the recycle port 804 even when the chemical liquid valve body 821 is closed, the temperature adjustment of the multiple valve 8d by the chemical liquid is continued.

  When supplying the rinsing liquid, as shown in FIG. 21, the rinsing liquid valve body 822 is opened, and the chemical liquid valve body 821 and the drain valve body 823 are closed. As a result, the rinsing liquid flows from the rinsing liquid port 803, and the rinsing liquid supply path 84a → the rinsing liquid valve chamber 84b → the connecting flow path 87 → processing from the second flow path toward the first flow path on the downstream side of the joining portion. The rinsing liquid flows through the liquid supply path 83 d and is discharged from the discharge port 802, and the rinsing liquid is supplied from the nozzle portion 41 to the wafer W.

Even during the period in which the rinsing liquid is supplied to the wafer W, the chemical valve continues to flow from the chemical valve chamber 83c toward the recycling port 804 by keeping the recycle valve body 824 open. The range of temperature fluctuation due to the flow of the liquid is suppressed.
Further, even if the chemical valve body 821, the rinse liquid valve body 822, and the drain valve body 823 are closed, if the recycle valve body 824 is kept open, the multiple valve 8d using the chemical is also used during the standby period. Temperature adjustment can be continued.

  In the multiple valve 8d according to the third embodiment, the recycle flow path 85a that is a branch flow path is a treatment liquid supply path 83d that is a first flow path downstream from the position where the recycle flow path 85a branches. It extends along. The bottom surface of the chemical valve chamber 83c constituting the first valve seat and the bottom surface of the rinse liquid valve chamber 84b constituting the second valve seat are arranged along the connection flow path 87 which is the first flow path. As a result, the temperature adjustment performance of the processing liquid flowing in the processing liquid supply path 83d by the chemical liquid flowing in the recycling flow path 85a is high.

Next, the structure of the multiple valve 8e according to the fourth embodiment will be described with reference to FIGS.
As shown in FIGS. 22 and 23, the main body 81 of the multiple valve 8e is formed in a three-pronged shape extending from the center toward the upper, lower right, and lower left, and is formed on the side wall surface of the center. A payout port 802 is connected. On the other hand, a chemical solution port 801 and a recycle port 804 are connected to the side wall surfaces on the proximal end side and the distal end side of the main body 81 projecting upward. The lower surface of the main body 81 is flat, and a rinsing liquid port 803 and a drain port 805 are provided from the lower surface in this order from the proximal end side to the distal end side.

  As shown in FIG. 23, at a position sandwiched between the chemical liquid port 801 and the recycle port 804, a chemical liquid valve chamber (first valve chamber) 83c containing a chemical liquid valve body portion (first valve body portion) 821 is provided. Is provided. A chemical liquid supply path 83a connected to the chemical liquid port 801 and a recycle flow path 85a connected to the recycle port 804 are connected to the inner surface of the chemical liquid valve chamber 83c. A chemical liquid supply path 83b that is opened and closed by a chemical liquid valve body portion 821 is connected to the bottom surface (first valve seat) of the chemical liquid valve chamber 83c. The lower end portion of the chemical solution supply path 83 b is connected to a dispensing port 802 that opens on the side surface of the main body portion 81.

A rinse liquid supply path 84c and a drain flow path 86a extend from the lower end of the chemical liquid supply path 83b in the lower left direction and the lower right direction, respectively.
The rinse liquid supply path 84c is connected to the end surface (second valve seat) of the rinse liquid valve chamber 84b that houses the rinse liquid valve body part (second valve body part) 822, and the rinse liquid supply path 84c is the rinse liquid valve body. It is opened and closed at a portion 822. Further, a rinsing liquid supply path 84 a is opened on the inner side surface of the rinsing liquid valve chamber 84 b, and this rinsing liquid supply path 84 a is connected to a rinsing liquid port 803 that opens on the lower surface of the main body 81.

  The drain flow path 86 a is connected to the end surface (third valve seat) of the drain valve chamber 86 b that houses the drain valve body (third valve body) 823, and the drain flow path 86 a is opened and closed by the drain valve body 823. Is done. In addition, a drain channel 86 c is opened on the inner side surface of the drain valve chamber 86 b, and this drain channel 86 c is connected to a drain port 805 that opens on the lower surface of the main body 81.

  Summarizing the structure in the main body 81 of the multiple valve 8e described above, the three chemical valve chambers 83c are arranged radially at positions on the upper side, lower left side and lower right side with the opening position of the dispensing port 802 as the center. A rinse liquid valve chamber 84b and a drain valve chamber 86b are disposed.

  In this example, the chemical liquid supply path 83a-chemical liquid valve chamber 83c-chemical liquid supply path 83b connecting the chemical liquid port 801 and the dispensing port 802 constitutes a first flow path. The rinse liquid supply path 84a-the rinse liquid valve chamber 84b-the rinse liquid supply path 84c connecting the rinse liquid port 803 and the lower end portion (merging section) of the chemical liquid supply path 83b constitutes a second flow path. . Furthermore, the recycle channel 85a branched from the chemical valve chamber 83c and connected to the recycle port 804 constitutes a branch channel. The drain flow path 86a-drain valve chamber 86b-drain flow path 86c branched from the lower end (merging section) of the chemical solution supply path 83b and connected to the drain port 805 constitutes a waste liquid flow path.

Next, the operation of the multiple valve 8e will be described with reference to FIGS.
As shown in FIG. 24, when supplying the chemical liquid, the chemical valve body 821 is opened, and the rinse liquid valve body 822 and the drain valve body 823 are closed. As a result, the chemical liquid flowing in from the chemical liquid port 801 is discharged from the discharge port 802 through the chemical liquid supply path 83a → the chemical liquid valve chamber 83c → the chemical liquid supply path 83b, which is the first flow path. Discharged.
Further, the on-off valve 743 of the return line 742 is closed to stop the flow of the chemical solution in the recycle channel 85a.

  At this time, the temperature-adjusted chemical liquid flows through the first flow path (chemical liquid supply path 83a-chemical liquid valve chamber 83c-chemical liquid supply path 83b), and heat transfer from the chemical liquid causes the main body 81, the chemical liquid valve body section 821, etc. The temperature is adjusted. Alternatively, the on / off valve 743 of the return line 742 may be opened, and the chemical solution may also flow through the branch channel (recycle channel 85a) branched from the chemical valve chamber 83c. In this case, in addition to the first flow path described above, the above temperature adjustment is also performed by heat transfer from the chemical liquid flowing through the branch flow path.

  Further, during the self-weight drain operation, as shown in FIG. 25, while the chemical liquid valve body portion 821 and the rinse liquid valve body portion 822 are closed, the drain valve body portion 823 is opened, and the processing liquid on the nozzle portion 41 side is drained. The liquid is drawn into the flow path 86a, and the processing liquid is discharged from the drain port 805 through the drain flow path 86a → the drain valve chamber 86b → the drain flow path 86c. Further, the on-off valve 743 of the return line 742 is opened. As a result, the chemical solution continues to flow toward the recycle port 804 through the chemical solution supply passage 83a → the chemical solution valve chamber 83c → the recycle flow passage 85a even when the chemical solution valve body portion 821 is closed. The temperature adjustment is continued.

  When supplying the rinsing liquid, as shown in FIG. 26, the rinsing liquid valve body 822 is opened, and the chemical liquid valve body 821 and the drain valve body 823 are closed. As a result, the rinsing liquid flows from the rinsing liquid port 803, the rinsing liquid supply path 84a → the rinsing liquid valve chamber 84b → the rinsing liquid supply path 84c and the rinsing liquid flow from the second flow path to the joining portion, and the discharge port 802. The rinsing liquid is supplied from the nozzle portion 41 to the wafer W.

Even during the period in which the rinsing liquid is supplied to the wafer W, the open / close valve 743 of the return line 742 is kept open so that the chemical liquid supply path 83a → the chemical liquid valve chamber 83c → the recycle flow path 85a passes through the recycle port 804. Since the chemical liquid continues to flow in the direction, the width of the temperature fluctuation due to the rinse liquid flowing through the main body 81 can be suppressed.
Further, even if the chemical valve body 821, the rinse liquid valve body 822, and the drain valve body 823 are closed, the chemical liquid continues to flow from the chemical port 801 to the recycle port 804. The temperature adjustment of 8c can be continued.

  In the multiple valve 8e according to the fourth embodiment, since the chemical liquid discharged by the self-weight drain operation before the rinsing liquid is supplied is extracted downward through the drain flow path 86c, the chemical liquid is extracted by the self-weight. It is easy to replace the chemical solution with the rinse solution.

  The multiple valves 8a to 8e having various configurations have been described above with reference to FIGS. These multiple valves 8a to 8e are different in the extending direction of the first flow path, the second flow path, the branch flow path, the waste liquid flow path, and the length of the flow path, but have a common basic structure. Yes. FIG. 27A schematically shows the basic structure of the multiple valve 8 according to these embodiments.

As shown in FIG. 27 (a), the multiple valve 8 is provided in the first flow path 91 formed in the main body 81 from the first receiving port 901 on the upstream side to the outlet port 902 on the downstream side. A first valve body 911 that opens and closes a first valve seat (not shown) formed in the first flow path 91 is provided. The second valve body 92 joins the position downstream of the first valve body portion 911, and opens and closes a second valve seat (not shown) formed in the second flow path 92. A portion 921 is provided. Further, the upstream end of the second flow path 92 is connected to the second receiving port 903. A branch channel 93 branches from a position upstream of the first valve body 911 in the first channel 91, and the downstream side of the branch channel 93 is connected to the discharge port 904.
Thus, the main body 81 does not necessarily have to include the waste liquid channel 94.

FIG. 27B schematically shows the configuration of the multiple valve 8 corresponding to the multiple valves 8c and 8e shown in FIGS. In the case of providing the waste liquid flow path 94 for discharging the waste liquid from the nozzle portion 41 during the self-weight drain operation, the first flow path 91 on the downstream side of the joining portion of the first flow path 91 and the second flow path 92 is provided. The waste liquid channel 94 is branched. And you may provide the 3rd valve body part 941 which opens and closes the 3rd valve seat (not shown) provided in the waste liquid flow path 94. FIG. Thereby, it is possible to prevent the processing liquid discharged from the waste liquid port 905 from being mixed into the processing liquid upstream of the merging portion.
Furthermore, a valve body portion 931 for opening and closing a valve seat (not shown) provided in the branch flow path 93 may be provided in the main body portion 81 as in the multiple valve 8 of FIG.

  As shown in FIG. 27C, a plurality of second flow paths 92a and second flow paths 92b may be joined to the first flow path 91. In this case, the second valve body 921 of the second flow paths 92b and 92a that do not supply the processing liquid is kept closed, and the second valve body of the second flow paths 92a and 92b that supply the processing liquid. Focusing on the part 921 and the first valve body part 911 of the first flow path 91, the control device 4 performs control to open one of the first valve body part 911 and the second valve body part 921 and close the other. It can be said that.

  Further, when the processing liquid whose temperature is adjusted is discharged only from the nozzle portion 41 and when the processing liquid is not discharged (when the processing liquid whose temperature is adjusted is allowed to flow only through the branch path 93) ), The amount of the treatment liquid supplied to the multiple valve 8 may be changed. For example, when the processing liquid discharged from the nozzle part 41 is small, when the processing liquid is not discharged from the nozzle part 41, the amount of the processing liquid flowing through the branch path 93 is made larger than the discharge amount. The temperature of the multiple valve 8 can be adjusted more reliably.

  Here, the discharge unit to which the multiple valves 8 and 8a to 8e according to each embodiment of the present invention are connected is not limited to the nozzle unit 41 that supplies the processing liquid from the upper surface side of the rotating wafer W. For example, in order to discharge a processing liquid toward the lower surface of the wafer W held above the holding unit 31 with a gap between the upper surface of the holding unit 31 of the processing unit 16 shown in FIG. The processing liquid supply source 70 including the multiple valves 8 and 8a to 8e of the present embodiment may be connected to the discharge line 42 that passes through the vertical direction. In this case, for example, an opening formed on the upper surface of the holding unit 31 serves as a processing liquid discharge unit.

  The type of substrate processed using the liquid processing unit 16 is not limited to a semiconductor wafer. For example, the present invention can be applied to the processing fluid supply source 70 of the liquid processing unit 16 that performs liquid processing of a glass substrate for a flat panel display.

8, 8a-8e
Multiple valve 801 Chemical liquid port 802 Dispensing port 803 Rinse liquid port 804 Recycle port 81 Main body part 821 Chemical liquid valve body part 822 Rinse liquid valve body parts 83a, 83b
Chemical liquid supply path 83d Process liquid supply paths 84a and 84c
Rinse solution supply paths 85a and 85c
Branch channel

Claims (7)

In the switching valve that switches multiple treatment liquids and pays out from the discharge outlet,
A main body of the switching valve;
A first receiving port provided in the main body for receiving a first processing liquid; a second receiving port for receiving a second processing liquid;
A first flow path provided in the main body and connecting the first receiving port and the payout port;
A second flow path provided in the main body, joined to the first flow path, and having an upstream end connected to the second receiving port;
A first valve seat provided in the main body, and provided in the first flow path upstream of a merging section where the first flow path and the second flow path merge; and the first valve seat A first valve body that is separate from the main body that opens and closes;
A second valve body provided in the main body, provided in the second flow path, and a second valve body separate from the main body for opening and closing the second valve seat;
A first portion provided in the main body portion, branched from the upstream side of the first valve seat in the first flow passage, or formed in the first flow passage for accommodating the first valve body portion. A branch flow path connected to the valve chamber;
Provided in the main body portion, formed at the downstream end of the branch flow path, and a discharge port for discharging the first treatment liquid ,
The branch flow path extends along the first flow path downstream from the position where the branch flow path branches, and the first valve seat and the second valve seat extend along the first flow path. A switching valve characterized by being arranged . A waste liquid flow path provided in the main body section and branched from between the merging section and the outlet in the first flow path;
A waste liquid port provided in the main body part and formed at an end of the waste liquid flow path opposite to the first flow path side;
A third valve seat provided in the main body portion and provided in the waste liquid flow path, and a third valve body portion separate from the main body portion for opening and closing the third valve seat. The switching valve according to claim 1 . The switching valve according to claim 2 , wherein the waste liquid flow path is branched so as to discharge the processing liquid from the first flow path toward the lower side. The switching valve according to any one of claims 1 to 3 ,
A first processing liquid supply path connected to a first receiving port of the switching valve;
A second processing liquid supply path connected to the second receiving port of the switching valve;
A discharge unit that discharges the processing liquid discharged from the discharge port of the switching valve to the substrate and performs processing;
A temperature adjusting unit for adjusting the temperature of the first processing liquid flowing in the first processing liquid supply path;
A controller that outputs a control signal for opening one of the first valve seat and the second valve seat of the switching valve and closing the other in a state in which the first processing liquid flows from the branch flow path to the discharge port; And a liquid processing apparatus. The switching valve includes the waste liquid passage according to claim 2 , a waste liquid port, and a third valve body part,
The controller closes the third valve seat when opening one of the first valve seat and the second valve seat, and closes the first valve seat and the second valve seat when opening the third valve seat. The liquid processing apparatus according to claim 4 , wherein the control signal is output as described above. A first processing liquid supply unit for supplying a first processing liquid to the first processing liquid supply path;
Connected to said outlet, a liquid processing apparatus according to claim 4 or 5, further comprising a recycle path back to the first processing liquid supply unit of the first processing solution discharged from the discharge port. A substrate holder for holding the substrate horizontally;
A rotation mechanism for rotating the substrate holder around the vertical axis,
The discharge unit, the liquid processing apparatus according to any one of to 4 claims, characterized in that for discharging a processing liquid to the rotating substrate 6.

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