JP6086738B2 - Ｌｅｄ装置 - Google Patents

Ｌｅｄ装置 Download PDF

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Publication number
JP6086738B2
JP6086738B2 JP2013008285A JP2013008285A JP6086738B2 JP 6086738 B2 JP6086738 B2 JP 6086738B2 JP 2013008285 A JP2013008285 A JP 2013008285A JP 2013008285 A JP2013008285 A JP 2013008285A JP 6086738 B2 JP6086738 B2 JP 6086738B2
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led
led device
external connection
die
dies
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Japanese (ja)
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JP2014139979A (ja
JP2014139979A5 (enExample
Inventor
吉正 高山
吉正 高山
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Citizen Electronics Co Ltd
Citizen Watch Co Ltd
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Citizen Electronics Co Ltd
Citizen Watch Co Ltd
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Priority to JP2013008285A priority Critical patent/JP6086738B2/ja
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Publication of JP2014139979A5 publication Critical patent/JP2014139979A5/ja
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JP2013008285A 2013-01-21 2013-01-21 Ｌｅｄ装置 Active JP6086738B2 (ja)

Priority Applications (1)

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JP2013008285A JP6086738B2 (ja) 2013-01-21 2013-01-21 Ｌｅｄ装置

Applications Claiming Priority (1)

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JP2013008285A JP6086738B2 (ja) 2013-01-21 2013-01-21 Ｌｅｄ装置

Publications (3)

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JP2014139979A JP2014139979A (ja) 2014-07-31
JP2014139979A5 JP2014139979A5 (enExample) 2016-01-07
JP6086738B2 true JP6086738B2 (ja) 2017-03-01

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JP2013008285A Active JP6086738B2 (ja) 2013-01-21 2013-01-21 Ｌｅｄ装置

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Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102252992B1 (ko) 2014-12-12 2021-05-20 삼성전자주식회사 반도체 발광소자 패키지의 제조 방법
WO2016178397A1 (ja) * 2015-05-01 2016-11-10 日東電工株式会社 蛍光体層－封止層付光半導体素子の製造方法
CN106856220B (zh) * 2015-12-08 2020-03-06 上海芯元基半导体科技有限公司 晶元级封装的倒装led器件及其分割单元和制作方法
JP6314968B2 (ja) * 2015-12-25 2018-04-25 日亜化学工業株式会社 発光装置
JP6512201B2 (ja) * 2016-09-30 2019-05-15 日亜化学工業株式会社 線状発光装置の製造方法及び線状発光装置
JP6834469B2 (ja) 2016-12-27 2021-02-24 日亜化学工業株式会社 発光装置及びその製造方法
JP6633111B2 (ja) * 2018-02-19 2020-01-22 アルパッド株式会社 発光ユニット及び半導体発光装置
JP2024018492A (ja) 2022-07-29 2024-02-08 日亜化学工業株式会社 発光装置の製造方法ならびに発光装置および発光モジュール
JP7769239B2 (ja) * 2023-09-29 2025-11-13 日亜化学工業株式会社 発光装置
JP2025074551A (ja) * 2023-10-30 2025-05-14 パナソニックＩｐマネジメント株式会社 発光装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4438492B2 (ja) * 2003-09-11 2010-03-24 日亜化学工業株式会社 半導体装置およびその製造方法
JP5008263B2 (ja) * 2005-03-02 2012-08-22 日亜化学工業株式会社 半導体発光素子
JP5463901B2 (ja) * 2009-12-24 2014-04-09 日亜化学工業株式会社 発光装置
US8198109B2 (en) * 2010-08-27 2012-06-12 Quarkstar Llc Manufacturing methods for solid state light sheet or strip with LEDs connected in series for general illumination
JP2012216712A (ja) * 2011-03-28 2012-11-08 Nitto Denko Corp 発光ダイオード装置の製造方法および発光ダイオード素子
JP5680472B2 (ja) * 2011-04-22 2015-03-04 シチズンホールディングス株式会社 半導体発光装置の製造方法

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