JP6084027B2 - 光導波路装置及びその製造方法 - Google Patents

光導波路装置及びその製造方法 Download PDF

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Publication number
JP6084027B2
JP6084027B2 JP2012277550A JP2012277550A JP6084027B2 JP 6084027 B2 JP6084027 B2 JP 6084027B2 JP 2012277550 A JP2012277550 A JP 2012277550A JP 2012277550 A JP2012277550 A JP 2012277550A JP 6084027 B2 JP6084027 B2 JP 6084027B2
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JP
Japan
Prior art keywords
optical
wiring layer
layer
optical waveguide
substrate
Prior art date
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Active
Application number
JP2012277550A
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English (en)
Japanese (ja)
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JP2014122929A5 (enExample
JP2014122929A (ja
Inventor
柳沢　賢司
賢司 柳沢
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2012277550A priority Critical patent/JP6084027B2/ja
Priority to US14/105,598 priority patent/US9075206B2/en
Publication of JP2014122929A publication Critical patent/JP2014122929A/ja
Publication of JP2014122929A5 publication Critical patent/JP2014122929A5/ja
Application granted granted Critical
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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/4279—Radio frequency signal propagation aspects of the electrical connection, high frequency adaptations
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/428—Electrical aspects containing printed circuit boards [PCB]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Integrated Circuits (AREA)
  • Light Receiving Elements (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
JP2012277550A 2012-12-20 2012-12-20 光導波路装置及びその製造方法 Active JP6084027B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2012277550A JP6084027B2 (ja) 2012-12-20 2012-12-20 光導波路装置及びその製造方法
US14/105,598 US9075206B2 (en) 2012-12-20 2013-12-13 Optical waveguide device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012277550A JP6084027B2 (ja) 2012-12-20 2012-12-20 光導波路装置及びその製造方法

Publications (3)

Publication Number Publication Date
JP2014122929A JP2014122929A (ja) 2014-07-03
JP2014122929A5 JP2014122929A5 (enExample) 2015-12-24
JP6084027B2 true JP6084027B2 (ja) 2017-02-22

Family

ID=50974763

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012277550A Active JP6084027B2 (ja) 2012-12-20 2012-12-20 光導波路装置及びその製造方法

Country Status (2)

Country Link
US (1) US9075206B2 (enExample)
JP (1) JP6084027B2 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10209464B2 (en) * 2014-10-17 2019-02-19 Cisco Technology, Inc. Direct printed circuit routing to stacked opto-electrical IC packages
US9786641B2 (en) 2015-08-13 2017-10-10 International Business Machines Corporation Packaging optoelectronic components and CMOS circuitry using silicon-on-insulator substrates for photonics applications
US9721812B2 (en) * 2015-11-20 2017-08-01 International Business Machines Corporation Optical device with precoated underfill
WO2021100978A1 (ko) * 2019-11-20 2021-05-27 엘지디스플레이 주식회사 사이드 배선 제조 장치, 사이드 배선 제조 방법 및 표시 장치 제조 방법
US11664355B2 (en) * 2019-12-02 2023-05-30 Seoul Semiconductor Co., Ltd. Display apparatus
JP7477306B2 (ja) * 2020-01-17 2024-05-01 日東電工株式会社 光電気伝送複合モジュールおよび光電気混載基板
JPWO2025028630A1 (enExample) * 2023-08-01 2025-02-06

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11135891A (ja) * 1997-10-31 1999-05-21 Matsushita Electric Ind Co Ltd 半導体発光素子およびその製造方法、発光素子付き光ファイバ、光通信モジュールならびに光通信システム
US6343171B1 (en) * 1998-10-09 2002-01-29 Fujitsu Limited Systems based on opto-electronic substrates with electrical and optical interconnections and methods for making
JP2004069798A (ja) * 2002-08-02 2004-03-04 Canon Inc 光電融合ビアをもつ光電融合配線基板
JP2004235418A (ja) * 2003-01-30 2004-08-19 Seiko Epson Corp 光モジュール、光通信装置、光電気混載集積回路、回路基板、電子機器
US7070207B2 (en) * 2003-04-22 2006-07-04 Ibiden Co., Ltd. Substrate for mounting IC chip, multilayerd printed circuit board, and device for optical communication
US7112885B2 (en) * 2003-07-07 2006-09-26 Board Of Regents, The University Of Texas System System, method and apparatus for improved electrical-to-optical transmitters disposed within printed circuit boards
US7248757B2 (en) * 2003-12-15 2007-07-24 Canon Kabushiki Kaisha Method, device and computer program for designing a circuit having electric wires and optical connections
US7366368B2 (en) * 2004-06-15 2008-04-29 Intel Corporation Optical add/drop interconnect bus for multiprocessor architecture
TWI246612B (en) * 2004-10-12 2006-01-01 Phoenix Prec Technology Corp Structure having embedded optical electronic components
US7492982B2 (en) * 2006-02-06 2009-02-17 Samsung Electronics Co., Ltd. Optical module
US7373033B2 (en) * 2006-06-13 2008-05-13 Intel Corporation Chip-to-chip optical interconnect
JP5137393B2 (ja) 2006-12-19 2013-02-06 古河電気工業株式会社 光結合器
US7783141B2 (en) * 2007-04-04 2010-08-24 Ibiden Co., Ltd. Substrate for mounting IC chip and device for optical communication
US7729570B2 (en) * 2007-05-18 2010-06-01 Ibiden Co., Ltd. Photoelectric circuit board and device for optical communication
JP2009175418A (ja) * 2008-01-24 2009-08-06 Shinko Electric Ind Co Ltd 光電気混載基板及びその製造方法
JP5106348B2 (ja) * 2008-10-28 2012-12-26 日東電工株式会社 光電気混載モジュールの製造方法およびそれによって得られた光電気混載モジュール
US8588558B2 (en) * 2008-12-05 2013-11-19 General Electric Company Optical link circuit and method of making same
JP5267426B2 (ja) * 2009-11-04 2013-08-21 住友ベークライト株式会社 光素子搭載基板、光電気混載基板および電子機器
JP5670169B2 (ja) * 2010-12-15 2015-02-18 新光電気工業株式会社 光導波路の製造方法

Also Published As

Publication number Publication date
US20140177999A1 (en) 2014-06-26
US9075206B2 (en) 2015-07-07
JP2014122929A (ja) 2014-07-03

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