JP6072122B2 - 半導体素子 - Google Patents
半導体素子 Download PDFInfo
- Publication number
- JP6072122B2 JP6072122B2 JP2015076934A JP2015076934A JP6072122B2 JP 6072122 B2 JP6072122 B2 JP 6072122B2 JP 2015076934 A JP2015076934 A JP 2015076934A JP 2015076934 A JP2015076934 A JP 2015076934A JP 6072122 B2 JP6072122 B2 JP 6072122B2
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- JP
- Japan
- Prior art keywords
- sic substrate
- plane
- substrate
- interface
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/64—Double-diffused metal-oxide semiconductor [DMOS] FETs
- H10D30/66—Vertical DMOS [VDMOS] FETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/028—Manufacture or treatment of FETs having insulated gates [IGFET] of double-diffused metal oxide semiconductor [DMOS] FETs
- H10D30/0291—Manufacture or treatment of FETs having insulated gates [IGFET] of double-diffused metal oxide semiconductor [DMOS] FETs of vertical DMOS [VDMOS] FETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/83—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
- H10D62/832—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge being Group IV materials comprising two or more elements, e.g. SiGe
- H10D62/8325—Silicon carbide
Landscapes
- Insulated Gate Type Field-Effect Transistor (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015076934A JP6072122B2 (ja) | 2015-04-03 | 2015-04-03 | 半導体素子 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015076934A JP6072122B2 (ja) | 2015-04-03 | 2015-04-03 | 半導体素子 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013240158A Division JP5763154B2 (ja) | 2013-11-20 | 2013-11-20 | 半導体素子及びその製造方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2015146450A JP2015146450A (ja) | 2015-08-13 |
JP2015146450A5 JP2015146450A5 (enrdf_load_stackoverflow) | 2015-12-03 |
JP6072122B2 true JP6072122B2 (ja) | 2017-02-01 |
Family
ID=53890529
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015076934A Active JP6072122B2 (ja) | 2015-04-03 | 2015-04-03 | 半導体素子 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP6072122B2 (enrdf_load_stackoverflow) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10665682B2 (en) | 2018-09-14 | 2020-05-26 | Kabushiki Kaisha Toshiba | Semiconductor device, method for manufacturing semiconductor device, inverter circuit, driving device, vehicle, and elevator |
US11015264B2 (en) | 2018-09-14 | 2021-05-25 | Kabushiki Kaisha Toshiba | Diamond substrate, quantum device, quantum system, and method for manufacturing diamond substrate |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6602263B2 (ja) | 2016-05-30 | 2019-11-06 | 株式会社東芝 | 半導体装置、半導体装置の製造方法、インバータ回路、駆動装置、車両、及び、昇降機 |
JP6776204B2 (ja) | 2017-08-25 | 2020-10-28 | 株式会社東芝 | 半導体装置、半導体装置の製造方法、インバータ回路、駆動装置、車両、及び、昇降機 |
JP6896672B2 (ja) | 2018-03-21 | 2021-06-30 | 株式会社東芝 | 半導体装置及びその製造方法 |
JP6790010B2 (ja) | 2018-03-21 | 2020-11-25 | 株式会社東芝 | 半導体装置及びその製造方法 |
JP6862384B2 (ja) | 2018-03-21 | 2021-04-21 | 株式会社東芝 | 半導体装置、半導体装置の製造方法、インバータ回路、駆動装置、車両、及び、昇降機 |
JP7500524B2 (ja) | 2021-09-16 | 2024-06-17 | 株式会社東芝 | 半導体装置の製造方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003264190A (ja) * | 2002-03-08 | 2003-09-19 | Toshiba Corp | 半導体装置及びその製造方法 |
JP2008098200A (ja) * | 2006-10-05 | 2008-04-24 | Kiyoyoshi Mizuno | 成膜体およびその製造方法 |
WO2008123213A1 (ja) * | 2007-03-26 | 2008-10-16 | Kyoto University | 半導体装置及び半導体製造方法 |
-
2015
- 2015-04-03 JP JP2015076934A patent/JP6072122B2/ja active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10665682B2 (en) | 2018-09-14 | 2020-05-26 | Kabushiki Kaisha Toshiba | Semiconductor device, method for manufacturing semiconductor device, inverter circuit, driving device, vehicle, and elevator |
US11015264B2 (en) | 2018-09-14 | 2021-05-25 | Kabushiki Kaisha Toshiba | Diamond substrate, quantum device, quantum system, and method for manufacturing diamond substrate |
Also Published As
Publication number | Publication date |
---|---|
JP2015146450A (ja) | 2015-08-13 |
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