JP6070532B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP6070532B2 JP6070532B2 JP2013263931A JP2013263931A JP6070532B2 JP 6070532 B2 JP6070532 B2 JP 6070532B2 JP 2013263931 A JP2013263931 A JP 2013263931A JP 2013263931 A JP2013263931 A JP 2013263931A JP 6070532 B2 JP6070532 B2 JP 6070532B2
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- layer
- crack
- solder
- crack starting
- semiconductor device
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- 239000004065 semiconductor Substances 0.000 title claims description 63
- 229910000679 solder Inorganic materials 0.000 claims description 63
- 239000000463 material Substances 0.000 claims description 17
- 230000000977 initiatory effect Effects 0.000 claims description 8
- 229910045601 alloy Inorganic materials 0.000 claims description 7
- 239000000956 alloy Substances 0.000 claims description 7
- 229920001721 polyimide Polymers 0.000 claims description 6
- 239000009719 polyimide resin Substances 0.000 claims description 6
- CSDREXVUYHZDNP-UHFFFAOYSA-N alumanylidynesilicon Chemical compound [Al].[Si] CSDREXVUYHZDNP-UHFFFAOYSA-N 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052799 carbon Inorganic materials 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 210
- 239000010949 copper Substances 0.000 description 6
- 239000011241 protective layer Substances 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 238000005336 cracking Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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- Condensed Matter Physics & Semiconductors (AREA)
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Description
2;半導体層
3;電極層
4;はんだ層
5;被接合部材
6;保護層
10;クラック起点層
31;第1層
32;第2層
35;開口部
41;第1領域
42;第2領域
101;第1部分
102;第2部分
Claims (3)
- 半導体層と、
前記半導体層上に配置された電極層と、
前記半導体層の上側に配置されたクラック起点層と、
前記電極層および前記クラック起点層に接触するはんだ層と、を備え、
前記はんだ層と前記クラック起点層との接合力が前記はんだ層と前記電極層との接合力より小さく、
前記クラック起点層が前記電極層上に配置されており、
前記クラック起点層の厚みが前記クラック起点層の幅よりも小さい、半導体装置。 - 前記電極層が、前記クラック起点層に比べて、前記はんだ層に対して合金を形成し易い材料によって形成されている、請求項1に記載の半導体装置。
- 前記クラック起点層は、アルミニウム、アルミシリコン、カーボン、または、ポリイミド樹脂のいずれかにより形成されている、請求項1又は2に記載の半導体装置。
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PCT/JP2014/070519 WO2015093090A1 (ja) | 2013-12-20 | 2014-08-04 | 半導体装置 |
CN201480069435.XA CN105830203B (zh) | 2013-12-20 | 2014-08-04 | 半导体装置 |
DE112014005925.0T DE112014005925B4 (de) | 2013-12-20 | 2014-08-04 | Halbleitervorrichtung |
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