JP6067110B2 - 通信制御装置及び実装基板 - Google Patents
通信制御装置及び実装基板 Download PDFInfo
- Publication number
- JP6067110B2 JP6067110B2 JP2015522364A JP2015522364A JP6067110B2 JP 6067110 B2 JP6067110 B2 JP 6067110B2 JP 2015522364 A JP2015522364 A JP 2015522364A JP 2015522364 A JP2015522364 A JP 2015522364A JP 6067110 B2 JP6067110 B2 JP 6067110B2
- Authority
- JP
- Japan
- Prior art keywords
- signal path
- circuit
- antenna
- communication
- conductive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004891 communication Methods 0.000 title claims description 380
- 239000000758 substrate Substances 0.000 claims description 155
- 230000005540 biological transmission Effects 0.000 claims description 66
- 239000003990 capacitor Substances 0.000 claims description 60
- 239000004065 semiconductor Substances 0.000 claims description 24
- 230000000903 blocking effect Effects 0.000 claims 1
- 101000600766 Homo sapiens Podoplanin Proteins 0.000 description 18
- 101000914496 Homo sapiens T-cell antigen CD7 Proteins 0.000 description 18
- 102100027208 T-cell antigen CD7 Human genes 0.000 description 18
- 230000001902 propagating effect Effects 0.000 description 18
- 238000001514 detection method Methods 0.000 description 13
- 238000010586 diagram Methods 0.000 description 12
- 230000003071 parasitic effect Effects 0.000 description 12
- 230000006866 deterioration Effects 0.000 description 11
- 101000899452 Dictyostelium discoideum Calcium-dependent cell adhesion molecule 1 Proteins 0.000 description 9
- 238000000034 method Methods 0.000 description 8
- 101100015456 Litomosoides carinii GP22 gene Proteins 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 7
- 101150048348 GP41 gene Proteins 0.000 description 6
- 230000006872 improvement Effects 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 230000006870 function Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- -1 GP31 Proteins 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
- 230000000295 complement effect Effects 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005674 electromagnetic induction Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000012840 feeding operation Methods 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 238000005549 size reduction Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 1
- 101100102627 Oscarella pearsei VIN1 gene Proteins 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000008867 communication pathway Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000005672 electromagnetic field Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 229910001416 lithium ion Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000037361 pathway Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000009774 resonance method Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B5/00—Near-field transmission systems, e.g. inductive or capacitive transmission systems
- H04B5/70—Near-field transmission systems, e.g. inductive or capacitive transmission systems specially adapted for specific purposes
- H04B5/79—Near-field transmission systems, e.g. inductive or capacitive transmission systems specially adapted for specific purposes for data transfer in combination with power transfer
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
- H02J50/10—Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling
- H02J50/12—Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling of the resonant type
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
- H02J50/80—Circuit arrangements or systems for wireless supply or distribution of electric power involving the exchange of data, concerning supply or distribution of electric power, between transmitting devices and receiving devices
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B5/00—Near-field transmission systems, e.g. inductive or capacitive transmission systems
- H04B5/20—Near-field transmission systems, e.g. inductive or capacitive transmission systems characterised by the transmission technique; characterised by the transmission medium
- H04B5/24—Inductive coupling
- H04B5/26—Inductive coupling using coils
Landscapes
- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Power Engineering (AREA)
- Signal Processing (AREA)
- Transceivers (AREA)
- Near-Field Transmission Systems (AREA)
- Charge And Discharge Circuits For Batteries Or The Like (AREA)
- Structure Of Printed Boards (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2013/066420 WO2014199507A1 (fr) | 2013-06-14 | 2013-06-14 | Dispositif de commande de communication et carte de montage |
Publications (2)
Publication Number | Publication Date |
---|---|
JP6067110B2 true JP6067110B2 (ja) | 2017-01-25 |
JPWO2014199507A1 JPWO2014199507A1 (ja) | 2017-02-23 |
Family
ID=52021837
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015522364A Expired - Fee Related JP6067110B2 (ja) | 2013-06-14 | 2013-06-14 | 通信制御装置及び実装基板 |
Country Status (7)
Country | Link |
---|---|
US (1) | US9705363B2 (fr) |
JP (1) | JP6067110B2 (fr) |
KR (1) | KR20160019437A (fr) |
CN (1) | CN105284056B (fr) |
HK (1) | HK1217830A1 (fr) |
TW (1) | TWI638499B (fr) |
WO (1) | WO2014199507A1 (fr) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016051961A (ja) * | 2014-08-29 | 2016-04-11 | ルネサスエレクトロニクス株式会社 | 通信用電子装置 |
JP6512799B2 (ja) * | 2014-11-27 | 2019-05-15 | キヤノン株式会社 | 給電装置、制御方法及びプログラム |
FR3032076A1 (fr) * | 2015-01-26 | 2016-07-29 | Stmicroelectronics Rousset | Procede de gestion de la communication sans contact et de la charge sans contact au sein d'un systeme, et systeme correspondant |
JP6540087B2 (ja) * | 2015-02-24 | 2019-07-10 | セイコーエプソン株式会社 | 回路装置及び電子機器 |
WO2017010285A1 (fr) * | 2015-07-10 | 2017-01-19 | 株式会社村田製作所 | Dispositif de transmission électrique et système d'alimentation électrique sans fil |
JP2017112706A (ja) * | 2015-12-16 | 2017-06-22 | 東芝テック株式会社 | 携帯端末装置 |
US10056332B2 (en) * | 2016-09-05 | 2018-08-21 | Renesas Electronics Corporation | Electronic device with delamination resistant wiring board |
US10277061B1 (en) * | 2018-03-08 | 2019-04-30 | Nxp B.V. | Wireless device |
JP7122902B2 (ja) * | 2018-07-27 | 2022-08-22 | 日本電産サンキョー株式会社 | 非接触式通信モジュールおよびカードリーダ |
JP7383890B2 (ja) * | 2019-03-20 | 2023-11-21 | オムロン株式会社 | 非接触給電装置 |
JP2021197647A (ja) * | 2020-06-16 | 2021-12-27 | 株式会社村田製作所 | 電力増幅モジュール |
JP7537138B2 (ja) * | 2020-06-18 | 2024-08-21 | オムロン株式会社 | 絶縁型共振回路装置及び非接触給電システム |
EP3937337B1 (fr) | 2020-07-09 | 2022-11-09 | Japan Tobacco Inc. | Unité d'alimentation électrique pour inhalateur d'aérosol comprenant un capteur de température |
JP6875595B1 (ja) * | 2020-07-09 | 2021-05-26 | 日本たばこ産業株式会社 | エアロゾル吸引器の電源ユニット |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0685408A (ja) * | 1992-08-31 | 1994-03-25 | Hitachi Ltd | 多層プリント回路基板装置 |
JPH09232790A (ja) * | 1996-02-26 | 1997-09-05 | Fuji Electric Co Ltd | プリント基板回路のシールド方法 |
JP2005204493A (ja) * | 2003-12-19 | 2005-07-28 | Semiconductor Energy Lab Co Ltd | 半導体装置及び半導体装置の駆動方法 |
JP2008112862A (ja) * | 2006-10-30 | 2008-05-15 | Nec Saitama Ltd | 両面プリント配線基板、電子機器及び両面プリント配線基板の製造方法 |
JP2008165744A (ja) * | 2006-12-07 | 2008-07-17 | Semiconductor Energy Lab Co Ltd | 半導体装置 |
JP2008271188A (ja) * | 2007-04-20 | 2008-11-06 | Toshiba Corp | 無線機 |
JP2011082797A (ja) * | 2009-10-07 | 2011-04-21 | Murata Mfg Co Ltd | 高周波モジュール |
WO2013054596A1 (fr) * | 2011-10-13 | 2013-04-18 | 株式会社村田製作所 | Démultiplexeur |
WO2013061899A1 (fr) * | 2011-10-28 | 2013-05-02 | 株式会社村田製作所 | Dispositif de réception d'énergie, dispositif de transmission d'énergie et système de transmission d'énergie sans fil |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7471188B2 (en) | 2003-12-19 | 2008-12-30 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and driving method thereof |
WO2005081303A1 (fr) * | 2004-02-25 | 2005-09-01 | Semiconductor Energy Laboratory Co., Ltd. | Dispositif semi-conducteur |
KR101029215B1 (ko) * | 2005-02-16 | 2011-04-12 | 가부시키가이샤 히타치세이사쿠쇼 | 전자 태그용 반도체 장치 및 rfid 태크 |
CN101401112B (zh) * | 2006-03-10 | 2013-01-02 | 株式会社半导体能源研究所 | 半导体器件 |
CN101385039B (zh) | 2006-03-15 | 2012-03-21 | 株式会社半导体能源研究所 | 半导体器件 |
US7541213B2 (en) * | 2006-07-21 | 2009-06-02 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
KR101349880B1 (ko) * | 2006-10-02 | 2014-01-09 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체장치 |
US7889528B2 (en) * | 2006-11-29 | 2011-02-15 | Semiconductor Energy Laroratory Co., Ltd. | Rectifier circuit, power supply circuit, and semiconductor device |
JP2008147573A (ja) * | 2006-12-13 | 2008-06-26 | Nec System Technologies Ltd | 多層基板装置 |
WO2010038581A1 (fr) * | 2008-10-02 | 2010-04-08 | Semiconductor Energy Laboratory Co., Ltd. | Dispositif à semi-conducteur |
JP2011030404A (ja) | 2009-06-22 | 2011-02-10 | Felica Networks Inc | 情報処理装置、プログラム、および情報処理システム |
DE102010061351A1 (de) * | 2010-12-20 | 2012-06-21 | Huf Hülsbeck & Fürst Gmbh & Co. Kg | Kompakter, eine NFC-Kommunikationsmöglichkeit aufweisender ID-Geber eines Kraftfahrzeug-Zugangssystems |
US9184509B2 (en) * | 2011-01-26 | 2015-11-10 | Panasonic Intellectual Property Management Co., Ltd. | Antenna device and wireless communication apparatus |
-
2013
- 2013-06-14 KR KR1020157035046A patent/KR20160019437A/ko not_active Application Discontinuation
- 2013-06-14 JP JP2015522364A patent/JP6067110B2/ja not_active Expired - Fee Related
- 2013-06-14 US US14/896,867 patent/US9705363B2/en not_active Expired - Fee Related
- 2013-06-14 CN CN201380077426.0A patent/CN105284056B/zh not_active Expired - Fee Related
- 2013-06-14 WO PCT/JP2013/066420 patent/WO2014199507A1/fr active Application Filing
-
2014
- 2014-05-20 TW TW103117680A patent/TWI638499B/zh not_active IP Right Cessation
-
2016
- 2016-05-18 HK HK16105688.8A patent/HK1217830A1/zh not_active IP Right Cessation
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0685408A (ja) * | 1992-08-31 | 1994-03-25 | Hitachi Ltd | 多層プリント回路基板装置 |
JPH09232790A (ja) * | 1996-02-26 | 1997-09-05 | Fuji Electric Co Ltd | プリント基板回路のシールド方法 |
JP2005204493A (ja) * | 2003-12-19 | 2005-07-28 | Semiconductor Energy Lab Co Ltd | 半導体装置及び半導体装置の駆動方法 |
JP2008112862A (ja) * | 2006-10-30 | 2008-05-15 | Nec Saitama Ltd | 両面プリント配線基板、電子機器及び両面プリント配線基板の製造方法 |
JP2008165744A (ja) * | 2006-12-07 | 2008-07-17 | Semiconductor Energy Lab Co Ltd | 半導体装置 |
JP2008271188A (ja) * | 2007-04-20 | 2008-11-06 | Toshiba Corp | 無線機 |
JP2011082797A (ja) * | 2009-10-07 | 2011-04-21 | Murata Mfg Co Ltd | 高周波モジュール |
WO2013054596A1 (fr) * | 2011-10-13 | 2013-04-18 | 株式会社村田製作所 | Démultiplexeur |
WO2013061899A1 (fr) * | 2011-10-28 | 2013-05-02 | 株式会社村田製作所 | Dispositif de réception d'énergie, dispositif de transmission d'énergie et système de transmission d'énergie sans fil |
Also Published As
Publication number | Publication date |
---|---|
CN105284056A (zh) | 2016-01-27 |
WO2014199507A1 (fr) | 2014-12-18 |
TWI638499B (zh) | 2018-10-11 |
CN105284056B (zh) | 2017-09-05 |
US9705363B2 (en) | 2017-07-11 |
HK1217830A1 (zh) | 2017-01-20 |
TW201507312A (zh) | 2015-02-16 |
KR20160019437A (ko) | 2016-02-19 |
US20160156231A1 (en) | 2016-06-02 |
JPWO2014199507A1 (ja) | 2017-02-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6067110B2 (ja) | 通信制御装置及び実装基板 | |
US10205237B2 (en) | Loop antenna and communication control device | |
US10366826B2 (en) | Dual-mode choke coil and high-frequency filter using same, and on-board motor integrated electric power steering and on-board charging device | |
JP4561786B2 (ja) | 送電装置及び電子機器 | |
US8884719B2 (en) | Noise filter device | |
TWI621005B (zh) | 產生調節式隔離供應電壓之方法及裝置 | |
US9099906B2 (en) | Inverter | |
US10044195B2 (en) | Electronic device for communication | |
US10615629B2 (en) | Wireless device | |
JP2017220927A (ja) | 電磁共鳴結合器、及び、伝送装置 | |
TW201429110A (zh) | 給電裝置及無線給電系統 | |
JP5552752B2 (ja) | 受電装置、電子機器および無接点電力伝送システム | |
JP6045150B2 (ja) | 電子機器、モジュール及びシステム | |
KR101392899B1 (ko) | 전력 조절형 3차원 무선 칩 패키지 | |
US10879736B2 (en) | Wireless power transfer systems and methods using non-resonant power receiver | |
CN106972011A (zh) | 用以改善线圈和电感器的噪声隔离的旁路环 | |
US9866102B2 (en) | Power conversion device | |
JP2019087592A (ja) | コンデンサモジュール、共振器、ワイヤレス送電装置、ワイヤレス受電装置、ワイヤレス電力伝送システム | |
KR101427302B1 (ko) | 3차원 무선 칩 패키지 | |
KR101391816B1 (ko) | 무선 전력 제어 장치 및 이를 이용한 3차원 무선 칩 패키지 | |
US20190140478A1 (en) | Capacitor module, resonator, wireless power transmission device, wireless power reception device, and wireless power transmission system | |
US9054701B1 (en) | Semiconductor device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20161124 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20161215 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20161220 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6067110 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
LAPS | Cancellation because of no payment of annual fees |