WO2013054596A1 - Démultiplexeur - Google Patents

Démultiplexeur Download PDF

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Publication number
WO2013054596A1
WO2013054596A1 PCT/JP2012/071342 JP2012071342W WO2013054596A1 WO 2013054596 A1 WO2013054596 A1 WO 2013054596A1 JP 2012071342 W JP2012071342 W JP 2012071342W WO 2013054596 A1 WO2013054596 A1 WO 2013054596A1
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Prior art keywords
transmission
reception
substrate
circuit
terminals
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PCT/JP2012/071342
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English (en)
Japanese (ja)
Inventor
高峰　裕一
坂野　究
宏之 西
一嗣 渡邉
Original Assignee
株式会社村田製作所
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Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Priority to JP2013538468A priority Critical patent/JP5660223B2/ja
Publication of WO2013054596A1 publication Critical patent/WO2013054596A1/fr

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/005—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission adapting radio receivers, transmitters andtransceivers for operation on two or more bands, i.e. frequency ranges
    • H04B1/0053—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission adapting radio receivers, transmitters andtransceivers for operation on two or more bands, i.e. frequency ranges with common antenna for more than one band
    • H04B1/0057—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission adapting radio receivers, transmitters andtransceivers for operation on two or more bands, i.e. frequency ranges with common antenna for more than one band using diplexing or multiplexing filters for selecting the desired band

Definitions

  • the present invention relates to a demultiplexing device having a transmission / reception circuit corresponding to the first and second communication standards, and more particularly to a module type demultiplexing device in which a plurality of electronic component elements are mounted on a substrate.
  • a demultiplexer is connected to an antenna in order to transmit and receive signals of each communication standard.
  • Patent Document 1 discloses an example of this type of demultiplexing device.
  • FIG. 19 is a schematic plan view showing the arrangement of a plurality of connection terminals in the package structure of the branching device described in Patent Document 1.
  • FIGS. 20 (a) to 20 (c) are electrical views of the plurality of connection terminals. It is each typical top view which shows a connection structure.
  • a duplexer corresponding to the first communication standard and the second communication standard is configured.
  • a transmission filter chip 1003 and a reception filter chip 1004 are mounted on the upper surface of the package 1002.
  • the transmission filter chip 1003 includes first and second transmission filters corresponding to the first and second communication standards.
  • first and second reception filters corresponding to the first and second communication standards are configured. These transmission filters and reception filters are composed of surface acoustic wave filters.
  • first and second antenna terminals 1005 and 1006 a first transmission terminal 1007, a second transmission terminal 1008, a first reception terminal 1009, and a second reception terminal 1010 are provided. ing.
  • a plurality of ground terminals 1011 are distributed along the outer periphery of the package 1002.
  • the first antenna terminal 1005, the first transmission terminal 1007, and the first reception terminal 1009 are connected by bonding wires 1012 to 1014.
  • the second transmission terminal 1008 and the second reception terminal 1010 are electrically connected to the second transmission circuit and the second reception circuit by bonding wires 1016 and 1017.
  • a matching circuit L1 provided in the substrate constituting the package is connected between the first antenna terminal 1005 and the ground terminal 1011.
  • a matching circuit L2 provided on another layer of the substrate constituting the package is connected between the second antenna terminal 1006 and the ground terminal 1011.
  • Patent Document 2 discloses a branching device in which a plurality of acoustic wave filter elements are mounted on a package substrate.
  • a plurality of acoustic wave filter elements are connected in parallel to the antenna terminal.
  • the thickness of the surface insulating layer of the package substrate is made thinner than the other insulating layers.
  • Patent Document 2 although the influence of the wiring intersection can be reduced, the intersection itself is not avoided. For this reason, there has been a problem that in the multilayer substrate, the wiring routing distance becomes long and the parasitic capacitance becomes large. In addition, when the distance in the intersecting wires is shortened due to the low profile, the influence of capacitive coupling and inductive coupling increases. Therefore, there has been a problem that the electrical characteristics deteriorate. Furthermore, Patent Document 2 also has a problem that the cost is high because a multilayer substrate is used.
  • An object of the present invention is to provide a branching device that is less likely to cause deterioration of electrical characteristics such as attenuation characteristics due to crossing of wirings and that can be provided at a low cost.
  • the present invention is a branching device including a first transmission / reception circuit corresponding to the first communication standard and a second transmission / reception circuit corresponding to the second communication standard.
  • a demultiplexer according to the present invention includes a substrate having a first main surface on which an antenna terminal, first and second transmission terminals, and first and second reception terminals are provided, and the first of the substrates.
  • the reception filter component includes a first reception filter circuit corresponding to the first communication standard and a second reception filter circuit corresponding to the second communication standard.
  • the transmission filter component includes a first transmission filter circuit corresponding to the first communication standard and a second transmission filter circuit corresponding to the second communication standard.
  • the first transmission filter circuit and the first reception filter circuit constitute a first transmission / reception circuit corresponding to the first communication standard
  • the second transmission filter circuit and the first transmission filter circuit A second transmission / reception circuit corresponding to the second communication standard is configured by the two reception filter circuits.
  • the transmission filter component has first and second transmission ends that constitute one end of the first and second transmission filter circuits, respectively, and the reception filter component is the first and second reception filter circuits.
  • the first and second receiving ends constitute one end of each of the first and second receiving ends.
  • the reception filter component is mounted on one side across the region where the antenna terminal is provided, and the transmission filter component is mounted on the other side.
  • the first connection wiring is provided on the first main surface of the substrate and connects the antenna terminal and the end connected to the antenna terminal of the first transmission / reception circuit. And a second connection line connecting the first connection line and an end of the second transmission / reception circuit connected to the antenna terminal.
  • the first and second transmission terminals are disposed on the one side and the first and second reception terminals are disposed on the other side across an area where the antenna terminal is provided.
  • the first main surface of the substrate has a rectangular plate shape having first to fourth sides, and the antenna is disposed on the first side.
  • a terminal is disposed, the first and second receiving terminals are disposed on the second side adjacent to the first side, and are adjacent to the first side and the first side
  • the first and second transmission terminals are arranged on the third side facing the two sides.
  • the substrate has a second main surface facing the first main surface.
  • the first main surface is provided with first and second transmission external terminals, the first and second reception external terminals, and the antenna external terminal.
  • the first and second transmission external terminals, the first and second reception external terminals, and the antenna external terminal are respectively connected to the first and second transmission terminals by via-hole electrodes provided in the substrate.
  • the first and second receiving terminals and the antenna terminal are electrically connected.
  • the second main surface side of the substrate is provided in a region between the reception filter component and the transmission filter component, and the first And a matching circuit connected between an end portion of the second transmission / reception circuit connected to the antenna terminal and an end portion of the second transmission / reception circuit connected to the antenna terminal.
  • the branching device is electrically connected between the antenna terminal and an end connected to the antenna terminal of the first or second transmission / reception circuit.
  • a second matching circuit is further provided.
  • the matching circuit includes an inductor element and a capacitor element mounted on the substrate.
  • an area where the transmission filter component is provided on the first main surface of the substrate and an area where the reception filter component is mounted A ground electrode is formed in the area between them.
  • the matching circuit includes a capacitor element connected between the first and second inductor elements connected in series with each other, a connection point between the first and second inductor elements, and the ground electrode. And have. One end of the first inductor element is connected to the antenna terminal and the first transmission / reception circuit, and the end of the second inductor element opposite to the side connected to the first inductor element The portion is connected to an end portion connected to the antenna terminal of the second transmission / reception circuit.
  • the first and second transmission terminals are provided on one side and the first and second reception terminals on the other side across the portion where the antenna terminal is provided in order to have the above configuration.
  • the arranged configuration it is possible to avoid crossing of wirings necessary for connecting the transmission filter component and the reception filter component with the first and second transmission terminals, the first and second reception terminals, and the antenna terminal. Therefore, it is possible to achieve deterioration of electrical characteristics such as deterioration of attenuation characteristics due to crossing of wirings while suppressing an increase in cost.
  • FIG. 1 is a schematic plan view showing a schematic configuration of a demultiplexer according to the first embodiment of the present invention.
  • FIG. 2 is a schematic circuit diagram of the branching device according to the first embodiment of the present invention.
  • FIG. 3 is a schematic plan view showing the relationship between a substrate and a plurality of elements mounted on the substrate in the demultiplexing device according to the first embodiment of the present invention.
  • FIG. 4 is a plan view showing an electrode structure on the upper surface of the substrate used in the first embodiment of the present invention.
  • FIG. 5 is a schematic plan view showing an electrode structure on the lower surface of the substrate used in the first embodiment of the present invention.
  • FIG. 6 is a schematic plan view showing the relationship between the electrodes on the upper surface of the multilayer substrate of the demultiplexing device prepared for comparison and a plurality of mounted elements.
  • FIG. 7 is a schematic plan view showing the electrode structure on the upper surface of the multilayer substrate of the demultiplexing device prepared for comparison.
  • FIG. 8 is a schematic plan view showing an electrode structure at an intermediate height position of the multilayer substrate of the duplexer prepared for comparison.
  • FIG. 9 is a schematic plan view showing a planar electrode structure at an intermediate height position lower than the height position plane shown in FIG.
  • FIG. 10 is a schematic plan view showing an electrode structure on the lower surface of a conventional branching device prepared for comparison.
  • FIG. 11 is a diagram illustrating transmission characteristics in the demultiplexing devices of the first embodiment and the comparative example in the Band2 standard.
  • FIG. 12 is a diagram illustrating the reception characteristics of the first and second branching devices in the Band2 standard.
  • FIG. 13 is a diagram illustrating isolation characteristics in the differential mode from the transmission side to the reception side in the duplexers of the first embodiment and the comparative example in the Band2 standard.
  • FIG. 14 is a diagram illustrating isolation characteristics in the common mode from the transmission side to the reception side in the demultiplexing devices of the first embodiment and the comparative example in the Band2 standard.
  • FIG. 15 is a diagram illustrating the attenuation frequency characteristics of the transmission filter in the branching device of the first embodiment and the comparative example in the Band5 standard.
  • FIG. 16 is a diagram illustrating the attenuation frequency characteristics of the reception filter in the branching device of the first embodiment and the comparative example in the Band5 standard.
  • FIG. 17 is a diagram illustrating isolation characteristics from the transmission terminal to the reception terminal in the branching device of the first embodiment and the comparative example in the Band5 standard.
  • FIG. 18 is a diagram illustrating isolation characteristics from the receiving terminal to the receiving terminal in the branching device according to the first embodiment and the comparative example in the Band5 standard.
  • FIG. 19 is a schematic plan view showing an arrangement of a plurality of connection terminals in a package structure of a conventional branching device.
  • 20A to 20C are schematic plan views showing an electrical connection configuration of a plurality of connection terminals.
  • FIG. 1 is a schematic configuration diagram of a demultiplexer according to the first embodiment of the present invention.
  • the duplexer 1 has a substrate 2.
  • the substrate 2 includes an insulating layer made of an appropriate insulating material. As will be described later, the substrate 2 is not a multilayer substrate but a substrate including a single insulating layer, as will be described later. Therefore, the cost can be reduced as compared with the case where a multilayer substrate including a plurality of insulating layers and connection wirings arranged between the plurality of insulating layers is used.
  • the reception filter component 3 and the transmission filter component 4 are mounted on the substrate 2.
  • the reception filter component 3 includes a first reception filter circuit 5 and a second reception filter circuit 6.
  • Each of the first and second reception filter circuits 5 and 6 includes a surface acoustic wave filter.
  • a surface acoustic wave filter constituting such reception filter circuits 5 and 6 a conventionally known longitudinally coupled resonator type surface acoustic wave filter can be used.
  • the first reception filter circuit 5 has an antenna end 5a connected to an antenna terminal described later and a reception end 5b connected to a reception terminal described later.
  • the second reception filter circuit 6 also has an antenna end 6a and a reception end 6b.
  • the transmission filter component 4 includes a first transmission filter circuit 7 and a second transmission filter circuit 8.
  • the first and second transmission filter circuits 7 and 8 are constituted by surface acoustic wave filters.
  • a surface acoustic wave filter a conventionally known surface acoustic wave filter having a ladder circuit configuration can be exemplified.
  • the first transmission filter circuit 7 has an antenna end 7a connected to the antenna terminal and a transmission end 7b connected to the transmission terminal.
  • the second transmission filter circuit 8 also has an antenna end 8a and a transmission end 8b.
  • the first reception filter circuit 5 and the first transmission filter circuit 7 constitute a first transmission / reception circuit 9.
  • the first transmission / reception circuit 9 is a transmission / reception circuit corresponding to Band 2 (transmission frequency band: 1850 to 1910 MHz, reception frequency band: 1930 to 1990 MHz) as the first communication standard.
  • the second reception filter circuit 6 and the second transmission filter circuit 8 constitute a second transmission / reception circuit 10 having a frequency band different from that of the first transmission / reception circuit.
  • the second transmission / reception circuit 10 is a transmission / reception circuit corresponding to Band 5 (transmission frequency band: 824 to 849 MHz, reception frequency band: 869 to 894 MHz) as the second communication standard.
  • the duplexer 1 is a duplexer that supports two communication standards, Band2 and Band5, as described above.
  • the splitter 1 is connected to the antenna 11.
  • the branching device 1 is provided with an antenna terminal 12 on the substrate 2.
  • a first connection wiring 13 is provided so as to be connected to the antenna terminal 12.
  • One end of the first connection wiring 13 is connected to the antenna terminal 12.
  • the first connection wiring 13 is connected to the antenna end 5 a of the first reception filter circuit 5 and the antenna end 7 a of the first transmission filter circuit 7. More specifically, the first connection wiring 13 has a connection point 13a. This connection point 13a is connected to the antenna ends 5a and 7a.
  • the first connection wiring 13 is a connection wiring portion connecting the antenna terminal 12 and the antenna ends 5a and 7a.
  • the second connection wiring 14 is formed on the upper surface of the substrate 2. One end of the second connection wiring 14 is connected to the connection point 13a.
  • the second connection wiring 14 is connected to the antenna end 6 a of the second reception filter circuit 6 and the antenna end 8 a of the second transmission filter circuit 8.
  • the second connection wiring 14 has a connection point 14a.
  • a connection point 14a is connected to the antenna ends 6a and 8a.
  • the matching circuit 15 is inserted in the second connection wiring 14 between the connection point 13a and the connection point 14a. Details of the matching circuit 15 will be described later.
  • the substrate 2 has a rectangular plate shape. One side of this rectangle is defined as a first side 2a.
  • An antenna terminal 12 is provided on the substrate 2 on the first side 2a side and between the reception filter component 3 and the transmission filter component.
  • a first transmission terminal 16 and a second transmission terminal 17 are provided on the substrate 2 in order from the antenna terminal 12 side along the second side 2b adjacent to the first side 2a.
  • the first transmission terminal 16 is connected to the transmission end 7b.
  • the second transmission terminal 17 is connected to the transmission end 8b.
  • First and second receiving terminals 18 and 19 are provided on the substrate 2 in order from the antenna terminal 12 side so as to extend along the third side 2c facing the second side 2b.
  • the first and second receiving terminals 18 and 19 are connected to the receiving ends 5b and 6b, respectively.
  • the fourth side 2d is opposed to the first side 2a.
  • FIG. 2 is a schematic circuit diagram of the branching device 1.
  • a duplexer in which the first and second transmission / reception circuits 9 and 10 are connected in parallel to the antenna terminal 12 is configured.
  • the reception filter component 3 is disposed on one side and the transmission filter component 4 is disposed on the other side with the antenna terminal 12 interposed therebetween. Therefore, the antenna ends 5 a, 6 a, 7 a, and 8 a can be electrically connected to the antenna terminal 12 by the first connection wiring 13 and the second connection wiring 14. That is, the antenna ends 5a to 8a can be electrically connected to the antenna terminal 12 by the first connection wiring 13 and the second connection wiring 14 provided so as not to intersect.
  • a transmission terminal group having first and second transmission terminals 16 and 17 is arranged on the substrate 2 while being brought close to the second side 2b side.
  • a receiving terminal group having the first and second receiving terminals 18 and 19 is arranged close to the third side 2c side. Therefore, the first and second transmission terminals 16 and 17 and the first and second reception terminals 18 and 19 can be easily connected to the portion connected to the next stage of the branching device 1.
  • first and second transmission terminals 16 and 17 and the connection wirings 21 and 22 connecting the transmission terminals 7b and 8b can be formed with a short wiring length without intersecting.
  • first and second receiving ends 5 b and 6 b are also connected to the first and second receiving terminals 18 and 19 by short connection wires 23 and 24.
  • the circuit parts constituting the first and second transmission / reception circuits 9 and 10 are connected to the outside such as the reception terminals 18 and 19, the transmission terminals 16 and 17 and the antenna terminal 12 provided on the substrate 2.
  • the connection wiring necessary for connection with the terminal for the purpose can be formed without intersecting on the upper surface of the substrate 2.
  • the length of the connection wiring can be shortened. Accordingly, capacitive coupling and inductive coupling between the connection wirings can be suppressed, generation of parasitic capacitance can be suppressed, and the electrical resistance of the connection wiring can be further reduced.
  • the duplexer can be easily downsized. Furthermore, the material cost and the manufacturing cost can be reduced by downsizing the substrate or shortening the wiring.
  • a multilayer substrate may be used. Even if a multilayer substrate is used, no crossing portion is required, so that capacitive coupling and inductive coupling can be suppressed. Therefore, the cost can be reduced by reducing the size of the substrate or shortening the wiring as described above.
  • FIG. 3 is a schematic plan view showing the relationship between a plurality of elements mounted on the substrate 2 and the electrode structure provided on the upper surface of the substrate 2 in the demultiplexing device 1, and FIG. It is a top view which shows an electrode structure.
  • a reception filter component 3 is mounted on the upper surface of the substrate 2.
  • a plurality of electrodes for electrical connection to the outside are formed on the lower surface of the reception filter component 3 facing the upper surface of the substrate 2.
  • FIG. 3 schematically shows the positions of the plurality of electrodes.
  • the plurality of electrodes include the electrodes constituting the antenna ends 5a and 6a and the receiving ends 5b and 6b, and the ground electrodes 5c and 6c connected to the ground potential.
  • the electrodes constituting the antenna ends 7a and 8a and the transmission ends 7b and 8b and the ground electrodes 7c and 8c connected to the ground potential are also arranged on the lower surface of the transmission filter component 4.
  • the first and second reception filter circuits 5 and 6 are balanced. That is, although the receiving terminals 18 and 19 are shown in FIG. 1, in the structure shown in FIG. 3, the receiving filter circuits 5 and 6 each have two first and second balanced output terminals. Therefore, on the lower surface of the reception filter component 3, two balanced receiving ends 5b1 and 5b2 corresponding to Band2 and two balanced receiving ends 6b1 and 6b2 corresponding to Band5 are provided. According to the present embodiment, even if the first and second reception filter circuits 5 and 6 are of the balanced type, no intersection between the connection wirings occurs on the upper surface of the substrate 2. In addition, only one of the first and second reception filter circuits 5 and 6 may be a balanced type, and in this case also, an intersection of connection wirings does not occur on the upper surface of the substrate 2.
  • the inductor elements 31 and 32 and the capacitor element 33 constituting the matching circuit 15 are mounted on the substrate 2.
  • one end of the first inductor element 31 is connected to the antenna terminal, and the other end is connected to one end of the capacitor element 33 and the second inductor element 32.
  • the other end of the second inductor element 32 is connected to the antenna ends 6 a and 8 a of the second transmission / reception circuit 10. That is, the other end of the second inductor element 32 is connected to the antenna ends 6a and 8a.
  • the other end of the capacitor element 33 is connected to the ground potential.
  • the first and second inductor elements 31 and 32 and the capacitor element 33 are made of chip parts and are surface-mounted on the substrate 2.
  • the matching circuit 15 is provided for impedance matching between the first transmission / reception circuit 9 and the second transmission / reception circuit 10.
  • the first and second transmission terminals 16 and 17, the first reception terminals 18 a and 18 b, the second reception terminals 19 a and 19 b, and the antenna terminal 12 are formed on the upper surface of the substrate 2.
  • a wiring pattern is formed.
  • a wiring electrode 34 for connecting the first inductor element 31, the capacitor element 33 and the second inductor element 32, and a wiring electrode 35 for connecting the capacitor element 33 to the ground potential are formed.
  • the antenna terminal 12 is arranged in an intermediate region between the reception filter component 3 and the transmission filter component 4 on the substrate 2.
  • the antenna terminal 12 is connected to a wiring pattern constituting the first connection wiring 13.
  • the antenna ends 6 a and 8 a are electrically connected by the wiring electrode 36.
  • the second connection wiring 14 is a connection wiring including wiring electrodes 34, 35 and 36.
  • the second connection wiring 14 is between the reception filter component 3 and the transmission filter component 4 on the substrate 2 in the direction in which the reception filter component 3 and the transmission filter component 4 face each other. Arranged in the middle area. Further, the side arranged so that the first and second transmission terminals are along and the side arranged so as to be along the first and second reception terminals face each other. With the above configuration, the first connection wiring 13 and the second connection wiring 14 can be easily provided on the substrate 2 so as not to cross each other.
  • first and second transmission terminals and the first and second reception terminals can be arranged in two corresponding sides and arranged close to the end of the side. Therefore, it is easy to dispose the transmission terminal that transmits a transmission signal having a stronger signal strength than the reception signal and the reception terminal without crossing each other. For this reason, it is possible to suppress deterioration of the signal generated by the transmission signal transmitted to the transmission terminal interfering with the reception signal via the reception terminal.
  • reception terminals 18a, 18b, 19a, and 19b are provided at positions where the reception ends 5b1, 5b2, 6b1, and 6b2 overlap.
  • the large-area electrodes 37 and 38 in FIG. 4 are electrodes connected to the ground potential.
  • the receiving ends 5b1, 5b2, 6b1, and 6b2 on the lower surface of the receiving filter component 3 are electrically connected to the receiving terminals 18a, 18b, 19a, and 19b by a conductive bonding material such as solder.
  • the transmission ends 7b and 8b are joined to the transmission terminals 16 and 17 on the upper surface of the substrate 2 using a conductive bonding material and are electrically connected.
  • the ground electrodes 6c, 5c, 7c, and 8c on the lower surfaces of the reception filter component 3 and the transmission filter component 4 are electrically connected to the electrode 37 or 38 by a conductive bonding material.
  • the via-hole electrode 41 is provided in each part shown with the broken-line circle shown in FIG.
  • the via-hole electrode 41 penetrates the substrate 2 and extends from the first main surface that is the upper surface to the second main surface that is the lower surface.
  • FIG. 5 is a schematic plan view showing the electrode structure formed on the lower surface of the substrate 2. Note that the lower end of the via-hole electrode 41 is indicated by a solid line in FIG.
  • the transmission external terminals 51 and 52 and the reception external terminals 53 a, 53 b, 54 a, and the reception external terminals 51 a, 52, and the reception external terminals 53 a, 53 b, 54 a, 54b is formed.
  • a ground electrode 56 is formed at the center of the lower surface of the substrate 2.
  • the transmission external terminals 51 and 52 are electrically connected to the transmission terminals 16 and 17 on the upper surface of the substrate 2 through the via hole electrodes 41.
  • the reception external terminals 53a, 53b, 54a, and 54b are electrically connected to the reception terminals 18a, 18b, 19a, and 19b through the via-hole electrode 41.
  • the first and second connection wirings 13 and 14 are formed on the upper surface of the substrate 2. Does not occur.
  • the length of the wiring pattern including the first and second connection wirings 13 and 14 can be shortened. Therefore, it is difficult for degradation of attenuation characteristics due to capacitive coupling or inductive coupling to occur. This will be clarified in comparison with the branching device of the comparative example shown in FIGS.
  • the demultiplexer 1101 of the comparative example shown in FIG. 6 is a duplexer corresponding to the Band2 and Band5 communication standards, as in the above embodiment.
  • a transmission / reception surface acoustic wave filter component 1103 corresponding to Band 2 and a transmission / reception surface acoustic wave filter component 1104 corresponding to Band 5 are mounted on the multilayer substrate 1102.
  • the transmission / reception surface acoustic wave filter component 1103 is a chip component having a transmission circuit and a reception circuit corresponding to the Band2 communication standard.
  • the surface acoustic wave filter component 1104 for transmission / reception is a chip component having a transmission circuit and a reception circuit corresponding to the Band 5 communication standard.
  • the first and second inductor elements 1105 and 1106 and the capacitor element 1107 are mounted on the upper surface of the multilayer substrate 1102 as in the above embodiment. Thereby, a matching circuit is configured.
  • the connection location and circuit configuration of the matching circuit are not limited to the above-described embodiment. It is preferable to set the characteristics of the inductor element and capacitor element to be configured or the connection position of the matching circuit.
  • FIG. 7 is a schematic plan view showing the electrode structure on the upper surface of the multilayer substrate 1102 of the demultiplexing device 1101.
  • FIG. 8 is a schematic plan view showing an electrode structure at an intermediate height position of the multilayer substrate 1102.
  • FIG. 9 is a schematic plan view showing a planar electrode structure at an intermediate height position lower than the height position plane shown in FIG. 8, and
  • FIG. 10 schematically shows an electrode structure on the lower surface of the multilayer substrate 1102.
  • each external terminal electrode is represented in the same manner.
  • Ant in FIG. 10 indicates an antenna external terminal.
  • FIG. 11 to FIG. 14 show the communication characteristics of Band 2 of the branching device 1 of the above embodiment and the branching device 1101 prepared as a comparative example.
  • 11 to 14 the solid line indicates the result of the embodiment, and the broken line indicates the result of the comparative example.
  • 11 shows the transmission characteristics
  • FIG. 12 shows the reception characteristics
  • FIG. 13 shows the isolation characteristics in the differential mode from the transmission side to the reception side
  • FIG. 14 shows the isolation characteristics in the common mode from the transmission side to the reception side. .
  • the insertion loss in the passband is generally deteriorated.
  • the amount of attenuation can be reduced by about 0.7 dB between the transmission terminal and the antenna terminal, and can be reduced by about 0.2 dB between the antenna terminal and the reception terminal.
  • the attenuation in the pass band is large in the transmission characteristics of FIG. 11, and it can be seen that the insertion loss in the pass band is also large in the reception characteristics shown in FIG.
  • FIGS. 15 to 18 are diagrams showing transmission characteristics, reception characteristics, differential characteristics in the differential mode, and isolation characteristics in the common mode in Band5. Also in FIGS. 15 to 18, the result of the embodiment is shown by a solid line, and the result of the comparative example is shown by a broken line.
  • the insertion loss in the pass band of the transmission filter and the reception filter is larger in the comparative example than in the above embodiment. That is, in Band 5, it can be seen that the attenuation can be reduced by 0.5 dB at the center of the pass band of the transmission filter, and the attenuation can be reduced by about 0.3 dB at the center of the pass band of the reception filter. It can also be seen that the isolation characteristics are degraded in the comparative example compared to the embodiment.
  • the communication quality can be effectively improved as compared with the comparative example.
  • the reason why the insertion loss in the passband is increased is considered to be that the loss has increased due to the longer routing length of the connection wiring.
  • impedance matching between the Band 2 side and the Band 5 side is reduced due to capacitive coupling or inductive coupling between the connection wirings.
  • the first and second transmission external terminals 51 and 52 are arranged along the rectangular second side 2b, and the reception external terminals 53a, 53b, 54a and 54b are arranged along the third side 2c. Therefore, electrical connection with an IC or the like can be easily performed. That is, the duplexer 1 that can be easily connected to the outside can be configured using the single substrate 2.
  • the antenna external terminal 55, the transmission external terminals 51 and 52, and the reception external terminals 53a, 53b, 54a, and 54b are provided on the second main surface, that is, the bottom surface of the substrate 2, but in the present invention, These external terminals may not be provided on the second main surface. That is, the antenna terminal, the transmission terminal, and the reception terminal provided on the upper surface of the substrate 2 may be used for connection to the outside.
  • a single-sided substrate in which a wiring pattern and terminals are formed only on one main surface of the substrate 2 can be used.
  • the first and second transmission filter circuits and the first and second reception filter circuits are configured by the surface acoustic wave filters in the reception filter component 3 and the transmission filter component 4, respectively.
  • an elastic wave filter using an elastic boundary wave or a bulk elastic wave may be used.
  • Second transmission filter circuit 8a ... Antenna end 8b ... Transmission end 8c ... Ground electrode 9 ... First transmission / reception circuit 10 ... Second transmission / reception circuit 11 ... Antenna 12 ... Antenna terminal 13 ... First connection wiring 13a ... Connection point 14 ... Second connection wiring 14a ... Connection point 15 ... Matching circuit 16 ... First transmission terminal 17 ... Second transmission terminal 18 ... First Receiving Terminals 18a, 18b ... Reception terminal 19 ... Second reception terminals 19a, 19b ... Reception terminals 21, 22, 23, 24 ... Connection wiring 31 ... First inductor element 32 ... Second inductor element 33 ... Capacitor element 34, 35, 36 ... Wiring electrodes 37, 38 ... Electrode 41 ... Via hole electrodes 51, 52 ... Transmission external terminals 53a, 53b, 54a, 54b ... Reception external terminals 55 ... Antenna external terminals 56 ... Ground electrodes

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  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Transceivers (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)

Abstract

L'invention concerne un démultiplexeur économique qui permet de réduire la longueur de fil installée et qui résiste à une détérioration d'une caractéristique d'atténuation ou d'une autre caractéristique électrique, due au croisement de fils. Le démultiplexeur (1) comprend : une borne d'antenne (12) placée sur une première surface principale d'un substrat (2); un composant de filtrage de réception (3) monté sur un côté de la borne d'antenne (12) et un composant de filtrage d'émission (4) monté de l'autre côté; un premier et un second circuit de filtrage de réception (5, 6) sont implantés sur le composant de filtrage de réception (3); un premier et un second circuit de filtrage d'émission (7, 8) implantés sur le composant de filtrage d'émission (4); un premier fil de connexion (13) formé sur le substrat (2) pour connecter la borne d'antenne (12) à des parties d'extrémité d'antenne (5a, 7a) du premier circuit de filtrage de réception (5) et du premier circuit de filtrage d'émission (7), et un second fil de connexion (14) qui est connecté au premier fil de connexion (13) et connecte à une partie d'extrémité d'antenne (6a) du second circuit de filtrage de réception (6) et à une partie d'extrémité d'antenne (8a) du second circuit de filtrage d'émission (8); une première et une seconde borne d'émission (16, 17) placées sur un côté et une première et une seconde borne de réception (18, 19) placées sur l'autre côté, avec la borne d'antenne (12) entre elles.
PCT/JP2012/071342 2011-10-13 2012-08-23 Démultiplexeur WO2013054596A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013538468A JP5660223B2 (ja) 2011-10-13 2012-08-23 分波装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011-225950 2011-10-13
JP2011225950 2011-10-13

Publications (1)

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WO2013054596A1 true WO2013054596A1 (fr) 2013-04-18

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PCT/JP2012/071342 WO2013054596A1 (fr) 2011-10-13 2012-08-23 Démultiplexeur

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JP (1) JP5660223B2 (fr)
WO (1) WO2013054596A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014199507A1 (fr) * 2013-06-14 2014-12-18 ルネサスエレクトロニクス株式会社 Dispositif de commande de communication et carte de montage
US20180068942A1 (en) * 2016-09-05 2018-03-08 Renesas Electronics Corporation Electronic device
JP2019205184A (ja) * 2015-04-27 2019-11-28 太陽誘電株式会社 モジュール

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010045563A (ja) * 2008-08-12 2010-02-25 Murata Mfg Co Ltd マルチバンドデュプレクサモジュール

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010045563A (ja) * 2008-08-12 2010-02-25 Murata Mfg Co Ltd マルチバンドデュプレクサモジュール

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014199507A1 (fr) * 2013-06-14 2014-12-18 ルネサスエレクトロニクス株式会社 Dispositif de commande de communication et carte de montage
JP6067110B2 (ja) * 2013-06-14 2017-01-25 ルネサスエレクトロニクス株式会社 通信制御装置及び実装基板
US9705363B2 (en) 2013-06-14 2017-07-11 Renesas Electronics Corporation Communication control device and mounting board
JP2019205184A (ja) * 2015-04-27 2019-11-28 太陽誘電株式会社 モジュール
US20180068942A1 (en) * 2016-09-05 2018-03-08 Renesas Electronics Corporation Electronic device
US10056332B2 (en) * 2016-09-05 2018-08-21 Renesas Electronics Corporation Electronic device with delamination resistant wiring board
US10396031B2 (en) 2016-09-05 2019-08-27 Renesas Electronics Corporation Electronic device with delamination resistant wiring board

Also Published As

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JPWO2013054596A1 (ja) 2015-03-30
JP5660223B2 (ja) 2015-01-28

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