JP6057379B2 - 窒化銅微粒子およびその製造方法 - Google Patents
窒化銅微粒子およびその製造方法 Download PDFInfo
- Publication number
- JP6057379B2 JP6057379B2 JP2013225296A JP2013225296A JP6057379B2 JP 6057379 B2 JP6057379 B2 JP 6057379B2 JP 2013225296 A JP2013225296 A JP 2013225296A JP 2013225296 A JP2013225296 A JP 2013225296A JP 6057379 B2 JP6057379 B2 JP 6057379B2
- Authority
- JP
- Japan
- Prior art keywords
- copper
- fine particles
- nitride fine
- copper nitride
- particles according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C24/00—Coating starting from inorganic powder
- C23C24/08—Coating starting from inorganic powder by application of heat or pressure and heat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B21/00—Nitrogen; Compounds thereof
- C01B21/06—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
- C01B21/0615—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with transition metals other than titanium, zirconium or hafnium
- C01B21/0625—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with transition metals other than titanium, zirconium or hafnium with copper
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/34—Nitrides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4417—Methods specially adapted for coating powder
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2002/00—Crystal-structural characteristics
- C01P2002/70—Crystal-structural characteristics defined by measured X-ray, neutron or electron diffraction data
- C01P2002/72—Crystal-structural characteristics defined by measured X-ray, neutron or electron diffraction data by d-values or two theta-values, e.g. as X-ray diagram
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2002/00—Crystal-structural characteristics
- C01P2002/80—Crystal-structural characteristics defined by measured data other than those specified in group C01P2002/70
- C01P2002/88—Crystal-structural characteristics defined by measured data other than those specified in group C01P2002/70 by thermal analysis data, e.g. TGA, DTA, DSC
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/01—Particle morphology depicted by an image
- C01P2004/04—Particle morphology depicted by an image obtained by TEM, STEM, STM or AFM
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/30—Particle morphology extending in three dimensions
- C01P2004/32—Spheres
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/64—Nanometer sized, i.e. from 1-100 nanometer
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Nanotechnology (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Crystallography & Structural Chemistry (AREA)
- Inorganic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Composite Materials (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
- Powder Metallurgy (AREA)
- Electrodes Of Semiconductors (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013225296A JP6057379B2 (ja) | 2013-01-31 | 2013-10-30 | 窒化銅微粒子およびその製造方法 |
| KR1020157020804A KR20150112984A (ko) | 2013-01-31 | 2014-01-31 | 질화구리 미립자 및 그 제조 방법 |
| PCT/JP2014/052321 WO2014119748A1 (ja) | 2013-01-31 | 2014-01-31 | 窒化銅微粒子およびその製造方法 |
| CN201480006826.7A CN104981427A (zh) | 2013-01-31 | 2014-01-31 | 氮化铜微粒及其制造方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013017510 | 2013-01-31 | ||
| JP2013017510 | 2013-01-31 | ||
| JP2013225296A JP6057379B2 (ja) | 2013-01-31 | 2013-10-30 | 窒化銅微粒子およびその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014166939A JP2014166939A (ja) | 2014-09-11 |
| JP2014166939A5 JP2014166939A5 (enExample) | 2016-06-23 |
| JP6057379B2 true JP6057379B2 (ja) | 2017-01-11 |
Family
ID=51262445
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013225296A Expired - Fee Related JP6057379B2 (ja) | 2013-01-31 | 2013-10-30 | 窒化銅微粒子およびその製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6057379B2 (enExample) |
| KR (1) | KR20150112984A (enExample) |
| CN (1) | CN104981427A (enExample) |
| WO (1) | WO2014119748A1 (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015147561A1 (ko) * | 2014-03-26 | 2015-10-01 | 전자부품연구원 | 전도체 패턴의 형성이 용이한 복합소재와 그 복합소재를 제조하는 방법 및 상기 복합소재에서 시드 소재인 구리질화물 및 그 구리질화물을 합성하는 방법 |
| JP6574553B2 (ja) * | 2014-06-26 | 2019-09-11 | 昭和電工株式会社 | 導電パターン形成用組成物および導電パターン形成方法 |
| KR102303767B1 (ko) * | 2017-11-01 | 2021-09-23 | 한국전자기술연구원 | 전도체 패턴용 구리질화물 분말의 제조 방법 |
| CN110642304B (zh) * | 2019-10-09 | 2021-12-31 | 上海师范大学 | 一种超级电容器用三金属氮化物材料及其制备方法 |
| CN111450867A (zh) * | 2020-05-09 | 2020-07-28 | 青岛科技大学 | 用于电催化二氧化碳还原的Cu3N纳米催化剂的制备方法 |
| CN115057417B (zh) * | 2022-06-08 | 2023-09-12 | 安徽大学 | 一种氮化铜纳米片的制备及其在甲酸盐电合成中的应用 |
| CN116516280A (zh) * | 2023-04-27 | 2023-08-01 | 常州大学 | 一种高效节能的工件氮化方法 |
| CN116924697B (zh) * | 2023-07-31 | 2025-08-29 | 上海耀皮工程玻璃有限公司 | 一种Low-E镀膜玻璃调色层及其制备方法和用途 |
| CN119282131A (zh) * | 2024-11-18 | 2025-01-10 | 济源星翰新材料科技有限公司 | 一种微米铜粉的制备方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005122230A1 (ja) * | 2004-06-07 | 2005-12-22 | Kyushu Institute Of Technology | 銅表面の処理方法及び銅パターン配線形成方法、並びに該方法を用いて作成された半導体装置 |
| JP3870273B2 (ja) * | 2004-12-28 | 2007-01-17 | 国立大学法人九州工業大学 | 銅パターン配線形成方法及び該方法を用いて作成された半導体装置、並びにナノ銅金属粒子 |
| JP5778382B2 (ja) * | 2008-10-22 | 2015-09-16 | 東ソー株式会社 | 金属膜製造用組成物、金属膜の製造方法及び金属粉末の製造方法 |
| JP5243510B2 (ja) * | 2010-10-01 | 2013-07-24 | 富士フイルム株式会社 | 配線材料、配線の製造方法、及びナノ粒子分散液 |
-
2013
- 2013-10-30 JP JP2013225296A patent/JP6057379B2/ja not_active Expired - Fee Related
-
2014
- 2014-01-31 WO PCT/JP2014/052321 patent/WO2014119748A1/ja not_active Ceased
- 2014-01-31 KR KR1020157020804A patent/KR20150112984A/ko not_active Ceased
- 2014-01-31 CN CN201480006826.7A patent/CN104981427A/zh active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| CN104981427A (zh) | 2015-10-14 |
| WO2014119748A1 (ja) | 2014-08-07 |
| KR20150112984A (ko) | 2015-10-07 |
| JP2014166939A (ja) | 2014-09-11 |
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