JP6050587B2 - 可変式メモリリフレッシュ装置および方法 - Google Patents
可変式メモリリフレッシュ装置および方法 Download PDFInfo
- Publication number
- JP6050587B2 JP6050587B2 JP2011543731A JP2011543731A JP6050587B2 JP 6050587 B2 JP6050587 B2 JP 6050587B2 JP 2011543731 A JP2011543731 A JP 2011543731A JP 2011543731 A JP2011543731 A JP 2011543731A JP 6050587 B2 JP6050587 B2 JP 6050587B2
- Authority
- JP
- Japan
- Prior art keywords
- memory
- vault
- memory device
- vaults
- different
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims description 10
- 238000005516 engineering process Methods 0.000 description 14
- 238000010586 diagram Methods 0.000 description 8
- 230000004044 response Effects 0.000 description 8
- 230000003068 static effect Effects 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 5
- 238000004891 communication Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000003491 array Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 208000033921 delayed sleep phase type circadian rhythm sleep disease Diseases 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 238000005457 optimization Methods 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000036772 blood pressure Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000012549 training Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
- G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
- G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
- G11C11/406—Management or control of the refreshing or charge-regeneration cycles
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
- G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
- G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
- G11C11/406—Management or control of the refreshing or charge-regeneration cycles
- G11C11/40618—Refresh operations over multiple banks or interleaving
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
- G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
- G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
- G11C11/406—Management or control of the refreshing or charge-regeneration cycles
- G11C11/40626—Temperature related aspects of refresh operations
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
- G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
- G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
- G11C11/4063—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing
- G11C11/407—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing for memory cells of the field-effect type
- G11C11/409—Read-write [R-W] circuits
- G11C11/4097—Bit-line organisation, e.g. bit-line layout, folded bit lines
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2211/00—Indexing scheme relating to digital stores characterized by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C2211/401—Indexing scheme relating to cells needing refreshing or charge regeneration, i.e. dynamic cells
- G11C2211/406—Refreshing of dynamic cells
- G11C2211/4061—Calibration or ate or cycle tuning
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/70—Masking faults in memories by using spares or by reconfiguring
Description
Claims (9)
- 複数のメモリダイのスタックと、
前記複数のメモリダイのスタックにおけるリフレッシュ速度を管理するためのロジックダイであって、前記複数のメモリダイのスタックに取り付けられたロジックダイと、
前記ロジックダイに配置され、異なるリフレッシュ速度で、前記複数のメモリダイのスタックを3次元構造的に小区分して構成した複数のボールトを、リフレッシュするために用いられるメモリマップと、
前記複数のボールトに対するエラー率を探知するエラートラッカーと、
を備え、
前記探知されたエラー率は前記複数のボールトの前記リフレッシュ速度を調節するために用いられる、メモリ装置。 - 前記ロジックダイは、前記メモリダイのスタックから動作データを受け取るよう、および前記動作データに基づいて、前記異なるリフレッシュ速度のうちの少なくとも1つを動的に調節するよう、構成された、請求項1に記載のメモリ装置。
- 前記メモリマップは、前記複数のボールトのうちの第1ボールトは、前記複数のボールトのうちの第2ボールトとは異なる速度でリフレッシュされることができるよう構成された、請求項1に記載のメモリ装置。
- 各ボールトは別個のメモリマップと関連した、請求項3に記載のメモリ装置。
- スタックされた複数のメモリダイを含むメモリ装置を3次元構造的に小区分して構成した複数のボールトから生成された動作データを用いて生成されたメモリマップを用いることにより、前記メモリ装置の第1のボールトをゼロより大きい第1リフレッシュ速度でリフレッシュすることと、
前記メモリマップを用いることにより、ゼロよりも大きく且つ前記第1リフレッシュ速度とは異なる第2リフレッシュ速度で前記メモリ装置の第2のボールトをリフレッシュすることと、
を含み、
前記生成された動作データは、動的であり、前記メモリ装置が動作する間、前記異なるリフレッシュ速度を動的に調節するためのフィードバックとして用いられる、メモリ装置を動作させる方法。 - 前記メモリ装置のいくつかの異なるボールトの動作データを生成することは、各異なるボールトのエラー率を探知することを含む、請求項5に記載の方法。
- 前記ボールトにおいて探知されたエラー率がエラー率閾値を超える場合、前記メモリ装置の当該ボールトを無効化することをさらに含む、請求項6に記載の方法。
- メモリ装置のいくつかの異なるボールトの動作データを生成することは、装置温度を探知することをさらに含む、請求項6に記載の方法。
- 前記メモリ装置のいくつかの異なるボールトの動作データを生成することは、前記異なるボールトのパワーダウン状態を探知することをさらに含む、請求項8に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/346,542 US7929368B2 (en) | 2008-12-30 | 2008-12-30 | Variable memory refresh devices and methods |
US12/346,542 | 2008-12-30 | ||
PCT/US2009/069858 WO2010078454A1 (en) | 2008-12-30 | 2009-12-30 | Variable memory refresh devices and methods |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012514286A JP2012514286A (ja) | 2012-06-21 |
JP6050587B2 true JP6050587B2 (ja) | 2016-12-21 |
Family
ID=42284755
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011543731A Active JP6050587B2 (ja) | 2008-12-30 | 2009-12-30 | 可変式メモリリフレッシュ装置および方法 |
Country Status (7)
Country | Link |
---|---|
US (3) | US7929368B2 (ja) |
EP (1) | EP2377127B1 (ja) |
JP (1) | JP6050587B2 (ja) |
KR (2) | KR101528659B1 (ja) |
CN (1) | CN102272849B (ja) |
TW (1) | TWI435326B (ja) |
WO (1) | WO2010078454A1 (ja) |
Families Citing this family (73)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7691668B2 (en) * | 2006-12-19 | 2010-04-06 | Spansion Llc | Method and apparatus for multi-chip packaging |
US7929368B2 (en) | 2008-12-30 | 2011-04-19 | Micron Technology, Inc. | Variable memory refresh devices and methods |
US8127185B2 (en) | 2009-01-23 | 2012-02-28 | Micron Technology, Inc. | Memory devices and methods for managing error regions |
US8018752B2 (en) * | 2009-03-23 | 2011-09-13 | Micron Technology, Inc. | Configurable bandwidth memory devices and methods |
US8261136B2 (en) * | 2009-06-29 | 2012-09-04 | Sandisk Technologies Inc. | Method and device for selectively refreshing a region of a memory of a data storage device |
US8612809B2 (en) | 2009-12-31 | 2013-12-17 | Intel Corporation | Systems, methods, and apparatuses for stacked memory |
US8412882B2 (en) * | 2010-06-18 | 2013-04-02 | Microsoft Corporation | Leveraging chip variability |
US9658678B2 (en) | 2011-03-31 | 2017-05-23 | Intel Corporation | Induced thermal gradients |
US9490003B2 (en) | 2011-03-31 | 2016-11-08 | Intel Corporation | Induced thermal gradients |
JP5960269B2 (ja) | 2011-09-30 | 2016-08-02 | インテル コーポレイション | メモリ装置、制御方法、メモリコントローラ及びメモリシステム |
DE112011105909B4 (de) * | 2011-12-02 | 2019-05-16 | Intel Corporation | Speichergerät mit Speicherchiplagenschichten, Speicherchiplagenelement mit Kopplungsstrukturen und System umfassend Speicherstapel, Prozessor und Systemelement |
CN103946980B (zh) * | 2011-12-02 | 2017-06-20 | 英特尔公司 | 允许装置互连中的变化的堆栈式存储器 |
WO2013095674A1 (en) * | 2011-12-23 | 2013-06-27 | Intel Corporation | Memory operations using system thermal sensor data |
US8645777B2 (en) | 2011-12-29 | 2014-02-04 | Intel Corporation | Boundary scan chain for stacked memory |
US8874979B2 (en) | 2012-06-14 | 2014-10-28 | International Business Machines Corporation | Three dimensional(3D) memory device sparing |
US8869007B2 (en) | 2012-06-14 | 2014-10-21 | International Business Machines Corporation | Three dimensional (3D) memory device sparing |
US8843794B2 (en) | 2012-09-24 | 2014-09-23 | Intel Corporation | Method, system and apparatus for evaluation of input/output buffer circuitry |
US8737108B2 (en) * | 2012-09-25 | 2014-05-27 | Intel Corporation | 3D memory configurable for performance and power |
US9203671B2 (en) * | 2012-10-10 | 2015-12-01 | Altera Corporation | 3D memory based address generator for computationally efficient architectures |
US9183917B1 (en) | 2012-12-21 | 2015-11-10 | Samsung Electronics Co., Ltd. | Memory device, operating method thereof, and system having the memory device |
WO2014120228A1 (en) * | 2013-01-31 | 2014-08-07 | Hewlett-Packard Development Company | Ram refresh rate |
US10042750B2 (en) | 2013-03-15 | 2018-08-07 | Micron Technology, Inc. | Apparatuses and methods for adaptive control of memory using an adaptive memory controller with a memory management hypervisor |
US9342443B2 (en) * | 2013-03-15 | 2016-05-17 | Micron Technology, Inc. | Systems and methods for memory system management based on thermal information of a memory system |
US20140370664A1 (en) * | 2013-06-13 | 2014-12-18 | Kiran Pangal | Word line and bit line processing for cross-point memories |
US9152488B2 (en) * | 2013-06-25 | 2015-10-06 | Sandisk Technologies Inc. | Storage module and low-complexity methods for assessing the health of a flash memory device |
CN105684089A (zh) * | 2013-08-28 | 2016-06-15 | 慧与发展有限责任合伙企业 | 刷新速率调整 |
US9704557B2 (en) * | 2013-09-25 | 2017-07-11 | Qualcomm Incorporated | Method and apparatus for storing retention time profile information based on retention time and temperature |
US9972376B2 (en) * | 2013-11-07 | 2018-05-15 | International Business Machines Corporation | Memory device for interruptible memory refresh |
US10096353B2 (en) | 2013-11-07 | 2018-10-09 | International Business Machines Corporation | System and memory controller for interruptible memory refresh |
US9911485B2 (en) * | 2013-11-11 | 2018-03-06 | Qualcomm Incorporated | Method and apparatus for refreshing a memory cell |
KR102094309B1 (ko) | 2013-12-30 | 2020-03-27 | 에스케이하이닉스 주식회사 | 리프레쉬 신호를 생성하는 적층 반도체 장치 |
EP3140743B1 (en) * | 2014-05-08 | 2021-11-24 | Micron Technology, INC. | Hybrid memory cube system interconnect directory-based cache coherence methodology |
DE102014208609A1 (de) * | 2014-05-08 | 2015-11-26 | Robert Bosch Gmbh | Refresh eines Speicherbereichs einer nichtflüchtigen Speichereinheit |
US9558143B2 (en) * | 2014-05-09 | 2017-01-31 | Micron Technology, Inc. | Interconnect systems and methods using hybrid memory cube links to send packetized data over different endpoints of a data handling device |
US9361195B2 (en) | 2014-11-12 | 2016-06-07 | International Business Machines Corporation | Mirroring in three-dimensional stacked memory |
KR102272132B1 (ko) | 2014-12-26 | 2021-07-01 | 삼성전자주식회사 | 반도체 장치 및 그 구동 방법 |
US10303235B2 (en) | 2015-03-04 | 2019-05-28 | Qualcomm Incorporated | Systems and methods for implementing power collapse in a memory |
KR102373543B1 (ko) | 2015-04-08 | 2022-03-11 | 삼성전자주식회사 | 멀티칩 패키지에서 온도 편차를 이용하여 동작 제어하는 방법 및 장치 |
US9570142B2 (en) | 2015-05-18 | 2017-02-14 | Micron Technology, Inc. | Apparatus having dice to perorm refresh operations |
KR20170024307A (ko) | 2015-08-25 | 2017-03-07 | 삼성전자주식회사 | 내장형 리프레쉬 콘트롤러 및 이를 포함하는 메모리 장치 |
US9575671B1 (en) | 2015-08-11 | 2017-02-21 | International Business Machines Corporation | Read distribution in a three-dimensional stacked memory based on thermal profiles |
US9734887B1 (en) * | 2016-03-21 | 2017-08-15 | International Business Machines Corporation | Per-die based memory refresh control based on a master controller |
CN106297890A (zh) * | 2016-07-21 | 2017-01-04 | 浪潮电子信息产业股份有限公司 | 一种内存目标刷新参数的确定方法及装置 |
US10580735B2 (en) | 2016-10-07 | 2020-03-03 | Xcelsis Corporation | Stacked IC structure with system level wiring on multiple sides of the IC die |
US10672663B2 (en) | 2016-10-07 | 2020-06-02 | Xcelsis Corporation | 3D chip sharing power circuit |
US10586786B2 (en) | 2016-10-07 | 2020-03-10 | Xcelsis Corporation | 3D chip sharing clock interconnect layer |
US10600691B2 (en) | 2016-10-07 | 2020-03-24 | Xcelsis Corporation | 3D chip sharing power interconnect layer |
US10672744B2 (en) * | 2016-10-07 | 2020-06-02 | Xcelsis Corporation | 3D compute circuit with high density Z-axis interconnects |
US10600780B2 (en) | 2016-10-07 | 2020-03-24 | Xcelsis Corporation | 3D chip sharing data bus circuit |
US10672745B2 (en) | 2016-10-07 | 2020-06-02 | Xcelsis Corporation | 3D processor |
US10600735B2 (en) | 2016-10-07 | 2020-03-24 | Xcelsis Corporation | 3D chip sharing data bus |
US10593667B2 (en) | 2016-10-07 | 2020-03-17 | Xcelsis Corporation | 3D chip with shielded clock lines |
US10762420B2 (en) | 2017-08-03 | 2020-09-01 | Xcelsis Corporation | Self repairing neural network |
US10672743B2 (en) | 2016-10-07 | 2020-06-02 | Xcelsis Corporation | 3D Compute circuit with high density z-axis interconnects |
US10580757B2 (en) | 2016-10-07 | 2020-03-03 | Xcelsis Corporation | Face-to-face mounted IC dies with orthogonal top interconnect layers |
KR102512017B1 (ko) | 2016-10-07 | 2023-03-17 | 엑셀시스 코포레이션 | 직접-접합된 네이티브 상호접속부 및 능동 베이스 다이 |
KR20180060091A (ko) | 2016-11-28 | 2018-06-07 | 삼성전자주식회사 | 메모리 장치의 구동 방법 및 메모리 시스템의 구동 방법 |
US10346232B2 (en) | 2017-08-16 | 2019-07-09 | Western Digital Technologies, Inc. | Non-volatile storage with failure prediction |
KR102568896B1 (ko) | 2018-04-19 | 2023-08-21 | 에스케이하이닉스 주식회사 | 메모리 컨트롤러 및 이를 포함하는 메모리 시스템 |
US20210241822A1 (en) * | 2018-06-26 | 2021-08-05 | Rambus Inc. | Memory device having non-uniform refresh |
US11100972B2 (en) * | 2019-02-12 | 2021-08-24 | Micron Technology, Inc. | Refresh rate control for a memory device |
US20200258566A1 (en) * | 2019-02-12 | 2020-08-13 | Micron Technology, Inc. | Refresh rate management for memory |
KR20210011176A (ko) | 2019-07-22 | 2021-02-01 | 에스케이하이닉스 주식회사 | 메모리 시스템의 액세스 동작 방법 및 장치 |
KR102273153B1 (ko) * | 2019-04-24 | 2021-07-05 | 경희대학교 산학협력단 | 우선순위 기반의 ecc에 기초하여 데이터를 근사적 메모리 장치에 저장하는 메모리 컨트롤러, 프로그램 코드를 저장하는 비일시적 컴퓨터 판독 가능한 매체, 그리고 근사적 메모리 장치와 메모리 컨트롤러를 포함하는 전자 장치 |
CN110537259A (zh) * | 2019-06-28 | 2019-12-03 | 长江存储科技有限责任公司 | 三维存储器件中的存储器内计算 |
CN110476209B (zh) | 2019-06-28 | 2020-11-17 | 长江存储科技有限责任公司 | 三维存储器件中的存储器内计算 |
US11144228B2 (en) * | 2019-07-11 | 2021-10-12 | Micron Technology, Inc. | Circuit partitioning for a memory device |
US11599299B2 (en) | 2019-11-19 | 2023-03-07 | Invensas Llc | 3D memory circuit |
CN111145807B (zh) * | 2019-12-10 | 2021-12-31 | 深圳市国微电子有限公司 | 一种3d堆叠存储器的温控自刷新方法及温控自刷新电路 |
WO2021179213A1 (zh) * | 2020-03-11 | 2021-09-16 | 华为技术有限公司 | 修复存储芯片的方法和装置 |
DE102021103853A1 (de) * | 2020-05-28 | 2021-12-02 | Taiwan Semiconductor Manufacturing Co., Ltd. | Speicherarray-testverfahren und -system |
US11450399B2 (en) | 2020-05-28 | 2022-09-20 | Taiwan Semiconductor Manufacturing Company, Ltd. | Memory array test method and system |
KR20220091162A (ko) | 2020-12-23 | 2022-06-30 | 삼성전자주식회사 | 온도에 대한 리프레쉬 레이트 승수와 상관없는 메모리 장치의 리프레쉬 방법 |
Family Cites Families (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0460988A (ja) * | 1990-06-27 | 1992-02-26 | Canon Inc | リフレツシユ制御装置 |
US5784328A (en) * | 1996-12-23 | 1998-07-21 | Lsi Logic Corporation | Memory system including an on-chip temperature sensor for regulating the refresh rate of a DRAM array |
US5915167A (en) * | 1997-04-04 | 1999-06-22 | Elm Technology Corporation | Three dimensional structure memory |
JP3444154B2 (ja) * | 1997-09-17 | 2003-09-08 | 日本電気株式会社 | メモリアクセス制御回路 |
JP3177207B2 (ja) * | 1998-01-27 | 2001-06-18 | インターナショナル・ビジネス・マシーンズ・コーポレ−ション | リフレッシュ間隔制御装置及び方法、並びにコンピュータ |
JP3974287B2 (ja) * | 1999-04-16 | 2007-09-12 | 富士通株式会社 | アドレス信号供給方法及びそれを利用した半導体記憶装置 |
US6385113B1 (en) * | 1999-04-30 | 2002-05-07 | Madrone Solutions, Inc | Method for operating an integrated circuit having a sleep mode |
US6567950B1 (en) * | 1999-04-30 | 2003-05-20 | International Business Machines Corporation | Dynamically replacing a failed chip |
US6560725B1 (en) * | 1999-06-18 | 2003-05-06 | Madrone Solutions, Inc. | Method for apparatus for tracking errors in a memory system |
US7107383B1 (en) * | 2000-05-03 | 2006-09-12 | Broadcom Corporation | Method and system for multi-channel transfer of data and control information |
JP4707803B2 (ja) * | 2000-07-10 | 2011-06-22 | エルピーダメモリ株式会社 | エラーレート判定方法と半導体集積回路装置 |
EP1197847A3 (en) * | 2000-10-10 | 2003-05-21 | Nazomi Communications Inc. | Java hardware accelerator using microcode engine |
JP3640165B2 (ja) * | 2000-10-20 | 2005-04-20 | セイコーエプソン株式会社 | 半導体装置、メモリシステムおよび電子機器 |
US6658078B2 (en) * | 2001-07-23 | 2003-12-02 | Tokyo Electric Power Co. | MOX nuclear fuel assembly employable for a thermal neutron nuclear reactor |
US6646942B2 (en) * | 2001-10-09 | 2003-11-11 | Micron Technology, Inc. | Method and circuit for adjusting a self-refresh rate to maintain dynamic data at low supply voltages |
US6750497B2 (en) | 2002-08-22 | 2004-06-15 | Micron Technology, Inc. | High-speed transparent refresh DRAM-based memory cell |
US6781908B1 (en) * | 2003-02-19 | 2004-08-24 | Freescale Semiconductor, Inc. | Memory having variable refresh control and method therefor |
US7085152B2 (en) * | 2003-12-29 | 2006-08-01 | Intel Corporation | Memory system segmented power supply and control |
JP4478974B2 (ja) * | 2004-01-30 | 2010-06-09 | エルピーダメモリ株式会社 | 半導体記憶装置及びそのリフレッシュ制御方法 |
KR20050120344A (ko) * | 2004-06-18 | 2005-12-22 | 엘지전자 주식회사 | 데이터 백업에 의한 에스디램의 셀프 리프레쉬 소모전류절감 방법 |
US7305518B2 (en) * | 2004-10-20 | 2007-12-04 | Hewlett-Packard Development Company, L.P. | Method and system for dynamically adjusting DRAM refresh rate |
US8041881B2 (en) * | 2006-07-31 | 2011-10-18 | Google Inc. | Memory device with emulated characteristics |
US20080028136A1 (en) * | 2006-07-31 | 2008-01-31 | Schakel Keith R | Method and apparatus for refresh management of memory modules |
US7379316B2 (en) * | 2005-09-02 | 2008-05-27 | Metaram, Inc. | Methods and apparatus of stacking DRAMs |
KR100725992B1 (ko) * | 2005-11-04 | 2007-06-08 | 삼성전자주식회사 | 리프레시 정보에 따라 반도체 메모리 장치의 리프레시를제어하는 장치 및 그 방법 |
US7408813B2 (en) * | 2006-08-03 | 2008-08-05 | Micron Technology, Inc. | Block erase for volatile memory |
US7631228B2 (en) * | 2006-09-12 | 2009-12-08 | International Business Machines Corporation | Using bit errors from memory to alter memory command stream |
US8015433B2 (en) | 2006-09-13 | 2011-09-06 | Hitachi Global Storage Technologies Netherlands B.V. | Disk drive with nonvolatile memory for storage of failure-related data |
EP3540736B1 (en) * | 2006-12-14 | 2023-07-26 | Rambus Inc. | Multi-die memory device |
US7975170B2 (en) * | 2007-06-15 | 2011-07-05 | Qimonda Ag | Memory refresh system and method |
US7545698B2 (en) * | 2007-06-28 | 2009-06-09 | Intel Corporation | Memory test mode for charge retention testing |
US7929368B2 (en) | 2008-12-30 | 2011-04-19 | Micron Technology, Inc. | Variable memory refresh devices and methods |
US8127185B2 (en) * | 2009-01-23 | 2012-02-28 | Micron Technology, Inc. | Memory devices and methods for managing error regions |
US9105323B2 (en) * | 2009-01-23 | 2015-08-11 | Micron Technology, Inc. | Memory device power managers and methods |
US8018752B2 (en) * | 2009-03-23 | 2011-09-13 | Micron Technology, Inc. | Configurable bandwidth memory devices and methods |
US8327225B2 (en) * | 2010-01-04 | 2012-12-04 | Micron Technology, Inc. | Error correction in a stacked memory |
-
2008
- 2008-12-30 US US12/346,542 patent/US7929368B2/en active Active
-
2009
- 2009-12-25 TW TW098145171A patent/TWI435326B/zh active
- 2009-12-30 KR KR1020117017680A patent/KR101528659B1/ko active IP Right Grant
- 2009-12-30 CN CN200980153463.9A patent/CN102272849B/zh active Active
- 2009-12-30 KR KR1020157009154A patent/KR101633241B1/ko active IP Right Grant
- 2009-12-30 JP JP2011543731A patent/JP6050587B2/ja active Active
- 2009-12-30 WO PCT/US2009/069858 patent/WO2010078454A1/en active Application Filing
- 2009-12-30 EP EP09837176.8A patent/EP2377127B1/en active Active
-
2011
- 2011-04-18 US US13/088,821 patent/US8199599B2/en active Active
-
2012
- 2012-06-11 US US13/493,651 patent/US8797818B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
KR101528659B1 (ko) | 2015-06-12 |
US20120250388A1 (en) | 2012-10-04 |
US8797818B2 (en) | 2014-08-05 |
JP2012514286A (ja) | 2012-06-21 |
US20100165692A1 (en) | 2010-07-01 |
KR20110103447A (ko) | 2011-09-20 |
EP2377127B1 (en) | 2014-06-11 |
TWI435326B (zh) | 2014-04-21 |
US7929368B2 (en) | 2011-04-19 |
EP2377127A1 (en) | 2011-10-19 |
EP2377127A4 (en) | 2012-10-31 |
KR20150046363A (ko) | 2015-04-29 |
US20110194369A1 (en) | 2011-08-11 |
TW201034013A (en) | 2010-09-16 |
KR101633241B1 (ko) | 2016-06-23 |
CN102272849B (zh) | 2016-01-20 |
CN102272849A (zh) | 2011-12-07 |
WO2010078454A1 (en) | 2010-07-08 |
US8199599B2 (en) | 2012-06-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6050587B2 (ja) | 可変式メモリリフレッシュ装置および方法 | |
US11145384B2 (en) | Memory devices and methods for managing error regions | |
JP5762312B2 (ja) | メモリ装置電源管理装置及び方法 | |
JP6127038B2 (ja) | メモリシステムおよび方法 | |
JP5784582B2 (ja) | コンフィギュラブルな帯域幅メモリ・デバイスおよび方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20121225 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20121225 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20130726 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130806 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20140527 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20140815 Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20140815 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20150317 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20150717 Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20150717 |
|
A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20150724 |
|
A912 | Re-examination (zenchi) completed and case transferred to appeal board |
Free format text: JAPANESE INTERMEDIATE CODE: A912 Effective date: 20150911 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20160127 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20160129 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20160810 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20161125 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6050587 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |