JP6046933B2 - 研磨方法 - Google Patents

研磨方法 Download PDF

Info

Publication number
JP6046933B2
JP6046933B2 JP2012154975A JP2012154975A JP6046933B2 JP 6046933 B2 JP6046933 B2 JP 6046933B2 JP 2012154975 A JP2012154975 A JP 2012154975A JP 2012154975 A JP2012154975 A JP 2012154975A JP 6046933 B2 JP6046933 B2 JP 6046933B2
Authority
JP
Japan
Prior art keywords
polishing
film thickness
wafer
film
polished
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2012154975A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014017418A5 (enExample
JP2014017418A (ja
Inventor
健 飯泉
健 飯泉
和英 渡辺
和英 渡辺
小林　洋一
洋一 小林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP2012154975A priority Critical patent/JP6046933B2/ja
Priority to TW102123143A priority patent/TWI567813B/zh
Priority to KR1020130078854A priority patent/KR101767291B1/ko
Priority to US13/938,018 priority patent/US8951813B2/en
Publication of JP2014017418A publication Critical patent/JP2014017418A/ja
Priority to US14/589,988 priority patent/US20150111314A1/en
Publication of JP2014017418A5 publication Critical patent/JP2014017418A5/ja
Application granted granted Critical
Publication of JP6046933B2 publication Critical patent/JP6046933B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H10P52/00—
    • H10P52/403—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • G01B11/0625—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of absorption or reflection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • G01B11/0683—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating measurement during deposition or removal of the layer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/02—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness
    • G01B7/06—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness
    • G01B7/10—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness using magnetic means, e.g. by measuring change of reluctance
    • G01B7/105—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness using magnetic means, e.g. by measuring change of reluctance for measuring thickness of coating
    • H10P52/402—
    • H10P72/0422—
    • H10P72/0428—
    • H10P72/0604—
    • H10P74/203—
    • H10P74/23—
    • H10P95/062—
    • H10P95/064—
    • H10W10/014—
    • H10W10/17—
    • H10W20/062—
    • H10W20/092—

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
JP2012154975A 2012-07-10 2012-07-10 研磨方法 Active JP6046933B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2012154975A JP6046933B2 (ja) 2012-07-10 2012-07-10 研磨方法
TW102123143A TWI567813B (zh) 2012-07-10 2013-06-28 Grinding method
KR1020130078854A KR101767291B1 (ko) 2012-07-10 2013-07-05 연마 방법
US13/938,018 US8951813B2 (en) 2012-07-10 2013-07-09 Method of polishing a substrate having a film on a surface of the substrate for semiconductor manufacturing
US14/589,988 US20150111314A1 (en) 2012-07-10 2015-01-05 A method of polishing a substrate having a film on a surface of the substrate for semiconductor manufacturing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012154975A JP6046933B2 (ja) 2012-07-10 2012-07-10 研磨方法

Publications (3)

Publication Number Publication Date
JP2014017418A JP2014017418A (ja) 2014-01-30
JP2014017418A5 JP2014017418A5 (enExample) 2015-08-20
JP6046933B2 true JP6046933B2 (ja) 2016-12-21

Family

ID=49914311

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012154975A Active JP6046933B2 (ja) 2012-07-10 2012-07-10 研磨方法

Country Status (4)

Country Link
US (2) US8951813B2 (enExample)
JP (1) JP6046933B2 (enExample)
KR (1) KR101767291B1 (enExample)
TW (1) TWI567813B (enExample)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI635929B (zh) * 2013-07-11 2018-09-21 日商荏原製作所股份有限公司 研磨裝置及研磨狀態監視方法
US9997420B2 (en) * 2013-12-27 2018-06-12 Taiwan Semiconductor Manufacturing Company Limited Method and/or system for chemical mechanical planarization (CMP)
JP6293519B2 (ja) * 2014-03-05 2018-03-14 株式会社荏原製作所 研磨装置および研磨方法
JP6266493B2 (ja) 2014-03-20 2018-01-24 株式会社荏原製作所 研磨装置及び研磨方法
JP6370084B2 (ja) * 2014-04-10 2018-08-08 株式会社荏原製作所 基板処理装置
KR102431971B1 (ko) 2014-04-18 2022-08-16 가부시키가이샤 에바라 세이사꾸쇼 기판 처리 장치 및 기판 처리 방법
KR102388170B1 (ko) * 2014-09-02 2022-04-19 가부시키가이샤 에바라 세이사꾸쇼 종점 검출 방법, 연마 장치 및 연마 방법
JP6321579B2 (ja) * 2015-06-01 2018-05-09 株式会社日立国際電気 半導体装置の製造方法、基板処理システム、基板処理装置及びプログラム
JP6566897B2 (ja) * 2016-03-17 2019-08-28 東京エレクトロン株式会社 制御装置、基板処理システム、基板処理方法及びプログラム
US11626315B2 (en) * 2016-11-29 2023-04-11 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor structure and planarization method thereof
JP7023063B2 (ja) * 2017-08-08 2022-02-21 株式会社荏原製作所 基板研磨装置及び方法
JP6902452B2 (ja) * 2017-10-19 2021-07-14 株式会社荏原製作所 研磨装置
JP7081919B2 (ja) * 2017-12-26 2022-06-07 株式会社ディスコ 加工装置
JP7316785B2 (ja) 2018-12-26 2023-07-28 株式会社荏原製作所 光学式膜厚測定システムの洗浄方法
US11623320B2 (en) * 2019-08-21 2023-04-11 Applied Materials, Inc. Polishing head with membrane position control
JP7517832B2 (ja) * 2020-01-17 2024-07-17 株式会社荏原製作所 研磨ヘッドシステムおよび研磨装置
JP7361637B2 (ja) * 2020-03-09 2023-10-16 株式会社荏原製作所 研磨方法、研磨装置、およびプログラムを記録したコンピュータ読み取り可能な記録媒体
JP7503418B2 (ja) * 2020-05-14 2024-06-20 株式会社荏原製作所 膜厚測定装置、研磨装置及び膜厚測定方法
JP7466434B2 (ja) * 2020-11-19 2024-04-12 株式会社荏原製作所 基板処理装置および基板処理方法
US12343840B2 (en) 2021-03-05 2025-07-01 Applied Materials, Inc. Control of processing parameters for substrate polishing with substrate precession
CN114000192B (zh) * 2021-10-29 2023-10-13 北京北方华创微电子装备有限公司 半导体工艺设备以及晶圆位置状态的监测方法
JP7680347B2 (ja) * 2021-12-24 2025-05-20 株式会社荏原製作所 膜厚測定方法および膜厚測定装置
JP2024155058A (ja) * 2023-04-20 2024-10-31 株式会社荏原製作所 膜厚測定装置、膜厚測定方法及び基板研磨装置
CN119897756B (zh) * 2025-04-02 2025-07-11 天通控股股份有限公司 一种提高钽酸锂键合片膜厚均匀性的方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3218881B2 (ja) * 1994-03-22 2001-10-15 三菱マテリアル株式会社 ウェーハ膜厚測定装置、ウェーハ膜厚測定方法およびウェーハ研磨装置
US5492594A (en) 1994-09-26 1996-02-20 International Business Machines Corp. Chemical-mechanical polishing tool with end point measurement station
JPH08240413A (ja) * 1995-01-06 1996-09-17 Toshiba Corp 膜厚測定装置及びポリシング装置
IL113829A (en) 1995-05-23 2000-12-06 Nova Measuring Instr Ltd Apparatus for optical inspection of wafers during polishing
JP3863624B2 (ja) * 1997-03-24 2006-12-27 不二越機械工業株式会社 ウェーハの研磨装置及びウェーハの研磨方法
US6626736B2 (en) * 2000-06-30 2003-09-30 Ebara Corporation Polishing apparatus
US6447370B1 (en) 2001-04-17 2002-09-10 Speedfam-Ipec Corporation Inline metrology device
US6939198B1 (en) 2001-12-28 2005-09-06 Applied Materials, Inc. Polishing system with in-line and in-situ metrology
JP2004012302A (ja) 2002-06-07 2004-01-15 Hitachi Ltd 膜厚分布計測方法及びその装置
JP2005203729A (ja) 2003-12-19 2005-07-28 Ebara Corp 基板研磨装置
US7118451B2 (en) 2004-02-27 2006-10-10 Taiwan Semiconductor Manufacturing Co., Ltd. CMP apparatus and process sequence method
JP2006231471A (ja) * 2005-02-25 2006-09-07 Speedfam Co Ltd 両面ポリッシュ加工機とその定寸制御方法
JP2010186866A (ja) * 2009-02-12 2010-08-26 Ebara Corp 研磨方法
JP2010087243A (ja) * 2008-09-30 2010-04-15 Panasonic Corp 半導体装置の製造方法
US20110300776A1 (en) 2010-06-03 2011-12-08 Applied Materials, Inc. Tuning of polishing process in multi-carrier head per platen polishing station
JP2012009692A (ja) * 2010-06-25 2012-01-12 Toshiba Corp ドレス方法、研磨方法および研磨装置
US20140141694A1 (en) 2012-11-21 2014-05-22 Applied Materials, Inc. In-Sequence Spectrographic Sensor

Also Published As

Publication number Publication date
US20140017824A1 (en) 2014-01-16
KR20140007753A (ko) 2014-01-20
US20150111314A1 (en) 2015-04-23
TWI567813B (zh) 2017-01-21
JP2014017418A (ja) 2014-01-30
US8951813B2 (en) 2015-02-10
TW201403700A (zh) 2014-01-16
KR101767291B1 (ko) 2017-08-10

Similar Documents

Publication Publication Date Title
JP6046933B2 (ja) 研磨方法
JP6145342B2 (ja) 膜厚測定装置、膜厚測定方法、および膜厚測定装置を備えた研磨装置
JP5941763B2 (ja) 研磨方法
US7840375B2 (en) Methods and apparatus for generating a library of spectra
TWI731162B (zh) 研磨裝置及研磨方法
US9132523B2 (en) Chemical mechanical polish process control for improvement in within-wafer thickness uniformity
TWI675721B (zh) 研磨裝置及研磨狀態監視方法
US6929531B2 (en) System and method for metal residue detection and mapping within a multi-step sequence
JP2013222856A (ja) 研磨装置および研磨方法
JP6374169B2 (ja) 研磨方法および研磨装置
JP6215602B2 (ja) 研磨装置および研磨状態監視方法
US11534886B2 (en) Polishing device, polishing head, polishing method, and method of manufacturing semiconductor device
JP2010186866A (ja) 研磨方法
JP6195754B2 (ja) 研磨装置および研磨状態監視方法
TW201324600A (zh) 化學機械研磨製程及化學機械研磨系統
US20040214508A1 (en) Apparatus and method for controlling film thickness in a chemical mechanical planarization system
JP2007301684A (ja) 研磨装置、これを用いた半導体デバイス製造方法およびこの方法により製造される半導体デバイス

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20150706

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20150706

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20160628

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20160629

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20160728

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20161101

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20161118

R150 Certificate of patent or registration of utility model

Ref document number: 6046933

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250