JP6034522B1 - 半導体ウェハ加工用粘着テープおよび半導体ウェハの加工方法 - Google Patents

半導体ウェハ加工用粘着テープおよび半導体ウェハの加工方法 Download PDF

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Publication number
JP6034522B1
JP6034522B1 JP2016054269A JP2016054269A JP6034522B1 JP 6034522 B1 JP6034522 B1 JP 6034522B1 JP 2016054269 A JP2016054269 A JP 2016054269A JP 2016054269 A JP2016054269 A JP 2016054269A JP 6034522 B1 JP6034522 B1 JP 6034522B1
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JP
Japan
Prior art keywords
semiconductor wafer
pressure
sensitive adhesive
group
adhesive tape
Prior art date
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Active
Application number
JP2016054269A
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English (en)
Japanese (ja)
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JP2017168739A (ja
Inventor
雅人 大倉
雅人 大倉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
THE FURUKAW ELECTRIC CO., LTD.
Original Assignee
THE FURUKAW ELECTRIC CO., LTD.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by THE FURUKAW ELECTRIC CO., LTD. filed Critical THE FURUKAW ELECTRIC CO., LTD.
Priority to JP2016054269A priority Critical patent/JP6034522B1/ja
Application granted granted Critical
Publication of JP6034522B1 publication Critical patent/JP6034522B1/ja
Priority to KR1020177031167A priority patent/KR102089928B1/ko
Priority to CN201780001306.0A priority patent/CN107960131B/zh
Priority to PCT/JP2017/007709 priority patent/WO2017159343A1/fr
Priority to TW106107209A priority patent/TWI744290B/zh
Publication of JP2017168739A publication Critical patent/JP2017168739A/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C09J201/02—Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2016054269A 2016-03-17 2016-03-17 半導体ウェハ加工用粘着テープおよび半導体ウェハの加工方法 Active JP6034522B1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2016054269A JP6034522B1 (ja) 2016-03-17 2016-03-17 半導体ウェハ加工用粘着テープおよび半導体ウェハの加工方法
KR1020177031167A KR102089928B1 (ko) 2016-03-17 2017-02-28 반도체 웨이퍼 가공용 점착 테이프 및 반도체 웨이퍼의 가공 방법
CN201780001306.0A CN107960131B (zh) 2016-03-17 2017-02-28 半导体晶片加工用胶带和半导体晶片的加工方法
PCT/JP2017/007709 WO2017159343A1 (fr) 2016-03-17 2017-02-28 Ruban adhésif pour traitement de plaquette de semi-conducteur et procédé de traitement de plaquette de semi-conducteur
TW106107209A TWI744290B (zh) 2016-03-17 2017-03-06 半導體晶圓加工用黏著帶及半導體晶圓之加工方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016054269A JP6034522B1 (ja) 2016-03-17 2016-03-17 半導体ウェハ加工用粘着テープおよび半導体ウェハの加工方法

Publications (2)

Publication Number Publication Date
JP6034522B1 true JP6034522B1 (ja) 2016-11-30
JP2017168739A JP2017168739A (ja) 2017-09-21

Family

ID=57419839

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016054269A Active JP6034522B1 (ja) 2016-03-17 2016-03-17 半導体ウェハ加工用粘着テープおよび半導体ウェハの加工方法

Country Status (5)

Country Link
JP (1) JP6034522B1 (fr)
KR (1) KR102089928B1 (fr)
CN (1) CN107960131B (fr)
TW (1) TWI744290B (fr)
WO (1) WO2017159343A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017171896A (ja) * 2016-03-17 2017-09-28 古河電気工業株式会社 半導体ウェハ加工用粘着テープ、半導体ウェハ加工用粘着テープの製造方法および半導体ウェハの加工方法
CN109075055A (zh) * 2017-03-31 2018-12-21 古河电气工业株式会社 半导体晶片表面保护用胶带和半导体晶片的加工方法
US11862504B2 (en) 2017-02-24 2024-01-02 Furukawa Electric Co., Ltd. Mask-integrated surface protective tape, and method of producing a semiconductor chip using the same

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7284856B2 (ja) * 2018-03-14 2023-05-31 マクセル株式会社 バックグラインド用粘着テープ
CN112930584A (zh) * 2018-11-12 2021-06-08 昭和电工材料株式会社 半导体装置的制造方法及半导体晶圆加工用胶黏膜
CN110763255A (zh) * 2019-11-26 2020-02-07 衡阳开拓光电科技有限公司 一种光纤绕环固化工艺
CN116406410A (zh) * 2020-11-09 2023-07-07 电化株式会社 粘合带及加工方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01249878A (ja) * 1988-03-31 1989-10-05 Furukawa Electric Co Ltd:The 半導体ウエハ固定用放射線硬化性粘着テープ
JP2011181899A (ja) * 2010-02-02 2011-09-15 Lintec Corp ダイシングシート
JP2015073056A (ja) * 2013-10-04 2015-04-16 リンテック株式会社 半導体加工用シート

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* Cited by examiner, † Cited by third party
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JP3620810B2 (ja) 1996-05-02 2005-02-16 リンテック株式会社 ウエハ保護用粘着シート
JP4369584B2 (ja) 2000-01-21 2009-11-25 日東電工株式会社 半導体ウエハ保持保護用粘着シート
JP5057697B2 (ja) * 2006-05-12 2012-10-24 日東電工株式会社 半導体ウエハ又は半導体基板加工用粘着シート
JP4861081B2 (ja) 2006-07-14 2012-01-25 電気化学工業株式会社 半導体部材固定用粘着シート及びそれを用いた電子部品製造方法。
JP5286084B2 (ja) * 2006-07-19 2013-09-11 積水化学工業株式会社 ダイシング・ダイボンディングテープ及び半導体チップの製造方法
JP5069662B2 (ja) * 2007-11-12 2012-11-07 リンテック株式会社 粘着シート
KR101140790B1 (ko) * 2010-03-30 2012-05-03 티티티케미칼 주식회사 웨이퍼 다이싱용 아크릴계 점착 조성물 및 이를 포함하는 다이싱 테이프
KR101198254B1 (ko) 2010-05-31 2012-11-07 주식회사 케이씨씨 반도체 제조용 점·접착쉬트
KR20110131772A (ko) * 2010-05-31 2011-12-07 주식회사 케이씨씨 자외선 경화성 점착수지 조성물 및 이를 포함하는 다이싱용 또는 표면보호용 점착 테이프
JP5687897B2 (ja) * 2010-12-28 2015-03-25 日東電工株式会社 放射線硬化型粘着剤組成物及び粘着シート
CN102504623B (zh) * 2011-09-28 2014-01-08 中钞特种防伪科技有限公司 一种剥离层组合物及其制备方法和应用
JP2013122005A (ja) * 2011-12-09 2013-06-20 Samsung Yokohama Research Institute Co Ltd 半導体用感光性接着フィルムおよび当該フィルムを用いた半導体装置の製造方法
JP6092161B2 (ja) * 2014-07-03 2017-03-08 リンテック株式会社 表面保護フィルム

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01249878A (ja) * 1988-03-31 1989-10-05 Furukawa Electric Co Ltd:The 半導体ウエハ固定用放射線硬化性粘着テープ
JP2011181899A (ja) * 2010-02-02 2011-09-15 Lintec Corp ダイシングシート
JP2015073056A (ja) * 2013-10-04 2015-04-16 リンテック株式会社 半導体加工用シート

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017171896A (ja) * 2016-03-17 2017-09-28 古河電気工業株式会社 半導体ウェハ加工用粘着テープ、半導体ウェハ加工用粘着テープの製造方法および半導体ウェハの加工方法
US11862504B2 (en) 2017-02-24 2024-01-02 Furukawa Electric Co., Ltd. Mask-integrated surface protective tape, and method of producing a semiconductor chip using the same
CN109075055A (zh) * 2017-03-31 2018-12-21 古河电气工业株式会社 半导体晶片表面保护用胶带和半导体晶片的加工方法
JPWO2018181240A1 (ja) * 2017-03-31 2020-02-06 古河電気工業株式会社 半導体ウェハ表面保護用粘着テープ及び半導体ウェハの加工方法
JP7079200B2 (ja) 2017-03-31 2022-06-01 古河電気工業株式会社 半導体ウェハ表面保護用粘着テープ及び半導体ウェハの加工方法
CN109075055B (zh) * 2017-03-31 2023-08-15 古河电气工业株式会社 半导体晶片表面保护用胶带和半导体晶片的加工方法

Also Published As

Publication number Publication date
KR20180020956A (ko) 2018-02-28
WO2017159343A1 (fr) 2017-09-21
JP2017168739A (ja) 2017-09-21
TWI744290B (zh) 2021-11-01
CN107960131B (zh) 2022-02-25
CN107960131A (zh) 2018-04-24
KR102089928B1 (ko) 2020-03-17
TW201802207A (zh) 2018-01-16

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